Abstract:
Dry processes, apparatus, compositions and systems are provided for reducing emissions of sulfur oxides, and sulfur dioxide in particular, and/or HCI in a process employing a combination of a dolomite hydrate sorbent and a sorbent doping agent administered to achieve coverage of a three-dimensional cross section of a passage carrying SOx and/or HCI - containing gases with a short but effective residence time at a temperature effective to provide significant sulfur dioxide and/or HCI reductions with high rates of reaction and sorbent utilization. The once-through, dry process can advantageously introduce the sorbent and sorbent doping agent dry or preferably as a slurry to enable uniform treatment. Preferred sorbent doping agents include water-soluble or water-dispersible copper and/or iron compositions which can be heated to an active form in situ by the flue gases being treated.
Abstract:
Dry processes, apparatus, compositions and systems are provided for reducing emissions of sulfur oxides, and sulfur dioxide in particular, and/or HCI in a process employing a combination of a dolomite hydrate sorbent and a sorbent doping agent administered to achieve coverage of a three-dimensional cross section of a passage carrying SOx and/or HCI - containing gases with a short but effective residence time at a temperature effective to provide significant sulfur dioxide and/or HCI reductions with high rates of reaction and sorbent utilization. The once-through, dry process can advantageously introduce the sorbent and sorbent doping agent dry or preferably as a slurry to enable uniform treatment. Preferred sorbent doping agents include water-soluble or water-dispersible copper and/or iron compositions which can be heated to an active form in situ by the flue gases being treated.
Abstract:
Dry processes, apparatus, compositions and systems are provided for reducing emissions of sulfur oxides, and sulfur dioxide in particular, and/or HCI in a process employing a combination of a dolomite hydrate sorbent and a sorbent doping agent administered to achieve coverage of a three-dimensional cross section of a passage carrying SO
Abstract:
Dry processes, apparatus, compositions and systems are provided for reducing emissions of sulfur oxides, and sulfur dioxide in particular, and/or HCI in a process employing a combination of a dolomite hydrate sorbent and a sorbent doping agent administered to achieve coverage of a three-dimensional cross section of a passage carrying SO
Abstract:
Dry processes, apparatus, compositions and systems are provided for reducing emissions of sulfur oxides, and sulfur dioxide in particular, and/or HCI in a process employing a combination of a dolomite hydrate sorbent and a sorbent doping agent administered to achieve coverage of a three-dimensional cross section of a passage carrying SO x and/or HCI - containing gases with a short but effective residence time at a temperature effective to provide significant sulfur dioxide and/or HCI reductions with high rates of reaction and sorbent utilization. The once-through, dry process can advantageously introduce the sorbent and sorbent doping agent dry or preferably as a slurry to enable uniform treatment. Preferred sorbent doping agents include water-soluble or water-dispersible copper and/or iron compositions which can be heated to an active form in situ by the flue gases being treated.
Abstract:
Dry processes, apparatus, compositions and systems are provided for reducing emissions of sulfur oxides, and sulfur dioxide in particular, and/or HCI in a process employing a combination of a dolomite hydrate sorbent and a sorbent doping agent administered to achieve coverage of a three-dimensional cross section of a passage carrying SO
Abstract:
Dry processes, apparatus, compositions and systems are provided for reducing emissions of mercury and optionally sulfur oxides and/or HCI. In an embodiment the copper- based mercury remediation composition comprises a copper ammonium complex having an empirical formula of C2H7CuN02 or any of the other materials described, which include compositions defined by the formula Cu(NH3)x(lower carboxylate)y, wherein the lower carboxylate is selected from the group consisting of formate, acetate and propionate, x is an integer from 0 to 4, y is an integer from 0 to 2, and x+y is equal to or greater than 1. Sulfur oxides and/or HCI can be additionally reduced by introduction of dolomite hydrate sorbent, and additional mercury remediation chemicals as manganese oxides can be employed. The treated gas stream is treated with a particulate removal device.
Abstract:
Dry processes, apparatus, compositions and systems are provided for reducing emissions of sulfur oxides, and sulfur dioxide in particular, and/or HCI in a process employing a combination of a dolomite hydrate sorbent and a sorbent doping agent administered to achieve coverage of a three-dimensional cross section of a passage carrying SO x and/or HCI - containing gases with a short but effective residence time at a temperature effective to provide significant sulfur dioxide and/or HCI reductions with high rates of reaction and sorbent utilization. The once-through, dry process can advantageously introduce the sorbent and sorbent doping agent dry or preferably as a slurry to enable uniform treatment. Preferred sorbent doping agents include water-soluble or water-dispersible copper and/or iron compositions which can be heated to an active form in situ by the flue gases being treated.
Abstract:
Compositions and methods for planarizing or polishing a surface, particularly a semiconductor wafer surface. The polishing compositions described herein comprise (a) a liquid carrier; (b) purified clay; and optional additives, such as (c) a chemical accelerator; and (d) a complexing or coupling agent capable of chemically or ionically complexing with, or coupling to, the metal and/or insulating material removed during the polishing process. The complexing or coupling agent carries away the removed metal and/or silicon dioxide insulator particles, during polishing, to prevent the separated particles from returning to the surface from which they were removed. Also disclosed are methods of planarizing or polishing a surface comprising contacting the surface with the compositions.