公开(公告)号：IL288977D0

公开(公告)日：2022-02-01

申请号：IL28897721

申请日：2021-12-13

Applicant: IBM ,  JINKA OBLESH ,  OLIVADESE SALVATORE BERNARDO ,  HART SEAN ,  BRONN NICHOLAS TORLEIV ,  CHOW JERRY ,  BRINK MARKUS ,  GUMANN PATRYK ,  BOGORIN DANIELA FLORENTINA

Inventor： JINKA OBLESH ,  OLIVADESE SALVATORE BERNARDO ,  HART SEAN ,  BRONN NICHOLAS TORLEIV ,  CHOW JERRY ,  BRINK MARKUS ,  GUMANN PATRYK ,  BOGORIN DANIELA FLORENTINA

IPC: F25D19/00 ,  H01L21/265 ,  H01L23/367 ,  H01L23/44

Abstract: A thermalization structure is formed using a cover configured with a set of pillars, the cover being a part of a cryogenic enclosure of a low temperature device (LTD). A chip including the LTD is configured with a set of cavities, a cavity in the set of cavities having a cavity profile. A pillar from the set of pillars and corresponding to the cavity has a pillar profile such that the pillar profile causes the pillar to couple with the cavity of the cavity profile within a gap tolerance to thermally couple the chip to the cover for heat dissipation in a cryogenic operation of the chip.