公开(公告)号：WO2013088263A2

公开(公告)日：2013-06-20

申请号：PCT/IB2012003096

申请日：2012-12-11

Applicant: CANADIAN INTELLECTUAL PROPERTY OFFICEATI TECHNOLOGIES ULC ,  TOPACIO RODEN R ,  MARTINEZ LIANE ,  LOW YIP SENG

Inventor： TOPACIO RODEN R ,  MARTINEZ LIANE ,  LOW YIP SENG

IPC: H05K1/14

CPC classification number: H01L23/36 ,  H01L23/3677 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/16 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2924/00

Abstract: According an embodiment, a package-on-package heatsink interposer for use between a top package and a bottom package of a package-on-package device, may include a top heatsink below the top package; an interposer substrate below the top heatsink; a bottom heatsink below the interposer substrate; a first interposer substrate metal layer between the interposer substrate and the top heatsink; a second interposer substrate metal layer between the interposer substrate and the bottom heatsink; and interposer solder balls between the second interposer substrate metal layer and the bottom package.

Abstract translation: 根据一个实施例，一种用于封装封装器件的顶部封装和底部封装之间的封装封装式散热器插入器可以包括位于顶部封装之下的顶部散热器; 在顶部散热器下方的插入器基板; 位于插入器底部下方的底部散热器; 在所述插入器基板和所述顶部散热器之间的第一内插基板金属层; 在所述插入器基板和所述底部散热器之间的第二插入件基板金属层; 以及在第二插入器基板金属层和底部封装之间的插入件焊球。