MEMS STRUCTURES, METHODS OF FABRICATING MEMS COMPONENTS ON SEPARATE SUBSTRATES AND ASSEMBLY OF SAME
    1.
    发明申请
    MEMS STRUCTURES, METHODS OF FABRICATING MEMS COMPONENTS ON SEPARATE SUBSTRATES AND ASSEMBLY OF SAME 审中-公开
    MEMS结构,制造分离基板上的MEMS部件的方法及其组装

    公开(公告)号:WO2008140926A3

    公开(公告)日:2009-05-28

    申请号:PCT/US2008061812

    申请日:2008-04-28

    Abstract: Methods of fabricating a microelectromechanical systems (MEMS) device with reduced masking and MEMS devices formed by the same are disclosed. In one embodiment, a MEMS device (900) is fabricated by laminating a front substrate (910) and a carrier (950), each of which has components preformed thereon. The front substrate (910) is provided with stationary electrodes formed thereover. A carrier (950) including movable electrodes (1360) formed thereover is attached to the front substrate (910). The carrier (3500) of some embodiments is released after transferring the movable electrodes (3510) to the front substrate (3570). In other embodiments, the carrier (3450) stays over the front substrate (3410), and serves as a backplate for the MEMS device (3400). Features are formed by deposition and patterning, by embossing, or by patterning and etching. In some embodiments in which the MEMS device (5200) serves as an interferometric modulator, the front substrate (5010) is also provided with black masks (5220) to prevent or mitigate bright areas in the actuated state of the MEMS device. Static interferometric modulators (5400) can also be formed by shaping or preformation and lamination. The methods not only reduce the manufacturing costs, but also provide a higher yield. The resulting MEMS devices can trap smaller volumes between laminated substrates and are less susceptible to pressure variations and moisture leakage.

    Abstract translation: 公开了制造具有减小的掩蔽的微机电系统(MEMS)装置和由其形成的MEMS装置的方法。 在一个实施例中,MEMS器件(900)通过层压前基板(910)和载体(950)而制造,每个基板具有在其上预成型的部件。 前基板(910)上设有固定电极。 包括在其上形成的可动电极(1360)的载体(950)附接到前基板(910)。 一些实施例的载体(3500)在将可移动电极(3510)转移到前基板(3570)之后被释放。 在其它实施例中,载体(3450)停留在前基板(3410)上,并且用作MEMS装置(3400)的背板。 特征通过沉积和图案化,通过压花或通过图案化和蚀刻形成。 在其中MEMS器件(5200)用作干涉式调制器的一些实施例中,前基板(5010)还具有黑色掩模(5220),以防止或减轻MEMS器件的致动状态下的亮区。 静态干涉式调制器(5400)也可以通过成形或预形成和层压形成。 该方法不仅降低了制造成本,而且提供了更高的产量。 所得到的MEMS器件可以在层压基板之间捕获更小的体积,并且不易受压力变化和水分泄漏的影响。

    MEMS DEVICES HAVING IMPROVED UNIFORMITY AND METHODS FOR MAKING THEM
    2.
    发明申请
    MEMS DEVICES HAVING IMPROVED UNIFORMITY AND METHODS FOR MAKING THEM 审中-公开
    具有改进的均匀性的MEMS器件及其制造方法

    公开(公告)号:WO2009006162A2

    公开(公告)日:2009-01-08

    申请号:PCT/US2008068205

    申请日:2008-06-25

    CPC classification number: G02B26/001 B81B3/0072 B81B2201/047

    Abstract: Disclosed is a microelectromechanical system (MEMS) device and method of manufacturing the same. In one aspect, MEMS such as an interferometric modulator include one or more elongated interior posts and support rails supporting a deformable reflective layer, where the elongated interior posts are entirely within an interferometric cavity and aligned parallel with the support rails. In another aspect, the interferometric modulator includes one or more elongated etch release holes formed in the deformable reflective layer and aligned parallel with channels formed in the deformable reflective layer defining parallel strips of the deformable reflective layer.

    Abstract translation: 公开了一种微机电系统(MEMS)装置及其制造方法。 在一个方面,诸如干涉式调制器的MEMS包括一个或多个细长的内部柱和支撑可变形的反射层的支撑轨道,其中细长的内部柱完全在干涉式空腔内并与支撑轨平行排列。 在另一方面,干涉式调制器包括形成在可变形反射层中的一个或多个细长蚀刻释放孔,并且与形成在可变形反射层中形成的沟道平行排列,所述可变形反射层限定可变形反射层的平行条带。

    MEMS STRUCTURES, METHODS OF FABRICATING MEMS COMPONENTS ON SEPARATE SUBSTRATES AND ASSEMBLY OF SAME
    4.
    发明申请
    MEMS STRUCTURES, METHODS OF FABRICATING MEMS COMPONENTS ON SEPARATE SUBSTRATES AND ASSEMBLY OF SAME 审中-公开
    MEMS结构,制造分离基板上的MEMS部件的方法及其组装

    公开(公告)号:WO2008140926A2

    公开(公告)日:2008-11-20

    申请号:PCT/US2008/061812

    申请日:2008-04-28

    Abstract: Methods of fabricating a microelectromechanical systems (MEMS) device with reduced masking and MEMS devices formed by the same are disclosed. In one embodiment, a MEMS device (900) is fabricated by laminating a front substrate (910) and a carrier (950), each of which has components preformed thereon. The front substrate (910) is provided with stationary electrodes formed thereover. A carrier (950) including movable electrodes (1360) formed thereover is attached to the front substrate (910). The carrier (3500) of some embodiments is released after transferring the movable electrodes (3510) to the front substrate (3570). In other embodiments, the carrier (3450) stays over the front substrate (3410), and serves as a backplate for the MEMS device (3400). Features are formed by deposition and patterning, by embossing, or by patterning and etching. In some embodiments in which the MEMS device (5200) serves as an interferometric modulator, the front substrate (5010) is also provided with black masks (5220) to prevent or mitigate bright areas in the actuated state of the MEMS device. Static interferometric modulators (5400) can also be formed by shaping or preformation and lamination. The methods not only reduce the manufacturing costs, but also provide a higher yield. The resulting MEMS devices can trap smaller volumes between laminated substrates and are less susceptible to pressure variations and moisture leakage.

    Abstract translation: 公开了制造具有减小的掩蔽的微机电系统(MEMS)装置和由其形成的MEMS装置的方法。 在一个实施例中,MEMS器件(900)通过层压前基板(910)和载体(950)而制造,每个基板具有在其上预成型的部件。 前基板(910)上设有固定电极。 包括在其上形成的可动电极(1360)的载体(950)附接到前基板(910)。 一些实施例的载体(3500)在将可移动电极(3510)转移到前基板(3570)之后被释放。 在其它实施例中,载体(3450)停留在前基板(3410)上,并且用作MEMS装置(3400)的背板。 特征通过沉积和图案化,通过压花或通过图案化和蚀刻形成。 在其中MEMS器件(5200)用作干涉式调制器的一些实施例中,前基板(5010)还具有黑色掩模(5220),以防止或减轻MEMS器件的致动状态下的亮区。 静态干涉式调制器(5400)也可以通过成形或预形成和层压形成。 该方法不仅降低了制造成本,而且提供了更高的产量。 所得到的MEMS器件可以在层压基板之间捕获更小的体积,并且不易受压力变化和水分泄漏的影响。

    MEMS DEVICES HAVING IMPROVED UNIFORMITY AND METHODS FOR MAKING THEM

    公开(公告)号:WO2009006162A3

    公开(公告)日:2009-01-08

    申请号:PCT/US2008/068205

    申请日:2008-06-25

    Abstract: Disclosed is a microelectromechanical system (MEMS) device and method of manufacturing the same. In one aspect, MEMS such as an interferometric modulator include one or more elongated interior posts and support rails supporting a deformable reflective layer, where the elongated interior posts are entirely within an interferometric cavity and aligned parallel with the support rails. In another aspect, the interferometric modulator includes one or more elongated etch release holes formed in the deformable reflective layer and aligned parallel with channels formed in the deformable reflective layer defining parallel strips of the deformable reflective layer.

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