Abstract:
Photoimageable dry-film for forming a solder mask on the face of a printed circuit board are more easily laminated on the face of the board by effecting evacuation of the entrapped air and a mechanical pressing within a vacuum chamber while avoiding heating of the photoimageable resin layer up to a fluid state. Subsequently the sandwich is heated at atmospheric pressure until the photoimageable resin layer (4) is made fluid to conform it to the surface of the board under the effect of the atmospheric pressure. Retention of a cover sheet (3) of the photoimageable dry-film (4) up to the moment of heating the pre-evacuated and pressed assembly facilitates the performance of local treatments for preserving the integrity of the film over tenting zones about holes of the printed circuit board. The method is effective either with conformable thin dry-films as well as with thicker dry-films.
Abstract:
A method of fabricating a multilayer printed circuit board, comprises alternately stacking on a template (1) having at least two vertical alignment pins (2), predefined printed circuit sub-boards (3) and pre-impregnated sheets (12) precursors of dielectric layers of reinforced resin between said sub-boards, all provided with alignment holes (14, 5), binding together the components of the assembled stack, lifting the stack off the alignment pins (2), transferring it between the platens of a press and hot pressing it causing polymerization of the resin of said pre-impregnated sheets. The method consists in defining at least a pair of soldering pads (7) with hole therethrough at certain positions relative to said alignment holes (14, 5) on both faces of each of said sub-boards (3) except the lowermost sub-board on which blind pads (6) are defined on at least its upper face; indenting or perforating each pre-impregnated sheet (12) such not to overlap said pads (6, 7) and soldering each newly stacked sub-board (3) to the previously stacked underlying sub-board (3) through the respective pads (7) with a hole therethrough. The machine employs a template (1) having at least two vertical alignment pins (2); a least two electric soldering irons (16), soldering each sub-board (3) just stacked to the previously stacked underlying one through welding pads (7) having a hole therethrough and has means (18) for moving each one of said soldering irons along three orthogonal axis onto a respective one of said pads (7) with a hole therethrough to make the soldering, and off and away from the stack when the soldering have been done.
Abstract:
A method of fabricating a multilayer printed circuit board, comprises alternately stacking on a template (1) having at least two vertical alignment pins (2), predefined printed circuit sub-boards (3) and pre-impregnated sheets (12) precursors of dielectric layers of reinforced resin between said sub-boards, all provided with alignment holes (14, 5), binding together the components of the assembled stack, lifting the stack off the alignment pins (2), transferring it between the platens of a press and hot pressing it causing polymerization of the resin of said pre-impregnated sheets. The method consists in defining at least a pair of soldering pads (7) with hole therethrough at certain positions relative to said alignment holes (14, 5) on both faces of each of said sub-boards (3) except the lowermost sub-board on which blind pads (6) are defined on at least its upper face; indenting or perforating each pre-impregnated sheet (12) such not to overlap said pads (6, 7) and soldering each newly stacked sub-board (3) to the previously stacked underlying sub-board (3) through the respective pads (7) with a hole therethrough. The machine employs a template (1) having at least two vertical alignment pins (2); a least two electric soldering irons (16), soldering each sub-board (3) just stacked to the previously stacked underlying one through welding pads (7) having a hole therethrough and has means (18) for moving each one of said soldering irons along three orthogonal axis onto a respective one of said pads (7) with a hole therethrough to make the soldering, and off and away from the stack when the soldering have been done.
Abstract:
An automatic machine for hot laminating a dry photoresist film (3, 4) supported on a peelable-off cover sheet onto a board (1) for printed circuit, includes at least a pair of hot laminating rolls, transfer means for feeding a preheated board to the inlet side of said pair of laminating rolls (11, 12), at least a supply roll of a rolled-up continuous ribbon of said supported dry photoresist film, vacuum means holding (5, 6) a free end portion of the supported dry photoresist film ribbon, means for pressing and tacking the leading edge of said vacuum held free end portion of the ribbon at a given position on a surface of a board moving towards the inlet side of said pair of laminating rolls, cutting means (17, 18) associated to said ribbon end holding and tacking means for cutting to measure, on account of the length of the fed board, the dry photoresist film ribbon carried along by the moving board (1) onto which the leading edge of the ribbon has been tacked by said tacking means, and means (13, 14) for heating said supported dry photoresist film at a certian temperature before laminating it through said pair or rolls. Said holding, tacking and cutting means translate together with the board (1), said holding, tacking and cutting means translate together with the board (1) and then return to their start position.
Abstract:
A machine peels a protective film (18) off a surface of a photoresist film laminated onto the surface of a printed circuit board (12), being the motion of the boards through the machine continuous. Such a condition is obtained in an effective manner by employing mechanical devices (2) for preventively degrading the adhesion along an edge zone of the laminated board (12) that, instead of acting onto the leading edge thereof substantially normal to the direction of advancement, act along two opposite lateral edges of the protective film (18), substantially parallel to the direction of advancement of the board through the machine, and are themselves a functional part of the board advancement system (conveyor). The mechanical devices (2) for degrading the adhesion along the two lateral edges of the protective film, eventually on both faces of the board, may be common knurls that act along the side edges of the protective film when the board passes at a substantially constant speed through the machine. According to the preferred embodiment, nozzles, (9, 10) suitable to blow air a relatively low pressure may be present in the separation gaps between two adjacent knurling wheels.
Abstract:
An automatic machine for hot laminating a dry photoresist film (3, 4) supported on a peelable-off cover sheet onto a board (1) for printed circuit, includes at least a pair of hot laminating rolls, transfer means for feeding a preheated board to the inlet side of said pair of laminating rolls (11, 12), at least a supply roll of a rolled-up continuous ribbon of said supported dry photoresist film, vacuum means holding (5, 6) a free end portion of the supported dry photoresist film ribbon, means for pressing and tacking the leading edge of said vacuum held free end portion of the ribbon at a given position on a surface of a board moving towards the inlet side of said pair of laminating rolls, cutting means (17, 18) associated to said ribbon end holding and tacking means for cutting to measure, on account of the length of the fed board, the dry photoresist film ribbon carried along by the moving board (1) onto which the leading edge of the ribbon has been tacked by said tacking means, and means (13, 14) for heating said supported dry photoresist film at a certian temperature before laminating it through said pair or rolls. Said holding, tacking and cutting means translate together with the board (1), said holding, tacking and cutting means translate together with the board (1) and then return to their start position.
Abstract:
An automatic machine for hot laminating a dry photoresist film (3, 4) supported on a peelable-off cover sheet onto a board (1) for printed circuit, includes at least a pair of hot laminating rolls, transfer means for feeding a preheated board to the inlet side of said pair of laminating rolls (11, 12), at least a supply roll of a rolled-up continuous ribbon of said supported dry photoresist film, vacuum means holding (5, 6) a free end portion of the supported dry photoresist film ribbon, means for pressing and tacking the leading edge of said vacuum held free end portion of the ribbon at a given position on a surface of a board moving towards the inlet side of said pair of laminating rolls, cutting means (17, 18) associated to said ribbon end holding and tacking means for cutting to measure, on account of the length of the fed board, the dry photoresist film ribbon carried along by the moving board (1) onto which the leading edge of the ribbon has been tacked by said tacking means, and means (13, 14) for heating said supported dry photoresist film at a certian temperature before laminating it through said pair or rolls. Said holding, tacking and cutting means translate together with the board (1), said holding, tacking and cutting means translate together with the board (1) and then return to their start position.
Abstract:
An automatic machine for hot laminating a dry photoresist film (3, 4) supported on a peelable-off cover sheet onto a board (1) for printed circuit, includes at least a pair of hot laminating rolls, transfer means for feeding a preheated board to the inlet side of said pair of laminating rolls (11, 12), at least a supply roll of a rolled-up continuous ribbon of said supported dry photoresist film, vacuum means holding (5, 6) a free end portion of the supported dry photoresist film ribbon, means for pressing and tacking the leading edge of said vacuum held free end portion of the ribbon at a given position on a surface of a board moving towards the inlet side of said pair of laminating rolls, cutting means (17, 18) associated to said ribbon end holding and tacking means for cutting to measure, on account of the length of the fed board, the dry photoresist film ribbon carried along by the moving board (1) onto which the leading edge of the ribbon has been tacked by said tacking means, and means (13, 14) for heating said supported dry photoresist film at a certian temperature before laminating it through said pair or rolls. Said holding, tacking and cutting means translate together with the board (1), said holding, tacking and cutting means translate together with the board (1) and then return to their start position.