公开(公告)号：WO2008012209A2

公开(公告)日：2008-01-31

申请号：PCT/EP2007/057198

申请日：2007-07-12

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION ,  IBM UNITED KINGDOM LIMITED ,  COLBERT, John, Lee ,  CORBIN JR, John, Saunders ,  EAGLE, Jason, Rodney ,  HAMILTON, Roger, Duane ,  MIKHAIL, Amanda, Elisa ,  SINHA, Arvind, Kumar ,  SOBOTTA, Terry, Leo

Inventor： COLBERT, John, Lee ,  CORBIN JR, John, Saunders ,  EAGLE, Jason, Rodney ,  HAMILTON, Roger, Duane ,  MIKHAIL, Amanda, Elisa ,  SINHA, Arvind, Kumar ,  SOBOTTA, Terry, Leo

IPC: H01L23/40

CPC classification number: H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method and apparatus for applying a specified compressive force by a heat dissipation device for an integrated circuit are given, including placing the integrated circuit device onto a printed circuit board and then placing the heat dissipation device onto the integrated circuit device. The method includes tightening an actuation screw in a spring plate against a 10 portion of the heat dissipation device. The actuation screw may be prevented from being tightened beyond a mechanical constraint corresponding to a pre-set calibration for the specific compressive force, which may be greater than or equal to a minimum compressive force corresponding to the greater of a minimum thermal interface pressure and a minimum contact interface pressure. Additionally, the specific compressive force may be less than or 15 equal to a maximum pressure which may be exerted on the integrated circuit device.

Abstract translation: 给出了一种通过用于集成电路的散热装置施加特定压缩力的方法和装置，包括将集成电路装置放置在印刷电路板上，然后将散热装置放置在集成电路装置上。 该方法包括将弹簧板中的致动螺钉紧固在散热装置的10个部分上。 可以防止致动螺钉被紧固超过对应于对于特定压缩力的预设校准的机械约束，其可以大于或等于对应于较小的最小热界面压力的最小压缩力，并且 最小接触界面压力。 另外，比压缩力可以小于或等于可以施加在集成电路装置上的最大压力。

公开(公告)号：WO2008012209A3

公开(公告)日：2008-05-08

申请号：PCT/EP2007057198

申请日：2007-07-12

Applicant: IBM ,  IBM UK ,  COLBERT JOHN LEE ,  CORBIN JR JOHN SAUNDERS ,  EAGLE JASON RODNEY ,  HAMILTON ROGER DUANE ,  MIKHAIL AMANDA ELISA ,  SINHA ARVIND KUMAR ,  SOBOTTA TERRY LEO

Inventor： COLBERT JOHN LEE ,  CORBIN JR JOHN SAUNDERS ,  EAGLE JASON RODNEY ,  HAMILTON ROGER DUANE ,  MIKHAIL AMANDA ELISA ,  SINHA ARVIND KUMAR ,  SOBOTTA TERRY LEO

IPC: H01L23/40

CPC classification number: H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method and apparatus for applying a specified compressive force by a heat dissipation device for an integrated circuit are given, including placing the integrated circuit device onto a printed circuit board and then placing the heat dissipation device onto the integrated circuit device. The method includes tightening an actuation screw in a spring plate against a portion of the heat dissipation device. The actuation screw may be prevented from being tightened beyond a mechanical constraint corresponding to a pre-set calibration for the specific compressive force, which may be greater than or equal to a minimum compressive force corresponding to the greater of a minimum thermal interface pressure and a minimum contact interface pressure. Additionally, the specific compressive force may be less than or equal to a maximum pressure which may be exerted on the integrated circuit device.

Abstract translation: 给出了一种通过用于集成电路的散热装置施加特定压缩力的方法和装置，包括将集成电路装置放置在印刷电路板上，然后将散热装置放置在集成电路装置上。 该方法包括将弹簧板中的致动螺钉紧固在散热装置的一部分上。 可以防止致动螺钉被紧固超过对应于特定压缩力的预设校准的机械约束，其可以大于或等于对应于最小热界面压力中较大者的最小压缩力，以及 最小接触界面压力。 此外，比压缩力可以小于或等于可以施加在集成电路装置上的最大压力。