Method for alignment employing film mask and aligner therefor

    公开(公告)号:GB2271430A

    公开(公告)日:1994-04-13

    申请号:GB9319933

    申请日:1993-09-28

    Abstract: A method for alignment of a printed circuit board and an aligner therefor comprise the steps of firmly fitting a film mask F having a given pattern onto a photosensitive object S for alignment after mutual positioning thereof, tightly fitting said film mask onto the object for alignment by depressing a film member P which is expanded by introducing a fluid, (e.g. air from a pressure source 45) onto the rear surface of the film mask, and performing exposure of the pattern on said film mask onto the objects.

    Printing frame
    7.
    发明专利

    公开(公告)号:GB2281980A

    公开(公告)日:1995-03-22

    申请号:GB9413941

    申请日:1994-07-11

    Inventor: SANGU KATSUYA

    Abstract: A printing frame has an enclosable space (S) to receive masks (F) on either side of a substrate (P) with photosensitive layers on both sides. Flexible films (4a, 4b) on either side of the mask can be inflated by pump (7) to establish tight fitting between the mask (F) and the substrate (P) by elastic expansion thereof. Also, a pressure reducing device (9) is provided for creating a vacuum in the enclosed space (S) for further establishing tight fitting between the mask (F) and the substrate (P). An exposure arrangement (20, 20b) contact exposes the photosensitive layers to the masks (F) tightly fitted on the substrate (P).

    METHOD FOR ALIGNMENT EMPLOYING FILM MASK AND ALIGNER THEREFOR

    公开(公告)号:GB9319933D0

    公开(公告)日:1993-11-17

    申请号:GB9319933

    申请日:1993-09-28

    Abstract: A method for alignment of a printed circuit board and an aligner therefor comprise the steps of firmly fitting a film mask F having a given pattern onto a photosensitive object S for alignment after mutual positioning thereof, tightly fitting said film mask onto the object for alignment by depressing a film member P which is expanded by introducing a fluid, (e.g. air from a pressure source 45) onto the rear surface of the film mask, and performing exposure of the pattern on said film mask onto the objects.

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