Abstract:
In one embodiment, a PLL circuit is provided with a plurality of pull-in operation modes for pulling a voltage across a filter capacitor (C1, C2) in a lock-up voltage, and with a register (CRG) for designating one of the plurality of pull-in operation modes. The pull-in operation is performed in accordance with a setting value in the register.
Abstract:
In one embodiment, a PLL circuit is provided with a plurality of pull-in operation modes for pulling a voltage across a filter capacitor (C1, C2) in a lock-up voltage, and with a register (CRG) for designating one of the plurality of pull-in operation modes. The pull-in operation is performed in accordance with a setting value in the register. Such a PLL may be used in a communication device such as a wireless portable phone which can operate in multiple frequency bands, e.g. GSM, DCS and PCS frequency bands. The PLL allows fast pull-in time in each frequency band and avoids locking the image frequency.
Abstract:
A semiconductor device has an FET of a trench-gate structure obtained by disposing a conductive layer, which will be a gate, in a trench extended in the main surface of a semiconductor substrate, wherein the upper surface of the trench-gate conductive layer is formed equal to or higher than the main surface of the semiconductor substrate. The conductive layer of the trench gate is formed to have a substantially flat or concave upper surface and the upper surface is formed equal to or higher than the main surface of the semiconductor substrate. After etching of the semiconductor substrate to form the upper surface of the conductive layer of the trench gate, a channel region and a source region are formed by ion implantation so that the semiconductor device is free from occurrence of a source offset.
Abstract:
In a method of fabricating a semiconductor device having a MISFET of trench gate structure, a trench is formed from a major surface of a semiconductor layer of first conductivity type which serves as a drain region, in a depth direction of the direction of the semiconductor layer, a gate insulating film including a thermal oxide film and a deposited film is formed over the internal surface of the trench, and after a gate electrode has been formed in the trench, impurities are introduced into the semiconductor substrate of first conductivity type to form a semiconductor region of second conductivity type which serves as a channel forming region, and impurities are introduced into the semiconductor region of second conductivity type to form the semiconductor region of first conductivity type which serves as a source region.
Abstract:
A semiconductor device includes memory cells each having an MISFET for memory selection formed on one major surface of a semiconductor substrate and a capacitive element comprised of a lower electrode electrically connected at a bottom portion to one of a source and drain of the MISFET for memory selection via a first metal layer and an upper electrode formed on the lower electrode via a capacitive insulating film. The lower electrode has a thickness of 30 nm or greater at the bottom portion thereof. Sputtering with a high ionization ratio and high directivity, such as PCM, is adapted to the formation of the lower electrode to make only the bottom portion of a capacitor thicker.
Abstract:
In a conventional level conversion circuit, the variation of output signals from a low level to a high level is slower than that from a high level to a low level. As a consequence, on the part of a circuit receiving signals from such a level conversion circuit, signals have to be accepted at the later signal timing, resulting in the problems of more complex timing design and of a longer time taken by signal transmission, which impedes raising the system speed. The configuration is such that a level conversion circuit is composed of a level shift circuit for supplying a level-converted signal in the same phase as the input signal and a signal in the reverse phase thereto and a follow-up circuit responsive to the earlier of the output signals of the level shift circuit for generating an output signal, wherein the follow-up circuit consists of an inverter circuit in which two p-channel type MOS transistors and two n-channel type MOS transistors are connected in series between a first voltage terminal and a second voltage terminal, of which one pair is used as input transistors and the remaining pair of transistors are subjected to feedback based on the output signal of the level shift circuit to be quickly responsive to the next variation.
Abstract:
A semiconductor memory device is capable of performing a faster operation by reducing a load applied to a subword selection line or driving a subword driver provided for each memory mat. In a drive method of subword drivers that are actuated in response to subword selection signals supplied through subword selection lines, the subword selection lines are branched according to the number of memory mats. Each subword selection signal has a polarity to a branching position and an inverted polarity from each branching position to each subword driver. The inverted subword selection signal together with a main word signal are calculated to operation in each subword driver and output as a subword drive signal. The plurality of subword drivers share an inverter circuit for inverting the main word signals so as to permit a simplified circuit configuration.
Abstract:
A first object of the present invention is to provide an insulated gate field effect transistor which realizes reductions in the junction depth and the resistance of source and drain junction regions beneath a gate electrode. Another object is to provide a miniaturized complementary type insulated gate field effect transistor capable of achieving a large current and a high operation speed. In a miniaturized MOS transistor, a low concentration impurity integrated layer comprising In or Ga is provided so as to have a peak in the inside of high concentration shallow source and drain diffusion layer regions. By this arrangement, the shallow source and drain diffusion layers are attracted by the impurity integrated layer, to realize shallower junctions having a high concentration and a rectangular distribution. As a result, particularly, a miniaturized PMOS with a larger current punch-through hard and an ultra miniaturized configuration is achieved, and this can be applied also to NMOS, and, therefore, a CMOS with a larger current, punch-through hard and a more miniaturized configuration can be achieved without complicating the fabrication steps, namely, economically.
Abstract:
An address-counter control system includes a counter circuit, path switches, and a control circuit. The counter circuit includes a first series of address counters which corresponds to a non-contiguous region portion and second and third series of address counters which correspond to respective contiguous region portions and which are located at two opposite ends of the first series of address counters. The path switches are provided at connection paths between the second and the third series of address counters. The path switches disconnect the first series of address counters and directly connect the second and third series of address counters or disconnect the direct connection between the second and third series of address counters and connect the first series of address counters to and between the second and the third series of address counters. The control circuit control the path switches.
Abstract:
A system and method are provided for using dynamic random access memory and flash memory. In one example, the memory system comprises a nonvolatile memory; synchronous dynamic random access memories; circuits including a control circuit which is coupled with the nonvolatile memory and the synchronous dynamic random access memories, and controls accesses to the nonvolatile memory and the synchronous dynamic random access memories; and a plurality of input/output terminals coupled with the circuits, wherein in data transfer from the nonvolatile memory to the synchronous dynamic random access memories, error corrected data is transferred.