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公开(公告)号:US10669636B2
公开(公告)日:2020-06-02
申请号:US15455762
申请日:2017-03-10
Applicant: Michael J. Naughton , Chaobin Yang , Kris Kempa , Michael J. Burns
Inventor: Michael J. Naughton , Chaobin Yang , Kris Kempa , Michael J. Burns
IPC: G03F7/095 , C23C18/38 , H01B1/02 , C23C18/42 , C23C18/16 , C23C18/52 , G03F7/11 , B05D1/32 , G03F7/40
Abstract: An all solution-processed deposition includes a non-water soluble, non-self-cracking film deposited by a solution process (e.g., spray, dip, spin coat, and the like), a water soluble, self-cracking film deposited by a solution process (e.g., spray, dip, spin coat, and the like), cracking of the film, and filling the cracks with a metal that is deposited in solution (e.g., by electroless disposition). A transparent substrate having a cracked water insoluble, non-self-cracking film surface coating includes a plurality of fissures therein extending to and exposing portions of the surface of the underlying transparent substrate is useful for producing a transparent conducting film.
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公开(公告)号:US20170261858A1
公开(公告)日:2017-09-14
申请号:US15455762
申请日:2017-03-10
Applicant: Michael J. Naughton , Chaobin Yang , Kris Kempa , Michael J. Burns
Inventor: Michael J. Naughton , Chaobin Yang , Kris Kempa , Michael J. Burns
IPC: G03F7/40 , G03F7/038 , G03F7/16 , H01B1/02 , G03F7/20 , G03F7/26 , H01B5/14 , H01B13/00 , G03F7/039 , G03F7/11
CPC classification number: C23C18/38 , B05D1/327 , B05D2201/02 , B05D2203/35 , C23C18/1605 , C23C18/42 , C23C18/52 , G03F7/11 , G03F7/40 , H01B1/02
Abstract: An all solution-processed deposition includes a non-water soluble, non-self-cracking film deposited by a solution process (e.g., spray, dip, spin coat, and the like), a water soluble, self-cracking film deposited by a solution process (e.g., spray, dip, spin coat, and the like), cracking of the film, and filling the cracks with a metal that is deposited in solution (e.g., by electroless disposition). A transparent substrate having a cracked water insoluble, non-self-cracking film surface coating includes a plurality of fissures therein extending to and exposing portions of the surface of the underlying transparent substrate is useful for producing a transparent conducting film.
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