公开(公告)号：JP2010080919A

公开(公告)日：2010-04-08

申请号：JP2009156088

申请日：2009-06-30

Applicant: Intevac Inc ,  インテヴァック インコーポレイテッド

Inventor： BARNES MICHAEL S ,  BLUCK TERRY

IPC: H01L21/3065 ,  C23F4/00 ,  H01L21/677 ,  H01L31/04

CPC classification number: H01L21/67225 ,  H01L21/67155 ,  H01L31/18

Abstract: PROBLEM TO BE SOLVED: To provide an apparatus and methods that manufacture patterned layers on a substrate using a detachable mask. SOLUTION: Unlike prior art where the mask is formed directly over the substrate, the mask 110 is formed independently of the substrate 105. During use, the mask 110 is positioned in close proximity or in contact with the substrate 105 so as to expose only portions of the substrate 105 to processing, e.g., deposition, sputtering or etch. Once the processing is completed, the mask 110 is moved away from the substrate 105 and may be discarded or used for another substrate 105. The mask 110 may be cycled for a given number of substrates 105 and then be removed for cleaning or disposal. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种使用可拆卸掩模在衬底上制造图案化层的设备和方法。 解决方案：与掩模直接形成在衬底上的现有技术不同，掩模110独立于衬底105形成。在使用期间，掩模110位于与衬底105紧密接近或接触的位置，以便 仅暴露衬底105的一部分以进行处理，例如沉积，溅射或蚀刻。 一旦处理完成，掩模110被移动离开基板105，并且可以被丢弃或用于另一基板105.掩模110可以循环给定数量的基板105，然后被移除以进行清洁或处置。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2009158917A

公开(公告)日：2009-07-16

申请号：JP2008241299

申请日：2008-09-19

Applicant: Intevac Inc ,  インテバック・インコーポレイテッドIntevac Incorporated

Inventor： SAMIR TUGRUL ,  BLUCK TERRY ,  GRIMARD DENNIS

IPC: H01L21/683 ,  B23K26/38 ,  B23Q3/15 ,  H01L21/3065 ,  H02N13/00

CPC classification number: H01L21/6831

Abstract: PROBLEM TO BE SOLVED: To provide an electrostatic chuck having surface embossments pattern for effectively balancing a uniform distribution of a backside gas, and gas-phase heat transfer and solid contact heat transfer. SOLUTION: The electrostatic chuck includes an angled conduit, or an angled laser drilled passage, through which a heat transfer gas is provided. A segment of the angled conduit and/or the angled laser drilled passage extends along an axis different from an axis of the electric field generated to hold a substrate to the chuck, thereby minimizing plasma arcing and backside gas ionization. A first plug may be inserted into the conduit, wherein a segment of a first exterior channel thereof extends along an axis different from an axis of the electric field. A first and a second plug may be inserted into a ceramic sleeve which extends through at least one of the dielectric member and the electrode. Finally, the surface of the dielectric member may comprise embossments arranged at radial distances from the center of the dielectric member so as to improve heat transfer and gas distribution. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供具有表面压花图案的静电卡盘，用于有效平衡背侧气体的均匀分布，以及气相热传递和固体接触热传递。 解决方案：静电卡盘包括成角度的导管或倾斜的激光钻孔通道，通过该通道提供传热气体。 成角度的管道和/或成角度的激光钻孔通道的一段沿着不同于将基板保持在卡盘上的电场的轴线不同的轴线延伸，从而最小化等离子体电弧放电和背侧气体电离。 第一塞子可以插入导管中，其中第一外部通道的一段沿着不同于电场的轴线的轴线延伸。 可以将第一和第二插头插入延伸穿过电介质构件和电极中的至少一个的陶瓷套管中。 最后，电介质构件的表面可以包括布置在离电介质构件的中心的径向距离处的凸起，以便改善传热和气体分布。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2009071180A

公开(公告)日：2009-04-02

申请号：JP2007239922

申请日：2007-09-14

Applicant: Intevac Inc ,  インテヴァック インコーポレイテッド

Inventor： BLUCK TERRY ,  FAIRBAIRN KEVIN P ,  BARNES MICHAEL S ,  LANE CHRISTOPHER T

IPC: H01L21/677

Abstract: PROBLEM TO BE SOLVED: To provide a device and a method for conveying and processing substrates inclusive of wafers adapted to allow efficient production at a reasonable cost and also having an improved throughput, as compared to systems in use today. SOLUTION: A key constituent feature is use of a conveying chamber, which feeds substrates into a controlled atmosphere along the sides of processing chambers through a load lock and then along a conveying chamber that performs as a means for carrying the substrates to reach the processing chambers, and subsequently to processing within the processing chambers, releases the substrates to the exterior of the controlled atmosphere. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：与目前使用的系统相比，提供一种用于输送和处理包括晶片的衬底的装置和方法，其适于允许以合理的成本有效地生产并且还具有改善的生产量。 解决方案：一个关键的组成特征是使用输送室，其通过负载锁将基板沿着处理室的侧面输送到受控气氛中，然后沿着作为承载基板达到的装置的输送室 处理室，随后在处理室内进行处理，将基板释放到受控气氛的外部。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JPH0794139A

公开(公告)日：1995-04-07

申请号：JP19588592

申请日：1992-07-01

Applicant: INTEVAC INC

Inventor： BUERURE DABURIYUU IIBI ,  KENESU EE KOSUTERO

IPC: H01J9/12 ,  H01J31/50 ,  H01J43/24

Abstract: PURPOSE: To limit feedback of ions or neutral particles by having an output electrode, consisting of a number of channels and a conductive layer, isolate at least 10% of an opening region of an output end of The channels. CONSTITUTION: An output electrode 126 that is aluminum is evaporated onto an output surface of a microchannel plate MCP116, so that an open region of a channel 128 formed by a channel wall 130 is substantially isolated. AN MCP output channel region is reduced by at least 10% and preferably is substantially reduced by 75 to 85% by thickening a metalization layer of the MCP output electrode much more than conventionally. For example, during MCP rotation, an electrode substance is supplied at an incident angel of 60 to 70 degrees with respect to MCP, and a channel output open region is reduced by about 25% more than a conventionally generated open region. Thereby, a rate at which a photon or aN electric load, or neutral particle pass through a plate is reduced by similar percentages.

公开(公告)号：JPH04293771A

公开(公告)日：1992-10-19

申请号：JP35396891

申请日：1991-12-19

Applicant: INTEVAC INC

Inventor： JIYON RESUTAA HIYUUZU

IPC: C23C14/34 ,  H01J37/34

公开(公告)号：JP2011091361A

公开(公告)日：2011-05-06

申请号：JP2010149236

申请日：2010-06-30

Applicant: Intevac Inc ,  インテヴァック インコーポレイテッド

Inventor： BLUCK TERRY ,  PEDERSON TERRY ,  GRIMARD DENNIS

IPC: H01L21/683 ,  B23Q3/15 ,  H02N13/00

CPC classification number: H01L21/6831

Abstract: PROBLEM TO BE SOLVED: To provide an electrostatic chuck assembly capable of reducing formation of plasma in the inside of an electrostatic chuck or its circumference, for example, in an opening penetrating the electrostatic chuck assembly, and a duct or its circumference while supplying a sufficient quantity of heat exchange gas to a substrate. SOLUTION: An isolator for a heat exchange gas conduit of this electrostatic chuck is disclosed. The isolator 300 includes a sleeve 304 and a body 308 arranged in the sleeve 304 for forming an annulus 312 for running the heat exchange gas between the sleeve 304 and itself. The body 308 is arranged in contact with a dielectric pack 111 of the electrostatic chuck, and may be supported in this position by a spring 328. A silicon seal 334 may be provided between the sleeve 304 and the pack 111 to prevent plasma from being formed in the conduit. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：提供一种能够减少静电卡盘或其周边内部的等离子体形成的静电卡盘组件，例如在穿过静电卡盘组件的开口以及导管或其圆周上，同时 向基板供应足够量的热交换气体。 解决方案：公开了一种用于该静电卡盘的热交换气体导管的隔离器。 隔离器300包括套筒304和布置在套筒304中的主体308，用于形成用于在套筒304和本身之间运行热交换气体的环带312。 主体308布置成与静电卡盘的电介质组111接触，并且可以通过弹簧328被支撑在该位置。硅密封件334可以设置在套筒304和包装件111之间，以防止形成等离子体 在导管中。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2010199517A

公开(公告)日：2010-09-09

申请号：JP2009046027

申请日：2009-02-27

Applicant: Intevac Inc ,  インテバック・インコーポレイテッドIntevac Incorporated

Inventor： BLUCK TERRY ,  FAIRBAIRN KEVIN P ,  BARNES MICHAEL S ,  LANE CHRISTOPHER T

IPC: H01L21/677 ,  C23C14/56 ,  C23C16/44 ,  H01L21/02 ,  H01L21/203 ,  H01L21/205 ,  H01L21/3065

Abstract: PROBLEM TO BE SOLVED: To provide an apparatus and a method for carrying and processing substrates including wafers in a small footprint. SOLUTION: A linear carrying chamber 1232 includes a linear track, a robot arm 1243 or the like mounted on the linear track, and carries substrates linearly along the side of a process chamber 1201 or the like. Also, it allows the substrates to reach the process chamber 1201 or the like through a load lock 1235 and supplies the substrates into a controlled atmosphere along the carrying chamber 1232. Consequently, manufacture can be efficiently performed at a reasonable cost and with improved throughput. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种在小占地面积中承载和处理包括晶片的基板的装置和方法。 解决方案：线性承载室1232包括安装在线性轨道上的线性轨道，机器人臂1243等，并且沿着处理室1201等的侧面线性地承载衬底。 此外，它允许衬底通过负载锁1235到达处理室1201等，并且将衬底沿着承载室1232供应到受控气氛中。因此，可以以合理的成本并且具有改善的生产量来有效地进行制造。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2010118136A

公开(公告)日：2010-05-27

申请号：JP2009241264

申请日：2009-10-20

Applicant: Intevac Inc ,  インテヴァック インコーポレイテッド

Inventor： SU REN ,  PETERSEN CARL T ,  LIU CHARLES

IPC: G11B5/84 ,  H01L21/027

CPC classification number: H01L21/67736 ,  B82Y10/00 ,  B82Y40/00 ,  C23C16/54 ,  G03F7/0002 ,  G11B5/85 ,  G11B5/855 ,  H01L21/67225 ,  H01L21/67754

Abstract: PROBLEM TO BE SOLVED: To provide a method and a system for enabling fabrication of hard disks to provide patterned media for HDD.
SOLUTION: A scalable, high-throughput nanoimprint lithography priming tool includes a dual-reactant chemical vapor deposition reactor chamber, a mandrel configured to hold a plurality of hard disks at an inner diameter of the hard disks, and a transport mechanism to move the plurality of hard disks into and out of the chamber. The tool may also include a transfer tool to transfer the plurality of hard disks to additional chambers for processing.
COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种能够制造硬盘以提供用于HDD的图案化介质的方法和系统。 解决方案：可扩展的高通量纳米压印光刻引发工具包括双反应物化学气相沉积反应室，心轴构造成将多个硬盘保持在硬盘的内径，以及传送机构， 将多个硬盘移入和移出室。 该工具还可以包括用于将多个硬盘传送到另外的室进行处理的转移工具。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2009152599A

公开(公告)日：2009-07-09

申请号：JP2008319137

申请日：2008-12-16

Applicant: Intevac Inc ,  インテバック・インコーポレイテッドIntevac Incorporated

Inventor： HUANG JUDY ,  BARNES MICHAEL S ,  BLUCK TERRY

IPC: H01L21/304 ,  C23C16/44 ,  H01L21/205 ,  H01L21/3065

CPC classification number: C23C16/4405 ,  H01J37/32082 ,  H01J37/32192 ,  H01J37/32862

Abstract: PROBLEM TO BE SOLVED: To provide a substrate processing chamber for processing substrates such as semiconductor wafers, flat panel substrates, solar panels, etc., including mechanism for in-situ plasma cleaning.
SOLUTION: The chamber body has at least one plasma source opening provided on its sidewall. A movable substrate holder is situated within the chamber body, the substrate holder is situated at a first position wherein the substrate is positioned below the plasma source opening for in-situ plasma cleaning of the chamber, and a second position wherein the substrate is positioned above the plasma source opening for substrate processing. A plasma energy source is coupled to the plasma source opening.
COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供用于处理诸如半导体晶片，平板基板，太阳能电池板等基板的基板处理室，包括用于原位等离子体清洗的机构。 解决方案：腔体具有设置在其侧壁上的至少一个等离子体源开口。 可移动衬底保持器位于腔室内，衬底保持器位于第一位置，其中衬底位于等离子体源开口下方，用于腔室的原位等离子体清洗，以及第二位置，其中衬底位于 用于衬底处理的等离子体源开口。 等离子体能源耦合到等离子体源开口。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2008266790A

公开(公告)日：2008-11-06

申请号：JP2008086162

申请日：2008-03-28

Applicant: Intevac Inc ,  インテヴァック インコーポレイテッド

Inventor： PETERSEN CARL ,  AMES KENNETH

IPC: C23C14/24 ,  G11B5/84

CPC classification number: G11B5/8408

Abstract: PROBLEM TO BE SOLVED: To provide a method and an apparatus for applying a lubricant vapor to a hard magnetic disk.
SOLUTION: Lubricant coatings are applied as lubricant vapor to magnetic disks 18 in a lubricant vapor flow path between the disks 18 and a reservoir 24 for liquid lubricant that is heated to the vapor. The flow path includes a vapor chamber 26 between the reservoir 24, an apertured diffuser 30, and a shutter 28 for selectively and simultaneously unblocking and blocking the flow path. While the shutter 28 is closed, lubricant vapor is confined in the vapor chamber 26. While the shutter 28 is open, the lubricant vapor flows via the flow path from the reservoir 24 to the holder 16. During substantial lulls in applying disks 18 to the flow path, the shutter 28 is closed and vaporizing heat is applied to the liquid lubricant, so that pressure in the vapor chamber 26 causes the volume of liquid in the reservoir 24 to remain substantially constant.
COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供一种将润滑剂蒸气施加到硬磁盘的方法和装置。 解决方案：将润滑剂涂料作为润滑剂蒸汽施加到磁盘18之间的润滑剂蒸汽流动通道中，该润滑剂蒸汽流路在盘18和用于被加热到蒸汽的液体润滑剂之间的储存器24中。 流动路径包括在储存器24，有孔扩散器30和快门28之间的蒸气室26，用于选择性地并且同时地解除阻塞和阻塞流动路径。 当闸门28关闭时，润滑剂蒸气被限制在蒸气室26中。当闸门28打开时，润滑剂蒸汽经由流动路径从储存器24流动到支架16.在将盘18应用到 开闭器28关闭，汽化热被施加到液体润滑剂，使得蒸气室26中的压力导致贮存器24中的液体体积基本保持不变。 版权所有（C）2009，JPO＆INPIT