Abstract:
Disclosed herein are electrochemical fabrication platforms for making structures, arrays of structures and functional devices having selected nanosized and/or microsized physical dimensions, shapes and spatial orientations. Methods, systems and system components use an electrochemical stamping tool such as solid state polymeric electrolytes for generating patterns of relief and/or recessed features exhibiting excellent reproducibility, pattern fidelity and resolution on surfaces of solid state ionic conductors and in metal. Electrochemical stamping tools are capable high throughput patterning of large substrate areas, are compatible with commercially attractive manufacturing pathways to access a range of functional systems and devices including nano- and micro-electromechanical systems, sensors, energy storage devices, metal masks for printing, interconnects, and integrated electronic circuits.
Abstract:
A new method for forming an array of high aspect ratio semiconductor nanostructures entails positioning a surface of a stamp comprising a solid electrolyte in opposition to a conductive film disposed on a semiconductor substrate. The surface of the stamp includes a pattern of relief features in contact with the conductive film so as to define a film- stamp interface. A flux of metal ions is generated across the film-stamp interface, and a pattern of recessed features complementary to the pattern of relief features is created in the conductive film. The recessed features extend through an entire thickness of the conductive film to expose the underlying semiconductor substrate and define a conductive pattern on the substrate. The stamp is removed, and material immediately below the conductive pattern is selectively removed from the substrate. Features are formed in the semiconductor substrate having a length-to-width aspect ratio of at least about 5: 1.
Abstract:
A new method for forming an array of high aspect ratio semiconductor nanostructures entails positioning a surface of a stamp comprising a solid electrolyte in opposition to a conductive film disposed on a semiconductor substrate. The surface of the stamp includes a pattern of relief features in contact with the conductive film so as to define a film- stamp interface. A flux of metal ions is generated across the film-stamp interface, and a pattern of recessed features complementary to the pattern of relief features is created in the conductive film. The recessed features extend through an entire thickness of the conductive film to expose the underlying semiconductor substrate and define a conductive pattern on the substrate. The stamp is removed, and material immediately below the conductive pattern is selectively removed from the substrate. Features are formed in the semiconductor substrate having a length-to-width aspect ratio of at least about 5: 1.
Abstract:
An electrostatic drive includes a first electrode and a second electrode responsive to a drive signal. The drive signal includes an actuation signal constituent and a sensing signal constituent. The sensing signal constituent is at a frequency higher than a natural mechanical resonant frequency of the electrostatic drive. In response to the actuation signal constituent, displacement between the first electrode and the second electrode changes, which is evaluated by detecting a change in an electrical characteristic of the drive as a function of the sensing signal constituent.
Abstract:
Provided are high-resolution electrohydrodynamic inkjet (e-jet) printing systems and related methods for printing functional materials on a substrate surface. In an embodiment, a nozzle with an ejection orifice that dispenses a printing fluid faces a surface that is to be printed. The nozzle is electrically connected to a voltage source that applies an electric charge to the fluid in the nozzle to controllably deposit the printing fluid on the surface. In an aspect, a nozzle that dispenses printing fluid has a small ejection orifice, such as an orifice with an area less than 700 µm 2 and is capable of printing nanofeatures or microfeatures. In an embodiment the nozzle is an integrated-electrode nozzle system that is directly connected to an electrode and a counter-electrode. The systems and methods provide printing resolutions that can encompass the sub-micron range.
Abstract:
In one embodiment, a flexure subsystem (26) comprises a base (30), a stage (34), a positioning mechanism (40), and a control device (22). The base (30) and stage (34) have first and second portions that are spaced apart from each other. The positioning mechanism (40) is coupled between the base (30) and the stage (34). The positioning mechanism (40) includes an actuator (42a, 42b) and a flexure structure engaged by the actuator (42a, 42b). The flexure structure includes base links (62) coupled to the first base portion, stage links (64) coupled to the first stage portion, and an intermediate member (58) coupled to both the base and stage links (62, 64). All structures are coupled by flexure hinges (56). The control device (22) generates a control signal to change position of the stage (34) by sending a control signal to the actuator (42a, 42b) which provides a force to elastically deform the flexure structure and correspondingly move the stage (34).
Abstract:
An electrostatic drive includes a first electrode and a second electrode responsive to a drive signal. The drive signal includes an actuation signal constituent and a sensing signal constituent. The sensing signal constituent is at a frequency higher than a natural mechanical resonant frequency of the electrostatic drive. In response to the actuation signal constituent, displacement between the first electrode and the second electrode changes, which is evaluated by detecting a change in an electrical characteristic of the drive as a function of the sensing signal constituent.
Abstract:
In one embodiment, a flexure subsystem comprises a base, a stage, a positioning mechanism, and a control device. The base and stage have first and second portions that are spaced apart from each other. The positioning mechanism is coupled between the base and the stage. The positioning mechanism includes an actuator and a flexure structure engaged by the actuator. The flexure structure includes base links coupled to the first base portion, stage links coupled to the first stage portion, and an intermediate member coupled to both the base and stage links. All structures are coupled by flexure hinges. The control device generates a control signal to change position of the stage by sending a control signal to the actuator which provides a force to elastically deform the flexure structure and correspondingly move the stage.
Abstract:
A transfer printing process that exploits the mismatch in mechanical or thermo-mechanical response at the interface of a printable micro- or nano-device and a transfer stamp to drive the release of the device from the stamp and its non-contact transfer to a receiving substrate are provided. The resulting facile, pick-and-place process is demonstrated with the assembling of 3-D microdevices and the printing of GAN light-emitting diodes onto silicon and glass substrates. High speed photography is used to provide experimental evidence of thermo-mechanically driven release.
Abstract:
The present invention provides an electrochemical fabrication platform for making structures, arrays of structures and functional devices having selected anodized and/or microsized physical dimensions, shapes and spatial orientations. Methods, systems and system components of the present invention use an electrochemical stamping tool for generating patterns of relief and/or recessed features exhibiting excellent reproducibility, pattern fidelity and resolution on surfaces of solid state ionic conductors and in metal. Electrochemical stamping tools of the present invention are capable high throughput patterning of large substrate areas and, thus, enable a robust and commercially attractive manufacturing pathway to a range of functional systems and devices including nano- and micro-electromechanical systems, sensors, energy storage devices and integrated electronic circuits.