公开(公告)号：WO2010126448A2

公开(公告)日：2010-11-04

申请号：PCT/SE2010050479

申请日：2010-04-30

Applicant: SILEX MICROSYSTEMS AB ,  EBEFORS THORBJOERN ,  KAELVESTEN EDWARD ,  SVEDIN NIKLAS ,  ERIKSSON ANDERS

Inventor： EBEFORS THORBJOERN ,  KAELVESTEN EDWARD ,  SVEDIN NIKLAS ,  ERIKSSON ANDERS

IPC: H01L23/10

CPC classification number: H01L23/10 ,  B81C1/00269 ,  B81C2203/0118 ,  B81C2203/019 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/13144 ,  H01L2224/29035 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81895 ,  H01L2224/83805 ,  H01L2224/9211 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/1461 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/0401

Abstract: The invention relates to a sealing and bonding material structure for joining semiconductor wafers having monolithically integrated components. The sealing and bonding material are provided in strips forming closed loops. There are provided at least two concentric sealing strips on one wafer. The strips are laid out so as to surround the component(s) on the wafers to be sealed off when wafers are bonded together. The material in said strips is a material bonding said semiconductor wafers together and sealing off the monolithically integrated components when subjected to force and optionally heating. The invention also provides a monolithically integrated electrical and/or mechanical and/or fluidic and/or optical device comprising a first substrate and a second substrate, bonded together with a sealing and bonding structure according to the invention. A method comprises providing a sealing and bonding material structure according to the invention on at least one of two wafers and applying a force and optionally heat to the wafers to join them.

Abstract translation: 本发明涉及用于接合具有单片集成部件的半导体晶片的密封和接合材料结构。 密封和接合材料设置成形成闭环的条带。 在一个晶片上提供至少两个同心密封条。 条带布置成围绕晶片上的部件以在晶片接合在一起时被密封。 所述条带中的材料是将所述半导体晶片结合在一起的材料，并且当经受强制和任选地加热时密封单片集成部件。 本发明还提供了一种单片集成的电气和/或机械和/或流体和/或光学装置，其包括第一基板和第二基板，其与根据本发明的密封和结合结构结合在一起。 一种方法包括在两个晶片中的至少一个晶片上提供根据本发明的密封和接合材料结构，并施加力并且可选地加热到晶片以将它们接合。

公开(公告)号：WO2008091221A3

公开(公告)日：2008-09-18

申请号：PCT/SE2008050093

申请日：2008-01-25

Applicant: SILEX MICROSYSTEMS AB ,  EBEFORS THORBJOERN ,  KAELVESTEN EDVARD ,  BAUER TOMAS

Inventor： EBEFORS THORBJOERN ,  KAELVESTEN EDVARD ,  BAUER TOMAS

IPC: B81B7/00 ,  B81C3/00 ,  H01L23/043

CPC classification number: H01L21/762 ,  B81C1/00246 ,  H01L21/823481 ,  H01L23/055 ,  H01L23/147 ,  H01L23/26 ,  H01L23/49838 ,  H01L23/552 ,  H01L23/66 ,  H01L2223/6622 ,  H01L2223/6688 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/16195 ,  H01L2924/16251 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/0401

Abstract: The invention relates in one aspect to a method of micro-packaging a component. At least a first and a second semi-conductor substrate are provided, one of which has electrical through connections (vias). A depression in either one of said substrates or in both is etched. A component is provided above vias and connected thereto. The substrates are joined to form a sealed package. The invention also relates to a micro-packaged electronic or micromechanic device, comprising a thin-walled casing of a semi-conductor material having electrical through connections through the bottom of the casing. An electronic or micromechanic component is attached to said electrical through connections, and the package is hermetically sealed for maintaining a desired atmosphere, suitably vacuum inside the box.

Abstract translation: 本发明在一个方面涉及一种微封装部件的方法。 提供至少第一和第二半导体衬底，其中一个具有电连接（通孔）。 在任一个所述衬底中或在两者中的凹陷被蚀刻。 元件设置在通孔上方并与其连接。 基材被接合以形成密封包装。 本发明还涉及一种微封装电子或微机械装置，其包括具有穿过壳体底部的电连接的半导体材料的薄壁壳体。 电子或微机械部件连接到所述电连接连接，并且封装被气密密封以保持期望的气氛，在盒内适当的真空。

公开(公告)号：WO2007070004A3

公开(公告)日：2007-08-23

申请号：PCT/SE2006050582

申请日：2006-12-14

Applicant: SILEX MICROSYSTEMS AB ,  KAELVESTEN EDVARD ,  EBEFORS THORBJOERN ,  CORMAN THIERRY

Inventor： KAELVESTEN EDVARD ,  EBEFORS THORBJOERN ,  CORMAN THIERRY

IPC: A61B5/042 ,  A61B5/151 ,  A61B5/153 ,  A61M5/158 ,  A61M25/06 ,  A61M37/00 ,  A61N1/18 ,  G01N33/483 ,  G01R1/073

CPC classification number: A61M37/0015 ,  A61B5/053 ,  A61B5/150022 ,  A61B5/150282 ,  A61B5/150984 ,  A61M2037/003 ,  A61M2037/0046 ,  A61M2037/0053 ,  A61N1/0502 ,  A61N1/0551 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/00014

Abstract: The invention relates in a general aspect to a method of making vertically protruding elements on a substrate, said elements having a tip comprising at least one inclined surface and an elongated body portion extending between said substrate and said tip. The method comprises an anisotropic, crystal plane dependent etch forming said inclined surface(s); and an anisotropic, non crystal plane dependent etch forming said elongated body portion; combined with suitable patterning processes defining said protruding elements to have a predetermined base geometry.

Abstract translation: 本发明在总体方面涉及一种在衬底上制造垂直突出元件的方法，所述元件具有包括至少一个倾斜表面的尖端和在所述衬底和所述尖端之间延伸的细长主体部分。 该方法包括形成所述倾斜表面的各向异性，依赖于晶面的蚀刻; 以及形成所述细长主体部分的各向异性非晶体平面依赖蚀刻; 结合限定所述突出元件以具有预定基部几何形状的适当图案化工艺。