公开(公告)号：EP1319326A1

公开(公告)日：2003-06-18

申请号：EP01968791.2

申请日：2001-09-12

Applicant: Datatronic Distribution Incorporated

Inventor： SIU, Paul

IPC: H05K5/06

CPC classification number: H05K5/0095 ,  H01L23/053 ,  H01L23/10 ,  H01L2924/0002 ,  H05K3/301 ,  H01L2924/00

Abstract: A hermetically sealed package having wires (30) entering at the base (50) and being embedded vertically in its walls (10A-10D) for connecting to the leads (45,46) of a component assembly (41) within the package. The wires protrude vertically from the walls, serving as pins (31) for electrical connection of the leads inside the package. The component assembly is secured to an inner side of the package by an adhesive (51). A cover (20) is affixed to the upper edges of the walls by an ultrasonic weld so as to create a hermetic seal.

公开(公告)号：EP1212774A1

公开(公告)日：2002-06-12

申请号：EP00905805.8

申请日：2000-01-31

Applicant: Datatronic Distribution Incorporated

Inventor： Rund, Larry D. ,  Hewitt, Richard P. ,  Sigafoos, Stuart O.

IPC: H01J3/08 ,  H01J41/02

CPC classification number: H01F41/0206 ,  H01F3/14

Abstract: A method for gapping a ferrite core (10) by coating the core with a stabilizing material (32), fracturing the core with a laser beam (44) thereby creating one or more gaps (47) in the cores magnetic field, optionally opening the fracture to obtain a desired inductance, and then sealing the core.