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    LINKER COMPOUND, LIGAND COMPLEX AND PROCESS FOR PRODUCING THEM
    1.
    发明专利
    LINKER COMPOUND, LIGAND COMPLEX AND PROCESS FOR PRODUCING THEM 未知

    公开(公告)号：CA2559962C

    公开(公告)日：2011-03-15

    申请号：CA2559962

    申请日：2005-02-04

    Applicant: JAPAN SCIENCE & TECH AGENCY ,  NAT UNIVERSITY CORP KAGOSHIMA UNIVERSITY

    Inventor： SUDA YASUO ,  ARANO AKIO ,  KUSUMOTO SHOICHI ,  SOBEL MICHAEL ,  WAKAO MASAHIRO

    IPC: C07D339/04 ,  C07H15/04 ,  G01N33/543

    Abstract: The present invention provides a novel linker compound which minimizes any nonspecific hydrophobic interactions and is capable of easily adjusting the length to a disulfide group subjected to metal bond to thereby enable effective formation of a metal-sulfur bond; novel ligand conjugate and ligand carrier, and a process for producing them. The linker compound is of a structure represented by the following general formula (1) (see formula 1) where a, b, d, e are independently an integer of 0 to 6. X has a structure serving as a multi-branched structure moiety including three or more hydrocarbon derivative chains, wherein the hydrocarbon derivative chains each include an aromatic amino group at an end thereof, and may or may not include a carbon-nitrogen bond in a main chain thereof. The ligand conjugate includes the linker compound having a sugar molecule introduced therein.

    HEAT PIPE AND ELECTRONIC DEVICE
    7.
    发明申请
    HEAT PIPE AND ELECTRONIC DEVICE 审中-公开

    公开(公告)号：WO2010026486A3

    公开(公告)日：2010-03-11

    申请号：PCT/IB2009/006920

    申请日：2009-09-08

    Applicant: MOLEX KIIRE CO., LTD. ,  KAGOSHIMA UNIVERSITY ,  TSURUTA, Katsuya ,  FUKUNAGA, Rinkou ,  KOTANI, Toshiaki ,  MIZUTA, Kei

    Inventor： TSURUTA, Katsuya ,  FUKUNAGA, Rinkou ,  KOTANI, Toshiaki ,  MIZUTA, Kei

    IPC: H01L23/427 ,  F28D15/02 ,  F28D15/04

    Abstract: The Present Invention provides a heat pipe and an electronic device which can efficiently cool a light emitting element arranged in an end portion, so that it is possible to efficiently mount the heat pipe in a narrow space. The heat pipe is provided with an upper plate (3), a lower plate (4) opposing the upper plate (3), one intermediate plate or a plurality of intermediate plates (5) laminated between the upper plate (3) and the lower plate (4), a main body portion (2) formed by lamination of the upper plate (3), the lower plate (4) and the intermediate plate (5) and capable of sealing a cooling medium, a vapor diffusion path (6) capable of diffusing a vaporized cooling medium, and a capillary flow path (7) capable of reflowing a condensed cooling medium, and the vapor diffusion path (6) is formed from a first end portion (15) of the main body portion toward a second end portion (16) opposing the first end portion (15).

    照明裝置
    9.
    发明专利
    照明裝置 审中-公开
    照明设备

    公开(公告)号：TW201326665A

    公开(公告)日：2013-07-01

    申请号：TW101150594

    申请日：2012-12-27

    Applicant: 日本莫仕股份有限公司 ,  MOLEX JAPAN CO., LTD. ,  日本國立大學法人鹿兒島大學 ,  KAGOSHIMA UNIVERSITY

    Inventor： 水田敬 ,  MIZUTA, KEI ,  福永倫康 ,  FUKUNAGA, RINKOU ,  鶴田克也 ,  TSURUTA, KATSUYA ,  濱崎浩史 ,  MAMASAKI, HIROSHI ,  田村英男 ,  TAMURA, HIDEO

    IPC: F21V29/00

    Abstract: 提供一種小型、重量輕且可以高亮度發光的照明裝置。在照明裝置(1)中，包括：發光單元(2)；導熱板(6)，其與發光單元(2)傳熱地接觸，擴散從發光單元(2)傳來的熱；熱管(9)，其一端與導熱板(6)傳熱地接觸，把熱從上述一端輸送到另一端；以及下部冷卻片列(10)和上部冷卻片列(11)，其與熱管(9)的另一端傳熱地接觸，把從熱管(9)傳來的熱發散到環境中。

    Abstract in simplified Chinese: 提供一种小型、重量轻且可以高亮度发光的照明设备。在照明设备(1)中，包括：发光单元(2)；导热板(6)，其与发光单元(2)传热地接触，扩散从发光单元(2)传来的热；热管(9)，其一端与导热板(6)传热地接触，把热从上述一端输送到另一端；以及下部冷却片列(10)和上部冷却片列(11)，其与热管(9)的另一端传热地接触，把从热管(9)传来的热发散到环境中。

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