-
公开(公告)号：WO2009132061A2
公开(公告)日：2009-10-29
申请号：PCT/US2009/041346
申请日：2009-04-22
Applicant: MEDTRONIC, INC. , ENGMARK, David, B. , GROSE, Gary, M. , SCHAEFER, Todd, H. , CEBALLOS, Thomas, I. , RIES, Andrew, J.
Inventor： ENGMARK, David, B. , GROSE, Gary, M. , SCHAEFER, Todd, H. , CEBALLOS, Thomas, I. , RIES, Andrew, J.
CPC classification number: H05K1/189 , A61N1/375 , A61N1/3758 , H05K1/118 , H05K1/147 , H05K2201/053 , H05K2201/10083 , H05K2201/10363 , Y10T29/49126
Abstract: An implantable medical device (IMD) having a hermetic housing formed from a case and a cover each having an exterior surface and an interior surface. An IMD component is mounted to the interior surface of the cover and has an electrical contact. A hybrid circuit is assembled in the case. The IMD component electrical contact is electrically coupled to the to the hybrid circuit assembled in the case.
Abstract translation: 一种具有由壳体和盖子形成的密封壳体的植入式医疗装置（IMD），每个壳体具有外表面和内表面。 IMD组件安装到盖的内表面并且具有电接触。 在这种情况下组装了混合电路。 IMD组件电接触件电耦合到组装在壳体中的混合电路。
-
公开(公告)号：WO2009132061A3
公开(公告)日：2010-01-21
申请号：PCT/US2009041346
申请日：2009-04-22
Applicant: MEDTRONIC INC , ENGMARK DAVID B , GROSE GARY M , SCHAEFER TODD H , CEBALLOS THOMAS I , RIES ANDREW J
Inventor： ENGMARK DAVID B , GROSE GARY M , SCHAEFER TODD H , CEBALLOS THOMAS I , RIES ANDREW J
CPC classification number: H05K1/189 , A61N1/375 , A61N1/3758 , H05K1/118 , H05K1/147 , H05K2201/053 , H05K2201/10083 , H05K2201/10363 , Y10T29/49126
Abstract: An implantable medical device (IMD) having a hermetic housing formed from a case and a cover each having an exterior surface and an interior surface. An IMD component is mounted to the interior surface of the cover and has an electrical contact. A hybrid circuit is assembled in the case. The IMD component electrical contact is electrically coupled to the to the hybrid circuit assembled in the case.
Abstract translation: 一种具有由壳体和盖子形成的密封壳体的植入式医疗装置（IMD），每个壳体具有外表面和内表面。 IMD组件安装到盖的内表面并且具有电接触。 在这种情况下组装了混合电路。 IMD组件电接触件电耦合到组装在壳体中的混合电路。
-
Search Results
2
records
(took 0.017 seconds)
