公开(公告)号：US09699904B2

公开(公告)日：2017-07-04

申请号：US13993343

申请日：2012-03-13

Applicant: Howe Yin Loo ,  Choong Kooi Chee

Inventor： Howe Yin Loo ,  Choong Kooi Chee

IPC: H05K7/10 ,  H05K1/18 ,  H01L23/13 ,  H01L23/367 ,  H01L23/498 ,  H01L25/065 ,  H05K3/30 ,  H01L23/427 ,  H05K1/14 ,  H05K3/34

CPC classification number: H05K1/181 ,  H01L23/13 ,  H01L23/3677 ,  H01L23/427 ,  H01L23/49827 ,  H01L25/0652 ,  H01L2224/16 ,  H01L2225/06517 ,  H01L2225/0652 ,  H05K1/141 ,  H05K1/144 ,  H05K3/30 ,  H05K3/3415 ,  H05K2201/10378 ,  Y10T29/4913

Abstract: The present description relates to the field of fabricating microelectronic structures. The microelectronic structure may include a microelectronic substrate have an opening, wherein the opening may be formed through the microelectronic substrate or may be a recess formed in the microelectronic substrate. A microelectronic package may be attached to the microelectronic substrate, wherein the microelectronic package may include an interposer having a first surface and an opposing second surface. A microelectronic device may be attached to the interposer first surface and the interposer may be attached to the microelectronic substrate by the interposer first surface such that the microelectronic device extends into the opening. At least one secondary microelectronic device may be attached to the interposer second surface.

公开(公告)号：US20140293563A1

公开(公告)日：2014-10-02

申请号：US13993343

申请日：2012-03-13

Applicant: Howe Yin Loo ,  Choong Kooi Chee

Inventor： Howe Yin Loo ,  Choong Kooi Chee

IPC: H05K1/18 ,  H05K3/30

CPC classification number: H05K1/181 ,  H01L23/13 ,  H01L23/3677 ,  H01L23/427 ,  H01L23/49827 ,  H01L25/0652 ,  H01L2224/16 ,  H01L2225/06517 ,  H01L2225/0652 ,  H05K1/141 ,  H05K1/144 ,  H05K3/30 ,  H05K3/3415 ,  H05K2201/10378 ,  Y10T29/4913

Abstract: The present description relates to the field of fabricating microelectronic structures. The microelectronic structure may include a microelectronic substrate have an opening, wherein the opening may be formed through the microelectronic substrate or may be a recess formed in the microelectronic substrate. A microelectronic package may be attached to the microelectronic substrate, wherein the microelectronic package may include an interposer having a first surface and an opposing second surface. A microelectronic device may be attached to the interposer first surface and the interposer may be attached to the microelectronic substrate by the interposer first surface such that the microelectronic device extends into the opening. At least one secondary microelectronic device may be attached to the interposer second surface.

Abstract translation: 本说明书涉及制造微电子结构的领域。 微电子结构可以包括具有开口的微电子衬底，其中开口可以通过微电子衬底形成，或者可以是在微电子衬底中形成的凹部。 微电子封装可以附接到微电子衬底，其中微电子封装可以包括具有第一表面和相对的第二表面的插入件。 微电子器件可以附接到插入器第一表面，并且插入器可以通过插入器第一表面附接到微电子衬底，使得微电子器件延伸到开口中。 至少一个次级微电子器件可以附接到插入件第二表面。

公开(公告)号：US20190206698A1

公开(公告)日：2019-07-04

申请号：US16325665

申请日：2016-09-27

Applicant: Bok Eng CHEAH ,  Min Suet LIM ,  Jackson Chung Peng KONG ,  Howe Yin LOO ,  Intel Corporation

Inventor： Bok Eng Cheah ,  Min Suet Lim ,  Jackson Chung Peng Kong ,  Howe Yin Loo

IPC: H01L21/48 ,  H01L23/48 ,  H01L23/538 ,  H01L23/552 ,  H01L25/065 ,  H01L25/00 ,  H01L29/06

CPC classification number: H01L21/48 ,  H01L23/00 ,  H01L23/48 ,  H01L23/538 ,  H01L23/552 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/18 ,  H01L25/50 ,  H01L29/0657 ,  H01L2224/13025 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/17181 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/3025

Abstract: A system in package device includes a landed first die disposed on a package substrate. The landed first die includes a notch that is contoured and that opens the backside surface of the die to a ledge. A stacked die is mounted at the ledge and the two dice are each contacted by a through-silicon via (TSV). The system in package device also includes a landed subsequent die on the package substrate and a contoured notch in the landed subsequent die and the notch in the first die form a composite contoured recess into which the stacked die is seated.

公开(公告)号：US10943792B2

公开(公告)日：2021-03-09

申请号：US16325665

申请日：2016-09-27

Applicant: Intel Corporation ,  Bok Eng Cheah ,  Min Suet Lim ,  Jackson Chung Peng Kong ,  Howe Yin Loo

Inventor： Bok Eng Cheah ,  Min Suet Lim ,  Jackson Chung Peng Kong ,  Howe Yin Loo

IPC: H01L25/00 ,  H01L21/48 ,  H01L23/48 ,  H01L23/538 ,  H01L23/552 ,  H01L25/065 ,  H01L29/06 ,  H01L23/00 ,  H01L25/18

Abstract: A system in package device includes a landed first die disposed on a package substrate. The landed first die includes a notch that is contoured and that opens the backside surface of the die to a ledge. A stacked die is mounted at the ledge and the two dice are each contacted by a through-silicon via (TSV). The system in package device also includes a landed subsequent die on the package substrate and a contoured notch in the landed subsequent die and the notch in the first die form a composite contoured recess into which the stacked die is seated.

公开(公告)号：US20150277506A1

公开(公告)日：2015-10-01

申请号：US14229835

申请日：2014-03-29

Applicant: Bok Eng Cheah ,  Howe Yin Loo ,  Min Suet Lim ,  Jackson Chung Peng Kong ,  Poh Tat Oh

Inventor： Bok Eng Cheah ,  Howe Yin Loo ,  Min Suet Lim ,  Jackson Chung Peng Kong ,  Poh Tat Oh

IPC: G06F1/16

Abstract: Particular embodiments described herein provide for an electronic device, such as a notebook computer or laptop, which includes a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). One particular example implementation of the electronic device may include a low profile hinge design that includes a micro-hinge. The micro-hinge can couple a first element to a second element and can include a first attachment that couples to the first element, a second attachment that couples to the second element, and a plurality of linkages that couples the first attachment to the second attachment. The low profile hinge can further include a plurality of micro-hinges and a plurality of support rods.

Abstract translation: 本文描述的特定实施例提供了一种诸如笔记本计算机或笔记本电脑的电子设备，其包括耦合到多个电子部件（其包括任何类型的部件，元件，电路等）的电路板。 电子设备的一个具体实施例可以包括包括微铰链的低轮廓铰链设计。 微铰链可以将第一元件耦合到第二元件并且可以包括耦合到第一元件的第一连接件，耦合到第二元件的第二连接件和将第一附件耦合到第二附件的多个连接件 。 小型铰链还可以包括多个微铰链和多个支撑杆。