LAMINATION OF DRY-FILM PHOTORESIST FOR FORMING A CONFORMABLE SOLDER MASK ON A PRINTED CIRCUIT BOARD
    1.
    发明申请
    LAMINATION OF DRY-FILM PHOTORESIST FOR FORMING A CONFORMABLE SOLDER MASK ON A PRINTED CIRCUIT BOARD 审中-公开
    用于在印刷电路板上形成一个一致的焊接掩模的干膜胶片的层压

    公开(公告)号:WO1995031885A1

    公开(公告)日:1995-11-23

    申请号:PCT/IT1995000076

    申请日:1995-05-16

    Abstract: Photoimageable dry-film for forming a solder mask on the face of a printed circuit board are more easily laminated on the face of the board by effecting evacuation of the entrapped air and a mechanical pressing within a vacuum chamber while avoiding heating of the photoimageable resin layer up to a fluid state. Subsequently the sandwich is heated at atmospheric pressure until the photoimageable resin layer (4) is made fluid to conform it to the surface of the board under the effect of the atmospheric pressure. Retention of a cover sheet (3) of the photoimageable dry-film (4) up to the moment of heating the pre-evacuated and pressed assembly facilitates the performance of local treatments for preserving the integrity of the film over tenting zones about holes of the printed circuit board. The method is effective either with conformable thin dry-films as well as with thicker dry-films.

    Abstract translation: 用于在印刷电路板的表面上形成焊接掩模的光致成像干膜更容易通过在真空室内进行真空抽吸和机械压制而轻易层压在板的表面上,同时避免光致成像树脂层的加热 达到流体状态。 随后,将夹心物在大气压下加热直到光致成像树脂层(4)在大气压力下被制成流体以使其与板的表面一致。 在加热预抽真空和压制的组件之前保留可光成像干膜(4)的覆盖片(3)有助于进行局部处理以保持薄膜在整个遮盖区上的完整性, 印刷电路板。 该方法对于适应性薄的干膜以及较厚的干膜是有效的。

    MACHINE FOR STACKING AND BONDING SUB-BOARDS OF A MULTILAYER BOARD FOR A PRINTED CIRCUIT AND METHOD OF FABRICATION OF A MULTILAYER BOARD
    2.
    发明申请
    MACHINE FOR STACKING AND BONDING SUB-BOARDS OF A MULTILAYER BOARD FOR A PRINTED CIRCUIT AND METHOD OF FABRICATION OF A MULTILAYER BOARD 审中-公开
    用于印刷电路的多层板的堆叠和结合子机的机器以及制造多层板的方法

    公开(公告)号:WO02067644A9

    公开(公告)日:2004-05-13

    申请号:PCT/IT0100083

    申请日:2001-02-21

    Applicant: CANDORE AMEDEO

    Inventor: CANDORE AMEDEO

    Abstract: A method of fabricating a multilayer printed circuit board, comprises alternately stacking on a template (1) having at least two vertical alignment pins (2), predefined printed circuit sub-boards (3) and pre-impregnated sheets (12) precursors of dielectric layers of reinforced resin between said sub-boards, all provided with alignment holes (14, 5), binding together the components of the assembled stack, lifting the stack off the alignment pins (2), transferring it between the platens of a press and hot pressing it causing polymerization of the resin of said pre-impregnated sheets. The method consists in defining at least a pair of soldering pads (7) with hole therethrough at certain positions relative to said alignment holes (14, 5) on both faces of each of said sub-boards (3) except the lowermost sub-board on which blind pads (6) are defined on at least its upper face; indenting or perforating each pre-impregnated sheet (12) such not to overlap said pads (6, 7) and soldering each newly stacked sub-board (3) to the previously stacked underlying sub-board (3) through the respective pads (7) with a hole therethrough. The machine employs a template (1) having at least two vertical alignment pins (2); a least two electric soldering irons (16), soldering each sub-board (3) just stacked to the previously stacked underlying one through welding pads (7) having a hole therethrough and has means (18) for moving each one of said soldering irons along three orthogonal axis onto a respective one of said pads (7) with a hole therethrough to make the soldering, and off and away from the stack when the soldering have been done.

    Abstract translation: 一种制造多层印刷电路板的方法,包括交替地堆叠在具有至少两个垂直对准销(2),预定印刷电路子板(3)和预浸渍片(12)的模板(1)上,所述预浸渍片(12) 在所述子板之间的增强树脂层,均设有对准孔(14,5),将组装好的堆叠的部件结合在一起,将堆叠从对准销(2)上提起,将其转移到压力机的压板和 热压它导致所述预浸渍片材的树脂聚合。 该方法包括在每个所述子板(3)的两个面上的相对于所述对准孔(15)的某些位置处至少限定一对具有孔的焊盘(7),除了最下面的子板 至少在其上表面上限定了盲垫(6); 每个预浸渍片材(12)的凹陷或穿孔,使得不与所述垫片(6,7)重叠,并且通过相应的垫片(7)将每个新堆叠的子板材(3)焊接到先前堆叠的下面的子板材(3) )。 机器采用具有至少两个垂直对准销(2)的模板(1); 至少两个电烙铁(16),通过具有穿过其中的孔的焊接垫(7)将每个子板(3)焊接到刚堆叠到先前堆叠的下层的子板上,并具有用于移动每个所述烙铁的装置(18) 沿着三个正交轴线到相应的一个所述焊盘(7)上,具有穿过其中的孔以进行焊接,并且在进行焊接时离开和离开堆叠。

    MACHINE FOR STACKING AND BONDING SUB-BOARDS OF A MULTILAYER BOARD FOR A PRINTED CIRCUIT AND METHOD OF FABRICATION OF A MULTILAYER BOARD
    3.
    发明申请
    MACHINE FOR STACKING AND BONDING SUB-BOARDS OF A MULTILAYER BOARD FOR A PRINTED CIRCUIT AND METHOD OF FABRICATION OF A MULTILAYER BOARD 审中-公开
    用于印刷电路的多层板的堆叠和结合子机的机器以及制造多层板的方法

    公开(公告)号:WO2002067644A1

    公开(公告)日:2002-08-29

    申请号:PCT/IT2001/000083

    申请日:2001-02-21

    Inventor: CANDORE, Amedeo

    Abstract: A method of fabricating a multilayer printed circuit board, comprises alternately stacking on a template (1) having at least two vertical alignment pins (2), predefined printed circuit sub-boards (3) and pre-impregnated sheets (12) precursors of dielectric layers of reinforced resin between said sub-boards, all provided with alignment holes (14, 5), binding together the components of the assembled stack, lifting the stack off the alignment pins (2), transferring it between the platens of a press and hot pressing it causing polymerization of the resin of said pre-impregnated sheets. The method consists in defining at least a pair of soldering pads (7) with hole therethrough at certain positions relative to said alignment holes (14, 5) on both faces of each of said sub-boards (3) except the lowermost sub-board on which blind pads (6) are defined on at least its upper face; indenting or perforating each pre-impregnated sheet (12) such not to overlap said pads (6, 7) and soldering each newly stacked sub-board (3) to the previously stacked underlying sub-board (3) through the respective pads (7) with a hole therethrough. The machine employs a template (1) having at least two vertical alignment pins (2); a least two electric soldering irons (16), soldering each sub-board (3) just stacked to the previously stacked underlying one through welding pads (7) having a hole therethrough and has means (18) for moving each one of said soldering irons along three orthogonal axis onto a respective one of said pads (7) with a hole therethrough to make the soldering, and off and away from the stack when the soldering have been done.

    Abstract translation: 一种制造多层印刷电路板的方法,包括交替地堆叠在具有至少两个垂直对准销(2),预定印刷电路子板(3)和预浸渍片(12)的模板(1)上,所述预浸渍片(12) 在所述子板之间的增强树脂层,均设有对准孔(14,5),将组装好的堆叠的部件结合在一起,将堆叠从对准销(2)上提起,将其转移到压力机的压板和 热压它导致所述预浸渍片材的树脂聚合。 该方法包括在每个所述子板(3)的两个面上的相对于所述对准孔(15)的某些位置处至少限定一对具有孔的焊盘(7),除了最下面的子板 至少在其上表面上限定了盲垫(6); 每个预浸渍片材(12)的凹陷或穿孔,使得不与所述垫片(6,7)重叠,并且通过相应的垫片(7)将每个新堆叠的子板材(3)焊接到先前堆叠的下面的子板材(3) )。 机器采用具有至少两个垂直对准销(2)的模板(1); 至少两个电烙铁(16),通过具有穿过其中的孔的焊接垫(7)将每个子板(3)焊接到刚堆叠到先前堆叠的下层的子板上,并具有用于移动每个所述烙铁的装置(18) 沿着三个正交轴线到相应的一个所述焊盘(7)上,具有穿过其中的孔以进行焊接,并且在进行焊接时离开和离开堆叠。

    MACHINE FOR HOT LAMINATION OF A DRY PHOTORESIST FILM ONTO A BOARD FOR PRINTED CIRCUIT
    5.
    发明授权
    MACHINE FOR HOT LAMINATION OF A DRY PHOTORESIST FILM ONTO A BOARD FOR PRINTED CIRCUIT 有权
    机热层压干光致抗蚀剂薄膜上板电路板

    公开(公告)号:EP1324881B1

    公开(公告)日:2004-09-15

    申请号:EP00974777.5

    申请日:2000-10-12

    Inventor: Candore, Amedeo

    Abstract: An automatic machine for hot laminating a dry photoresist film (3, 4) supported on a peelable-off cover sheet onto a board (1) for printed circuit, includes at least a pair of hot laminating rolls, transfer means for feeding a preheated board to the inlet side of said pair of laminating rolls (11, 12), at least a supply roll of a rolled-up continuous ribbon of said supported dry photoresist film, vacuum means holding (5, 6) a free end portion of the supported dry photoresist film ribbon, means for pressing and tacking the leading edge of said vacuum held free end portion of the ribbon at a given position on a surface of a board moving towards the inlet side of said pair of laminating rolls, cutting means (17, 18) associated to said ribbon end holding and tacking means for cutting to measure, on account of the length of the fed board, the dry photoresist film ribbon carried along by the moving board (1) onto which the leading edge of the ribbon has been tacked by said tacking means, and means (13, 14) for heating said supported dry photoresist film at a certian temperature before laminating it through said pair or rolls. Said holding, tacking and cutting means translate together with the board (1), said holding, tacking and cutting means translate together with the board (1) and then return to their start position.

    PROTECTIVE FILM PEELING MACHINE FOR PRINTED CIRCUIT BOARDS
    6.
    发明公开
    PROTECTIVE FILM PEELING MACHINE FOR PRINTED CIRCUIT BOARDS 审中-公开
    机,用于电路板上的保护

    公开(公告)号:EP1351806A1

    公开(公告)日:2003-10-15

    申请号:EP01902643.4

    申请日:2001-01-16

    Inventor: Candore, Amedeo

    CPC classification number: B29C63/0013 G03F7/161

    Abstract: A machine peels a protective film (18) off a surface of a photoresist film laminated onto the surface of a printed circuit board (12), being the motion of the boards through the machine continuous. Such a condition is obtained in an effective manner by employing mechanical devices (2) for preventively degrading the adhesion along an edge zone of the laminated board (12) that, instead of acting onto the leading edge thereof substantially normal to the direction of advancement, act along two opposite lateral edges of the protective film (18), substantially parallel to the direction of advancement of the board through the machine, and are themselves a functional part of the board advancement system (conveyor). The mechanical devices (2) for degrading the adhesion along the two lateral edges of the protective film, eventually on both faces of the board, may be common knurls that act along the side edges of the protective film when the board passes at a substantially constant speed through the machine. According to the preferred embodiment, nozzles, (9, 10) suitable to blow air a relatively low pressure may be present in the separation gaps between two adjacent knurling wheels.

    HOT LAMINATION OF A DRY PHOTORESIST FILM ONTO A BOARD FOR PRINTED CIRCUIT
    7.
    发明公开
    HOT LAMINATION OF A DRY PHOTORESIST FILM ONTO A BOARD FOR PRINTED CIRCUIT 有权
    机热层压干光致抗蚀剂薄膜上板电路板

    公开(公告)号:EP1324881A1

    公开(公告)日:2003-07-09

    申请号:EP00974777.5

    申请日:2000-10-12

    Inventor: Candore, Amedeo

    Abstract: An automatic machine for hot laminating a dry photoresist film (3, 4) supported on a peelable-off cover sheet onto a board (1) for printed circuit, includes at least a pair of hot laminating rolls, transfer means for feeding a preheated board to the inlet side of said pair of laminating rolls (11, 12), at least a supply roll of a rolled-up continuous ribbon of said supported dry photoresist film, vacuum means holding (5, 6) a free end portion of the supported dry photoresist film ribbon, means for pressing and tacking the leading edge of said vacuum held free end portion of the ribbon at a given position on a surface of a board moving towards the inlet side of said pair of laminating rolls, cutting means (17, 18) associated to said ribbon end holding and tacking means for cutting to measure, on account of the length of the fed board, the dry photoresist film ribbon carried along by the moving board (1) onto which the leading edge of the ribbon has been tacked by said tacking means, and means (13, 14) for heating said supported dry photoresist film at a certian temperature before laminating it through said pair or rolls. Said holding, tacking and cutting means translate together with the board (1), said holding, tacking and cutting means translate together with the board (1) and then return to their start position.

    9.
    发明专利
    未知

    公开(公告)号:DE60013918D1

    公开(公告)日:2004-10-21

    申请号:DE60013918

    申请日:2000-10-12

    Applicant: CANDORE AMEDEO

    Inventor: CANDORE AMEDEO

    Abstract: An automatic machine for hot laminating a dry photoresist film (3, 4) supported on a peelable-off cover sheet onto a board (1) for printed circuit, includes at least a pair of hot laminating rolls, transfer means for feeding a preheated board to the inlet side of said pair of laminating rolls (11, 12), at least a supply roll of a rolled-up continuous ribbon of said supported dry photoresist film, vacuum means holding (5, 6) a free end portion of the supported dry photoresist film ribbon, means for pressing and tacking the leading edge of said vacuum held free end portion of the ribbon at a given position on a surface of a board moving towards the inlet side of said pair of laminating rolls, cutting means (17, 18) associated to said ribbon end holding and tacking means for cutting to measure, on account of the length of the fed board, the dry photoresist film ribbon carried along by the moving board (1) onto which the leading edge of the ribbon has been tacked by said tacking means, and means (13, 14) for heating said supported dry photoresist film at a certian temperature before laminating it through said pair or rolls. Said holding, tacking and cutting means translate together with the board (1), said holding, tacking and cutting means translate together with the board (1) and then return to their start position.

    10.
    发明专利
    未知

    公开(公告)号:AT276109T

    公开(公告)日:2004-10-15

    申请号:AT00974777

    申请日:2000-10-12

    Applicant: CANDORE AMEDEO

    Inventor: CANDORE AMEDEO

    Abstract: An automatic machine for hot laminating a dry photoresist film (3, 4) supported on a peelable-off cover sheet onto a board (1) for printed circuit, includes at least a pair of hot laminating rolls, transfer means for feeding a preheated board to the inlet side of said pair of laminating rolls (11, 12), at least a supply roll of a rolled-up continuous ribbon of said supported dry photoresist film, vacuum means holding (5, 6) a free end portion of the supported dry photoresist film ribbon, means for pressing and tacking the leading edge of said vacuum held free end portion of the ribbon at a given position on a surface of a board moving towards the inlet side of said pair of laminating rolls, cutting means (17, 18) associated to said ribbon end holding and tacking means for cutting to measure, on account of the length of the fed board, the dry photoresist film ribbon carried along by the moving board (1) onto which the leading edge of the ribbon has been tacked by said tacking means, and means (13, 14) for heating said supported dry photoresist film at a certian temperature before laminating it through said pair or rolls. Said holding, tacking and cutting means translate together with the board (1), said holding, tacking and cutting means translate together with the board (1) and then return to their start position.

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