STACKED MICROELECTRONIC ASSEMBLY WITH MICROELECTRONIC ELEMENTS HAVING VIAS EXTENDING THROUGH BOND PADS
    2.
    发明申请
    STACKED MICROELECTRONIC ASSEMBLY WITH MICROELECTRONIC ELEMENTS HAVING VIAS EXTENDING THROUGH BOND PADS 审中-公开
    具有通过粘结垫延伸的VIAS的微电子元件的堆叠微电子组件

    公开(公告)号:WO2010104610A8

    公开(公告)日:2011-11-17

    申请号:PCT/US2010000777

    申请日:2010-03-12

    Abstract: A stacked microelectronic assembly is provided which includes first and second stacked microelectronic elements (101, 102). Each of the first and second microelectronic elements can include a conductive layer (610) extending along a face (608) of such microelectronic element. At least one of the first and second microelectronic elements can include a recess (618) extending from the rear surface towards the front surface, and a conductive via (605) extending from the recess through the bond pad (603) and electrically connected to the bond pad, with a conductive layer (610) connected to the via and extending along a rear face (608) of the microelectronic element (101, 102) towards an edge (620) of the microelectronic element. A plurality of leads (224) can extend from the conductive layers (610) of the first and second microelectronic elements and a plurality of terminals (616) of the assembly can be electrically connected with the leads.

    Abstract translation: 提供堆叠的微电子组件,其包括第一和第二堆叠的微电子元件(101,102)。 第一和第二微电子元件中的每一个可以包括沿着这种微电子元件的面(608)延伸的导电层(610)。 第一和第二微电子元件中的至少一个可以包括从后表面朝向前表面延伸的凹槽(618),以及从凹部穿过接合焊盘(603)延伸并电连接到 接合焊盘,其中导电层(610)连接到通孔并且沿着微电子元件(101,102)的后表面(608)朝着微电子元件的边缘(620)延伸。 多个引线(224)可以从第一和第二微电子元件的导电层(610)延伸,并且组件的多个端子(616)可以与引线电连接。

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