Abstract:
A lamp power assembling structure and method, the lamp power assembling structure is installed indoors and is connected an indoor power source, and includes a lamp power seat and a lamp fixing seat. The lamp power seat has a first power connector for connecting to the indoor power source and two sliding trenches. Each sliding trench has an arced channel and an enlarged hole formed at an end of the arced channel. The lamp fixing seat has a second power connector corresponding to the first power connector and two fasteners separately corresponding to the two enlarged holes. The two fasteners are separately inserted into the two enlarged holes, and the lamp fixing seat is rotated about the first and second power connectors so as to make the two fasteners separately to be engaged with the arced channels to fix the lamp fixing seat to the lamp power seat.
Abstract:
Within a method for forming a silicon layer, there is employed at least one sub-layer formed of a higher crystalline silicon material and at least one sub-layer formed of a lower crystalline silicon material. The lower crystalline silicon material is formed employing a hydrogen treatment of the higher crystalline silicon material. The method is particularly useful for forming polysilicon based gate electrodes with enhanced dimensional control and enhanced performance.
Abstract:
A system for, and method of using multiple data flows, both transactional and non-transactional, in real time to modify a transaction is disclosed. Further the use of transaction information in real time as a decision factor to trigger a different, non-transactional response, and the combination of the two approaches is disclosed. In particular, a network comprised of a plurality of software modules and databases is capable of combining current POS/POP transaction data, with a variety of other outside data sources to provide improved information for adjusting responses to transactions in real time. More specifically, the network utilizes payer facing systems to analyze the data in combination with well-known POS/POP transaction data and a variety of internal and external systems to combine information and provide modified transactions, related discounts and offers, and other relevant messaging to the payer. In addition, a specific method for analyzing for fraud within hybrid information transactions is disclosed and several examples to illustrate the invention are included.
Abstract:
A method includes measuring a gate leakage current of a plurality of transistors. A single stress bias voltage is applied to the plurality of transistors. The stress bias voltage causes a 10% degradation in a drive current of each transistor within a respective stress period t. One or more relationships are determined, between the measured gate leakage current and one or more of the group consisting of gate voltage, gate length, gate temperature, and gate width of the plurality of transistors, respectively. A negative bias temperature instability (NBTI) lifetime τ of the plurality of transistors is estimated, based on the measured gate leakage current and the one or more relationships.
Abstract:
A PMOS device less affected by negative bias time instability (NBTI) and a method for forming the same are provided. The PMOS device includes a barrier layer over at least a portion of a gate structure, a gate spacer, and source/drain regions of a PMOS device. A stressed layer is then formed over the barrier layer. The barrier layer is preferably an oxide layer and is preferably not formed for NMOS devices.
Abstract:
The current invention provides a method of determining the lifetime of a semiconductor device due to time dependent dielectric breakdown (TDDB). This method includes providing a plurality of samples of dielectric layer disposed as a gate dielectric layer of a MOS transistor, approximating a source/drain current density distribution as a first function of voltage applied on the samples, approximating a substrate current density distribution as a second function of voltage applied on the samples, approximating a dielectric layer lifetime distribution as a third function of source/drain current density and substrate current density in the samples, deriving, from the first, second, and the third functions, an empirical model wherein a dielectric layer lifetime is a function of voltage applied thereon, and using the model to determine dielectric layer lifetime at a pre-determined operating gate voltage.
Abstract:
A semiconductor device having a random grained polysilicon layer and a method for its manufacture are provided. In one example, the device includes a semiconductor substrate and an insulator layer on the substrate. A first polysilicon layer having a random grained structure is positioned above the insulator layer, a semiconductor alloy layer is positioned above the first polysilicon layer, and a second polysilicon layer is positioned above the semiconductor alloy layer.
Abstract:
A gas supply device, including: a first source of an inert carrier gas, communicated with a first pipeline; a second source of anhydrous reactive gas, communicated with a second pipeline; a third source of enabling chemical gas of an enabling chemical compound, communicated with a third pipeline; a main pipeline, communicated with the first, second, and third pipelines; and a temperature controller, located on the second pipeline.
Abstract:
A method includes measuring a gate leakage current of at least one transistor. A single stress bias voltage is applied to the at least one transistor at a given temperature for a stress period t. The stress bias voltage causes a 10% degradation in a drive current of the transistor at the given temperature within the stress period t. A negative bias temperature instability (NBTI) lifetime τ of the transistor is estimated based on the measured gate leakage current and a relationship between drive current degradation and time observed during the applying step.
Abstract:
A PMOS device less affected by negative bias time instability (NBTI) and a method for forming the same are provided. The PMOS device includes a barrier layer over at least a portion of a gate structure, a gate spacer, and source/drain regions of a PMOS device. A stressed layer is then formed over the barrier layer. The barrier layer is preferably an oxide layer and is preferably not formed for NMOS devices.