公开(公告)号：JP4359657B2

公开(公告)日：2009-11-04

申请号：JP2006508027

申请日：2004-04-21

Applicant: ヨンデテック アーベーJonDeTech AB

Inventor： イェラン エーバルド マルタン、ハンス ,  アンデシュ ヨルト、クラス ,  ペーター エリック リンドベルク、ミカエル

IPC: H05K1/11 ,  G01J3/02 ,  H05K3/00 ,  H05K3/14 ,  H05K3/40

CPC classification number: H05K3/0041 ,  G01K2211/00 ,  H01L2924/0002 ,  H05K1/115 ,  H05K3/002 ,  H05K2201/09609 ,  H05K2201/0979 ,  H05K2203/092 ,  H01L2924/00

公开(公告)号：AT524956T

公开(公告)日：2011-09-15

申请号：AT04728728

申请日：2004-04-21

Applicant: JONDETECH AB

Inventor： MARTIN HANS GOERAN EVALD ,  HJORT KLAS ANDERS ,  LINDBERG MIKAEL PETER ERIK

IPC: H05K3/18 ,  H05K1/11 ,  H05K3/00

Abstract: The present invention comprises a processed thin film substrate ( 10 ) and a method therefore, in order to produce a flexible printed circuit card, having a plurality of microvias going or passing through the thin film substrate and electrically connected along faced-away surfaces, in order to form an electric circuit. A first a number of real nano-tracks are filled with a first material (M 1 ), having good electric properties, for the formation of a first number of, here denominated, first vias (V 10 , V 30 , V 50 ), that a second number of real nano-tracks are filled with a second material (M 2 ), having good electric properties, for the formation of a second number of, here denominated, second vias (V 20 , V 40 , V 60 ). The first material (M 1 ) and the second material (M 2 ) of said first and second vias (V 10 -V 60 ) are chosen having mutually different thermoelectric properties. A material surface-applied to the thin film substrate, coated on both sides ( 10 a , 10 b) of the thin film substrate ( 10 ), is distributed and/or adapted in order to allow the electrical interconnection of first vias, allocated the first material (M 1 ), with second vias, allocated the second material (M 2 ), and that a first via (V 10 ) included in a series connection and a last via (V 60 ) included in the series connection are serially co-ordinated in order to form an electric thermocouple ( 100 ) or other circuit arrangement.

公开(公告)号：EP1621054B1

公开(公告)日：2011-09-14

申请号：EP04728728.9

申请日：2004-04-21

Applicant: JonDeTech AB

Inventor： MARTIN, Hans Göran Evald ,  HJORT, Klas Anders ,  LINDBERG, Mikael Peter Erik

IPC: H05K3/18

CPC classification number: H05K3/0041 ,  G01K2211/00 ,  H01L2924/0002 ,  H05K1/115 ,  H05K3/002 ,  H05K2201/09609 ,  H05K2201/0979 ,  H05K2203/092 ,  H01L2924/00

Abstract: The present invention comprises a processed thin film substrate (10) and a method therefore, in order to produce a flexible printed circuit card, having a plurality of microvias going or passing through the thin film substrate and electrically connected along faced-away surfaces, in order to form an electric circuit. A first a number of real nano-tracks are filled with a first material (M1), having good electric properties, for the formation of a first number of, here denominated, first vias (V10, V30, V50), that a second number of real nano-tracks are filled with a second material (M2), having good electric properties, for the formation of a second number of, here denominated, second vias (V20, V40, V60). The first material (M1) and the second material (M2) of said first and second vias (V10-V60) are chosen having mutually different thermoelectric properties. A material surface-applied to the thin film substrate, coated on both sides (10a, 10b) of the thin film substrate (10), is distributed and/or adapted in order to allow the electrical interconnection of first vias, allocated the first material (M1), with second vias, allocated the second material (M2), and that a first via (V10) included in a series connection and a last via (V60) included in the series connection are serially co-ordinated in order to form an electric thermocouple (100) or other circuit arrangement.