公开(公告)号：WO2009026224A3

公开(公告)日：2009-02-26

申请号：PCT/US2008/073475

申请日：2008-08-18

Applicant: TEXAS INSTRUMENTS INCORPORATED ,  GERBER, Mark, A. ,  WACHTLER, Kurt, P. ,  CASTRO, Abram, M.

Inventor： GERBER, Mark, A. ,  WACHTLER, Kurt, P. ,  CASTRO, Abram, M.

IPC: H01L23/12

Abstract: A package-on-package system (100) has a first subsystem (191) interconnected with a second subsystem (192) by solder connectors. The first subsystem has an insulating, trace- laminated, sheet- like carrier (101), which is laminated (102) with an insulating trace- laminated frame (110) exposing a central portion (103) of the carrier. A first chip (160) is disposed in the central portion, with a second chip (170) on top; the height of the assembled chips approximates the frame height (111). Bondable contact pads (104) are in the central portion, and solderable terminals (121); pitch center-to-center 0.65 mm or less) on the frame. The second subsystem has a laminated substrate (194) with at least one chip attached, and terminals (195) in locations matching the terminals (121) on the frame of the first subsystem. The terminals of both subsystems are interconnected with solder (193) of a higher reflow temperature than additional solder balls (190) for connecting to external parts.

公开(公告)号：WO2009026224A2

公开(公告)日：2009-02-26

申请号：PCT/US2008073475

申请日：2008-08-18

Applicant: TEXAS INSTRUMENTS INC ,  GERBER MARK A ,  WACHTLER KURT P ,  CASTRO ABRAM M

Inventor： GERBER MARK A ,  WACHTLER KURT P ,  CASTRO ABRAM M

IPC: H01L23/12

CPC classification number: H01L25/105 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A package-on-package system (100) has a first subsystem (191) interconnected with a second subsystem (192) by solder connectors. The first subsystem has an insulating, trace- laminated, sheet- like carrier (101), which is laminated (102) with an insulating trace- laminated frame (110) exposing a central portion (103) of the carrier. A first chip (160) is disposed in the central portion, with a second chip (170) on top; the height of the assembled chips approximates the frame height (111). Bondable contact pads (104) are in the central portion, and solderable terminals (121); pitch center-to-center 0.65 mm or less) on the frame. The second subsystem has a laminated substrate (194) with at least one chip attached, and terminals (195) in locations matching the terminals (121) on the frame of the first subsystem. The terminals of both subsystems are interconnected with solder (193) of a higher reflow temperature than additional solder balls (190) for connecting to external parts.

Abstract translation: 封装封装系统（100）具有通过焊料连接器与第二子系统（192）互连的第一子系统（191）。 第一子系统具有绝缘的，跟踪层压的片状载体（101），其被层压（102）和暴露载体的中心部分（103）的绝缘的跟踪层叠框架（110）。 第一芯片（160）设置在中心部分，顶部具有第二芯片（170）; 组装芯片的高度接近框架高度（111）。 可焊接接触垫（104）在中心部分，以及可焊接端子（121）; 间距中心到中心0.65mm或更小）。 第二子系统具有附接有至少一个芯片的层叠基板（194），以及与第一子系统的框架上的端子（121）匹配的位置中的端子（195）。 两个子系统的端子与比另外的焊球（190）更高的回流温度的焊料（193）互连，用于连接到外部部件。

公开(公告)号：WO2008143675A1

公开(公告)日：2008-11-27

申请号：PCT/US2007/069553

申请日：2007-05-23

Applicant: TEXAS INSTRUMENTS INCORPORATED ,  WACHTLER, Kurt, P. ,  CASTRO, Abram, M. ,  GERBER, Mark, A.

Inventor： WACHTLER, Kurt, P. ,  CASTRO, Abram, M. ,  GERBER, Mark, A.

IPC: H01L23/48

CPC classification number: H01L25/0657 ,  H01L23/3128 ,  H01L23/481 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/73253 ,  H01L2225/06513 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2924/00014

Abstract: A semiconductor system (200) of one or more semiconductor interposers (201 ) with a certain dimension (210), conductive vias (212) extending from the first to the second surface, with terminals and attached non-reflow metal studs (215) at the ends of the vias. A semiconducting interposer surface may include discrete electronic components or an integrated circuit. One or more semiconductor chips (202,203) have a dimension (220,230) narrower than the interposer dimension, and an active surface with terminals and non- reflow metal studs (224,234). One chip is flip-attached to the first interposer surface, and another chip to the second interposer surface, so that the interposer dimension projects over the chip dimension. An insulating substrate (204) has terminals and reflow bodies (242) to connect to the studs of the projecting interposer.

Abstract translation: 具有一定尺寸（210）的一个或多个半导体插入件（201）的半导体系统（200），从第一表面延伸到第二表面的导电通孔（212），端子和附接的非回流金属螺柱（215）在 通孔的末端。 半导体插入器表面可以包括分立的电子部件或集成电路。 一个或多个半导体芯片（202,203）具有比插入件尺寸窄的尺寸（220,230）以及具有端子和非回流金属螺柱（224,234）的有源表面。 一个芯片被翻转连接到第一插入器表面，另一个芯片被转接到第二插入器表面，使得插入器尺寸突出在芯片尺寸上。 绝缘基板（204）具有端子和回流体（242），以连接到突出插入件的螺柱。

公开(公告)号：WO2007130938A2

公开(公告)日：2007-11-15

申请号：PCT/US2007/067872

申请日：2007-05-01

Applicant: TEXAS INSTRUMENTS INCORPORATED ,  GERBER, Mark, A. ,  WACHTLER, Kurt, P. ,  CASTRO, Abram, M.

Inventor： GERBER, Mark, A. ,  WACHTLER, Kurt, P. ,  CASTRO, Abram, M.

IPC: H01L31/111 ,  H01L23/02 ,  H01L21/00

CPC classification number: H05K1/141 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/162 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/19105 ,  H01L2924/30107 ,  H05K3/3436 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10734 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor system (300) has one or more packaged active subsystems (310, 330); each subsystem has a substrate with electrical contact pads and one or more semiconductor chips stacked on top of each other, assembled on the substrate. The system further has a packaged passive subsystem (320) including a substrate with electrical contacts and passive electrical components, such as resistors, capacitors, and indictors. The passive subsystem is stacked with the active subsystems and connected to them by solder bodies.

Abstract translation: 半导体系统（300）具有一个或多个封装的有源子系统（310,330）; 每个子系统具有基板，其具有电接触焊盘和堆叠在彼此之上的一个或多个半导体芯片，组装在基板上。 该系统还具有封装的无源子系统（320），其包括具有电触点的基板和无源电部件，例如电阻器，电容器和指示器。 被动子系统与有源子系统堆叠并通过焊料体与其连接。

公开(公告)号：WO2007130938A3

公开(公告)日：2009-01-08

申请号：PCT/US2007067872

申请日：2007-05-01

Applicant: TEXAS INSTRUMENTS INC ,  GERBER MARK A ,  WACHTLER KURT P ,  CASTRO ABRAM M

Inventor： GERBER MARK A ,  WACHTLER KURT P ,  CASTRO ABRAM M

IPC: H01L23/488

CPC classification number: H05K1/141 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/162 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/19105 ,  H01L2924/30107 ,  H05K3/3436 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10734 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor system (300) has one or more packaged active subsystems (310, 330); each subsystem has a substrate with electrical contact pads and one or more semiconductor chips stacked on top of each other, assembled on the substrate. The system further has a packaged passive subsystem (320) including a substrate with electrical contacts and passive electrical components, such as resistors, capacitors, and indictors. The passive subsystem is stacked with the active subsystems and connected to them by solder bodies.

Abstract translation: 半导体系统（300）具有一个或多个封装的有源子系统（310,330）; 每个子系统具有基板，其具有电接触焊盘和堆叠在彼此之上的一个或多个半导体芯片，组装在基板上。 该系统还具有封装的无源子系统（320），其包括具有电触点的基板和无源电部件，例如电阻器，电容器和指示器。 被动子系统与有源子系统堆叠并通过焊料体与其连接。