HINGE ASSEMBLY
    1.
    发明申请
    HINGE ASSEMBLY 有权
    铰链装配

    公开(公告)号:US20150337579A1

    公开(公告)日:2015-11-26

    申请号:US14650880

    申请日:2012-12-17

    Inventor: Steven Jacobs

    Abstract: A hinge assembly is disclosed herein. An example includes a first knuckle including a first wall that defines a first cavity and second knuckle including a second wall that defines a second cavity. The example also includes a friction element disposed in both the first cavity defined by the first wall of the first knuckle and the second cavity defined by the second wall of the second knuckle to both rotatably and resistively couple the first knuckle to the second knuckle by application of a force directed toward the first wall and the second wall, the friction element including a third wall that defines a third cavity. Modifications and additions to, as well as other examples of, the hinge assembly are also disclosed herein.

    Abstract translation: 本文公开了铰链组件。 一个例子包括第一转向节,其包括限定第一腔的第一壁和包括限定第二腔的第二壁的第二转向节。 该实施例还包括摩擦元件,其设置在由第一转向节的第一壁限定的第一空腔和由第二转向节的第二壁限定的第二腔中,并且通过施加可旋转地和电阻地将第一转向节连接到第二转向节 指向第一壁和第二壁的力,摩擦元件包括限定第三腔的第三壁。 本文还公开了铰链组件的修改和添加以及其他示例。

    DOCKTING STATION COOLING SYSTEM INCLUDING LIQUID-FILLED HOLLOW STRUCTURE
    2.
    发明申请
    DOCKTING STATION COOLING SYSTEM INCLUDING LIQUID-FILLED HOLLOW STRUCTURE 审中-公开
    包括液体填充空心结构的加料站冷却系统

    公开(公告)号:WO2005057387A2

    公开(公告)日:2005-06-23

    申请号:PCT/US2004/040682

    申请日:2004-12-03

    CPC classification number: G06F1/203 G06F2200/201

    Abstract: A docking station 100 includes a housing 170 receiving a portable computer 200. A liquid-filled hollow structure 112 is provided on a portion of the housing 170. The liquid-filled hollow structure 110 is in thermally conductive relation to the portable computer 200 when the portable computer 200 is docked in the docking station 100 such the heat is transferred from the portable computer 100 to the liquid-filled hollow structure 110.

    Abstract translation: 基座100包括容纳便携式计算机200的壳体170.充满液体的中空结构112设置在壳体170的一部分上。充液中空结构110处于导热状态 当便携式计算机200对接在对接站100中时,便携式计算机200与热量从便携式计算机100传递到充液中空结构110的关系。

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