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    MEMORY DEVICE AND MEMORY SYSTEM INCLUDING THE SAME
    1.
    发明申请
    MEMORY DEVICE AND MEMORY SYSTEM INCLUDING THE SAME 有权
    包括其的存储器件和存储器系统

    公开(公告)号：US20120042116A1

    公开(公告)日：2012-02-16

    申请号：US13210591

    申请日：2011-08-16

    Applicant: KYU-MIN PARK ,  Byoung-Sul Kim ,  Hak-Yong Lee ,  Jun-Ho Jo

    Inventor： KYU-MIN PARK ,  Byoung-Sul Kim ,  Hak-Yong Lee ,  Jun-Ho Jo

    IPC: G06F12/00 ,  G06F12/02

    CPC classification number: G06F13/4086

    Abstract: A memory device includes an interface unit and a memory unit. The interface unit receives a clock signal, a command signal and a data signal, internally adjusts input impedance based upon at least one of the command signal and the clock signal, and generates internal control signal of the memory device based upon the command signal and data signal. The memory unit performs read/write operations based upon the internal control signal.

    Abstract translation: 存储装置包括接口单元和存储单元。 接口单元接收时钟信号，命令信号和数据信号，根据命令信号和时钟信号中的至少一个在内部调整输入阻抗，并根据命令信号和数据产生存储器件的内部控制信号 信号。 存储单元基于内部控制信号执行读/写操作。

    Memory device and memory system including the same
    2.
    发明授权
    Memory device and memory system including the same 有权
    存储器件和存储器系统包括相同的

    公开(公告)号：US09218312B2

    公开(公告)日：2015-12-22

    申请号：US13210591

    申请日：2011-08-16

    Applicant: Kyu-Min Park ,  Byoung-Sul Kim ,  Hak-Yong Lee ,  Jun-Ho Jo

    Inventor： Kyu-Min Park ,  Byoung-Sul Kim ,  Hak-Yong Lee ,  Jun-Ho Jo

    IPC: G06F12/00 ,  G06F13/40

    CPC classification number: G06F13/4086

    Abstract: A memory device includes an interface unit and a memory unit. The interface unit receives a clock signal, a command signal and a data signal, internally adjusts input impedance based upon at least one of the command signal and the clock signal, and generates internal control signal of the memory device based upon the command signal and data signal. The memory unit performs read/write operations based upon the internal control signal.

    Abstract translation: 存储装置包括接口单元和存储单元。 接口单元接收时钟信号，命令信号和数据信号，根据命令信号和时钟信号中的至少一个在内部调整输入阻抗，并根据命令信号和数据产生存储器件的内部控制信号 信号。 存储单元基于内部控制信号执行读/写操作。

    Semiconductor Packages
    3.
    发明申请
    Semiconductor Packages 有权
    半导体封装

    公开(公告)号：US20110297933A1

    公开(公告)日：2011-12-08

    申请号：US13118948

    申请日：2011-05-31

    Applicant: Jun-ho Jo ,  Byoung-sul Kim ,  Kwang-won Park ,  Hak-yong Lee

    Inventor： Jun-ho Jo ,  Byoung-sul Kim ,  Kwang-won Park ,  Hak-yong Lee

    IPC: H01L23/48

    CPC classification number: G11C5/02 ,  H01L23/49816 ,  H01L23/49838 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Provided are a semiconductor package, a semiconductor memory module including the semiconductor package, and a system including the semiconductor memory module. The semiconductor package may include a plurality of main terminals arranged on a surface of the semiconductor package with constant intervals, and the plurality of main terminals may include terminals of a first set including a plurality of input/output terminals to which test signals may be input, and terminals of a second set including a plurality of input/output terminals to/from which signals other than the test signals may be input/output.

    Abstract translation: 提供半导体封装，包括半导体封装的半导体存储器模块和包括半导体存储器模块的系统。 半导体封装可以包括以恒定间隔布置在半导体封装的表面上的多个主端子，并且多个主端子可以包括包括可以输入测试信号的多个输入/输出端子的第一组的端子 ，以及可以输入/输出除了测试信号之外的信号的多个输入/输出端子的第二组的端子。

    LASER PROCESSING APPARATUS AND METHOD USING BEAM SPLIT
    4.
    发明申请
    LASER PROCESSING APPARATUS AND METHOD USING BEAM SPLIT 有权
    激光加工设备和使用光束分离的方法

    公开(公告)号：US20100187207A1

    公开(公告)日：2010-07-29

    申请号：US12670159

    申请日：2008-05-06

    Applicant: Dong Jun Lee ,  Jung Rae Park ,  Hak Yong Lee ,  Young Hoon Kwon

    Inventor： Dong Jun Lee ,  Jung Rae Park ,  Hak Yong Lee ,  Young Hoon Kwon

    IPC: B23K26/00

    CPC classification number: B23K26/067 ,  B23K26/0608 ,  B23K26/0652 ,  B23K26/0676 ,  B23K26/0736 ,  B23K26/082 ,  B23K26/0821 ,  B23K26/364 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/172 ,  B23K2103/30 ,  B23K2103/50 ,  H01L21/268

    Abstract: Disclosed are a laser processing apparatus and method that can effectively remove a low-k material formed on a wafer. A laser processing apparatus of the invention is a laser processing apparatus that processes a subject on which a low-k material is formed. The laser processing apparatus includes a laser generating unit that emits a laser beam; and an optical system that splits the laser beam emitted from the laser generating unit into two and irradiates the split laser beams onto the subject In this case, the optical system includes a pair of condensing lenses in which cut surfaces that are cut at a predetermined distance from central axes to be parallel to the central axes contact with each other, and the interval between the two split laser beams is the same as the interval between two edges of the low-k material in a removal subject region. According to the invention, after splitting a laser beam into two laser beams and primarily removing the edges of the low-k material in the removal subject region using the laser beams, the remaining low-k material between the edges is removed. As a result, it is possible to improve processing quality.

    Abstract translation: 公开了一种能够有效地去除在晶片上形成的低k材料的激光加工装置和方法。 本发明的激光加工装置是对形成有低k材料的被摄体进行处理的激光加工装置。 激光加工装置包括发射激光束的激光发生单元; 以及将从激光发生单元发射的激光束分成两部分并将分离的激光束照射到被摄体上的光学系统。在这种情况下，光学系统包括一对聚光透镜，其中以预定距离切割的切割表面 从中心轴平行于中心轴彼此接触，并且两个分离激光束之间的间隔与去除对象区域中的低k材料的两个边缘之间的间隔相同。 根据本发明，在将激光束分成两束激光束并且主要使用激光束去除去除对象区域中的低k材料的边缘之后，边缘之间剩余的低k材料被去除。 结果，可以提高加工质量。

    Method of multi-processing object using polygon mirror
    5.
    发明授权
    Method of multi-processing object using polygon mirror 有权
    使用多面镜的多处理对象的方法

    公开(公告)号：US07713780B2

    公开(公告)日：2010-05-11

    申请号：US11902602

    申请日：2007-09-24

    Applicant: Eun-Jeong Hong ,  Hak-Yong Lee ,  Tae-Kyoung Ryoo

    Inventor： Eun-Jeong Hong ,  Hak-Yong Lee ,  Tae-Kyoung Ryoo

    IPC: H01L21/44

    CPC classification number: B23K26/082 ,  B23K26/0821 ,  B23K26/40 ,  B23K2103/172

    Abstract: A method of multi-processing an object using a polygon mirror according to an embodiment of the invention includes setting processing parameters for individual layers of an object having a multilayer structure, performing laser processing on exposed layers in a region to be processed of the object according to the processing parameters using a polygon mirror, determining whether or not all of the layers of the object having a multilayer structure are processed, and if it is determined in the determining that not all of the layers are processed, progressing the performing of laser processing. Therefore, efficiency in processing the object can be increased, and cracks that occur in the object during laser processing using a polygon mirror can be minimized.

    Abstract translation: 根据本发明的实施例的使用多面镜对物体进行多处理的方法包括设置具有多层结构的物体的各层的处理参数，对待处理的物体的区域中的暴露层进行激光处理， 涉及使用多面镜的处理参数，确定是否处理具有多层结构的对象的所有层，并且如果确定不是所有的层都被处理，则进行激光加工的执行 。 因此，能够提高加工对象物的效率，能够使使用多面镜的激光加工时的物体发生的裂缝最小化。

    Semiconductor packages
    6.
    发明授权
    Semiconductor packages 有权
    半导体封装

    公开(公告)号：US08618540B2

    公开(公告)日：2013-12-31

    申请号：US13118948

    申请日：2011-05-31

    Applicant: Jun-Ho Jo ,  Byoung-Sul Kim ,  Kwang-Won Park ,  Hak-Yong Lee

    Inventor： Jun-Ho Jo ,  Byoung-Sul Kim ,  Kwang-Won Park ,  Hak-Yong Lee

    IPC: H01L23/58

    CPC classification number: G11C5/02 ,  H01L23/49816 ,  H01L23/49838 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Provided are a semiconductor package, a semiconductor memory module including the semiconductor package, and a system including the semiconductor memory module. The semiconductor package may include a plurality of main terminals arranged on a surface of the semiconductor package with constant intervals, and the plurality of main terminals may include terminals of a first set including a plurality of input/output terminals to which test signals may be input, and terminals of a second set including a plurality of input/output terminals to/from which signals other than the test signals may be input/output.

    Abstract translation: 提供半导体封装，包括半导体封装的半导体存储器模块和包括半导体存储器模块的系统。 半导体封装可以包括以恒定间隔布置在半导体封装的表面上的多个主端子，并且多个主端子可以包括包括可以输入测试信号的多个输入/输出端子的第一组的端子 ，以及可以输入/输出除了测试信号之外的信号的多个输入/输出端子的第二组的端子。

    Laser processing apparatus and method using beam split
    7.
    发明授权
    Laser processing apparatus and method using beam split 有权
    激光加工设备和使用光束分割的方法

    公开(公告)号：US08329560B2

    公开(公告)日：2012-12-11

    申请号：US12670159

    申请日：2008-05-06

    Applicant: Dong Jun Lee ,  Jung Rae Park ,  Hak Yong Lee ,  Young Hoon Kwon

    Inventor： Dong Jun Lee ,  Jung Rae Park ,  Hak Yong Lee ,  Young Hoon Kwon

    IPC: H01L21/30 ,  H01L21/461 ,  B23K26/36

    CPC classification number: B23K26/067 ,  B23K26/0608 ,  B23K26/0652 ,  B23K26/0676 ,  B23K26/0736 ,  B23K26/082 ,  B23K26/0821 ,  B23K26/364 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/172 ,  B23K2103/30 ,  B23K2103/50 ,  H01L21/268

    Abstract: Disclosed are a laser processing apparatus and method that can effectively remove a low-k material formed on a wafer. A laser processing apparatus of the invention is a laser processing apparatus that processes a subject on which a low-k material is formed. The laser processing apparatus includes a laser generating unit that emits a laser beam; and an optical system that splits the laser beam emitted from the laser generating unit into two and irradiates the split laser beams onto the subject In this case, the optical system includes a pair of condensing lenses in which cut surfaces that are cut at a predetermined distance from central axes to be parallel to the central axes contact with each other, and the interval between the two split laser beams is the same as the interval between two edges of the low-k material in a removal subject region. According to the invention, after splitting a laser beam into two laser beams and primarily removing the edges of the low-k material in the removal subject region using the laser beams, the remaining low-k material between the edges is removed. As a result, it is possible to improve processing quality.

    Abstract translation: 公开了一种能够有效地去除在晶片上形成的低k材料的激光加工装置和方法。 本发明的激光加工装置是对形成有低k材料的被摄体进行处理的激光加工装置。 激光加工装置包括发射激光束的激光发生单元; 以及将从激光发生单元发射的激光束分成两部分并将分离的激光束照射到被摄体上的光学系统。在这种情况下，光学系统包括一对聚光透镜，其中以预定距离切割的切割表面 从中心轴平行于中心轴彼此接触，并且两个分离激光束之间的间隔与去除对象区域中的低k材料的两个边缘之间的间隔相同。 根据本发明，在将激光束分成两束激光束并且主要使用激光束去除去除对象区域中的低k材料的边缘之后，边缘之间剩余的低k材料被去除。 结果，可以提高加工质量。

    Method and apparatus for managing erase count of memory device
    9.
    发明授权
    Method and apparatus for managing erase count of memory device 有权
    用于管理存储器件的擦除次数的方法和装置

    公开(公告)号：US08504760B2

    公开(公告)日：2013-08-06

    申请号：US12948157

    申请日：2010-11-17

    Applicant: Hak-yong Lee ,  Byoung-sul Kim ,  Kwang-won Park ,  Jun-ho Jo

    Inventor： Hak-yong Lee ,  Byoung-sul Kim ,  Kwang-won Park ,  Jun-ho Jo

    IPC: G06F12/00

    CPC classification number: G06F12/0246 ,  G06F2212/7211 ,  G11C16/349

    Abstract: A non-volatile memory device having a hidden cell located separate from data storage cells, and a method of effectively managing an erase count of the non-volatile memory device. The method includes preparing the non-volatile memory device that includes a hidden cell located separate from data storage cells and is not accessible to users of the data storage cells, and increasing an erase count stored in an erase count storing region of the hidden cell corresponding to at least one erased data storage cell when the at least one data storage cell is erased.

    Abstract translation: 具有与数据存储单元分离的隐藏单元的非易失性存储器件，以及有效地管理非易失性存储器件的擦除计数的方法。 该方法包括准备非易失性存储器件，该非易失性存储器件包括与数据存储单元分离的隐藏单元，并且数据存储单元的用户不可访问，并且增加存储在隐藏单元对应的擦除计数存储区域中的擦除计数 至少一个擦除的数据存储单元，当所述至少一个数据存储单元被擦除时。

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