公开(公告)号：US08824707B2

公开(公告)日：2014-09-02

申请号：US13340240

申请日：2011-12-29

Applicant: Mark Bachman ,  Guann-Pyng Li Li

Inventor： Mark Bachman ,  Guann-Pyng Li Li

IPC: H04R31/00 ,  H04R19/00

CPC classification number: H04R19/005 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A micromachined microphone or speaker embedded within, or positioned on top of, a substrate suitable for carrying microelectronic chips and components. The acoustic element converts sound energy into electrical energy which is then amplified by electronic components positioned on the surface of the substrate. Alternatively, the acoustic element may be driven by electronics to produce sound. The substrate can be used in standard microelectronic packaging applications.

Abstract translation: 嵌入在适于承载微电子芯片和部件的基板内或位于其上的微机械麦克风或扬声器。 声学元件将声能转换成电能，然后由位于基板表面上的电子部件放大。 或者，声学元件可以由电子器件驱动以产生声音。 该基板可用于标准微电子封装应用。