公开(公告)号：EP0818814A3

公开(公告)日：1999-02-24

申请号：EP97305036.2

申请日：1997-07-09

Applicant: KLA INSTRUMENTS CORP.

Inventor： Bareket, Noah

IPC: H01L21/66

CPC classification number: G03F7/70633 ,  H01L22/12 ,  H01L22/34

Abstract: The present invention is a new target, and associated apparatus and methods, for determining offset between adjacent layers of a semiconductor device. The target disclosed here includes a first periodic structure to be placed on a first layer of the device and a second periodic structure, that complements the first periodic structure, placed on a second layer of the device at a location that is adjacent the first periodic structure when the second layer is placed on the first layer. Any offset that may occur is detected by the present invention either optically, micro-mechanically or with electron beams using any of various methods and system embodiments.

公开(公告)号：EP0426182A3

公开(公告)日：1992-01-08

申请号：EP90120956.9

申请日：1990-10-31

Applicant: KLA INSTRUMENTS CORP.

Inventor： Chadwick, Curt H. ,  Sholes, Robert H. ,  Greene, John D. ,  Tucker, Francis D., III ,  Fein, Michael E. ,  Jann, P. C. ,  Harvey, David J. ,  Bell, William

IPC: G01N21/88 ,  G01R31/308 ,  G06F15/62 ,  G01R31/00

CPC classification number: G01R31/308 ,  G01N21/64 ,  G01N21/956 ,  G01N21/95607 ,  G01N2021/8887 ,  G01N2021/95615 ,  G01N2021/95638 ,  G01N2201/06126 ,  G01N2201/0826

Abstract: Methods and apparatus for inspecting surface features of a substrate. In each configuration, at least one TDI sensor is used to image the portions of interest of the substrate, with those portions illuminated either with substantially uniform illumination or critical illumination. In one configuration, a substrate, is compared to the expected characteristic features prestored in a memory. In a second configuration, a first and second pattern in a region of the surface of at least one substrate are inspected by comparing one pattern against the other and noting whether they agree with each other without the prestoring of an expected pattern. This is accomplished by illuminating at least the two patterns, imaging the first pattern and storing its characteristics in a temporary memory, then imaging the second pattern and comparing it to the stored characteristics from the temporary memory. Here, the comparison reveals whether the two patterns agree or not. Then the comparisons continue sequentially with the second pattern becoming the first pattern in the next imaging/comparison sequence against a new second pattern. Each time the comparison is performed, it is noted whether or not there has been agreement between the two patterns and which two patterns where compared. After all of the patterns are sequentially compared, the bad ones are identified by identifying those that did not compare with other patterns in the test process. This inspection technique is useful for doing die-to-die inspections, as well as repeating pattern inspections within the same die. A variation of the second configuration uses two TDI sensors to simultaneously image the first and second patterns, thus eliminating the need for the temporary memory. In this configuration, the two patterns are simultaneous imaged and compared, then additional patterns are compared sequentially, in the same manner with the results of the comparisons and the pattern locations stored determine which patterns are bad when the inspection of all patterns is completed.

公开(公告)号：EP0426166B1

公开(公告)日：1996-08-28

申请号：EP90120932.0

申请日：1990-10-31

Applicant: KLA INSTRUMENTS CORP.

Inventor： Chadwick, Curt H. ,  Sholes, Robert H. ,  Greene, John D. ,  Tucker, Francis D. III ,  Fein, Michael E. ,  Jann, P.C. ,  Harvey, David J. ,  Bell, William

IPC: G01N21/88 ,  G01R31/308 ,  G06T7/60

CPC classification number: G01N21/8806 ,  G01N21/956 ,  G01N21/95607 ,  G01N2021/8907 ,  G01N2021/8908 ,  G01N2021/95615 ,  G01N2021/95638 ,  G01N2201/06126 ,  G01R31/309 ,  G01R31/311

公开(公告)号：EP0426166A3

公开(公告)日：1992-01-08

申请号：EP90120932.0

申请日：1990-10-31

Applicant: KLA INSTRUMENTS CORP.

Inventor： Chadwick, Curt H. ,  Sholes, Robert H. ,  Greene, John D. ,  Tucker, Francis D. III ,  Fein, Michael E. ,  Jann, P.C. ,  Harvey, David J. ,  Bell, William

IPC: G01N21/88 ,  G01R31/308 ,  G06T7/60

CPC classification number: G01N21/8806 ,  G01N21/956 ,  G01N21/95607 ,  G01N2021/8907 ,  G01N2021/8908 ,  G01N2021/95615 ,  G01N2021/95638 ,  G01N2201/06126 ,  G01R31/309 ,  G01R31/311

Abstract: Methods and apparatus for inspecting surface features of a substrate. In each configuration, at least one TDI sensor is used to image the portions of interest of the substrate, with those portions illuminated either with substantially uniform illumination. In one configuration, a substrate is compared to the expected characteristic features prestored in a memory. In a second configuration, a first and second pattern in a region of the surface of at least one substrate are inspected by comparing one pattern against the other and noting whether they agree with each other without the prestoring of an expected pattern. This is accomplished by illuminating at least the two patterns, imaging the first pattern and storing its characteristics in a temporary memory, then imaging the second pattern and comparing it to the stored characteristics from the temporary memory. Here, the comparison reveals whether the two patterns agree or not. Then the comparisons continue sequentially with the second pattern becoming the first pattern in the next imaging/comparison sequence against a new second pattern. Each time the comparison is performed, it is noted whether or not there has been agreement between the two patterns and which two patterns where compared. After all of the patterns are sequentially compared, the bad ones are identified by identifying those that did not compare with other patterns in the test process. This inspection technique is useful for doing die-to-die inspections. A variation of the second configuration uses two TDI sensors to simultaneously image the first and second patterns, thus eliminating the need for the temporary memory. In this configuration, the two patterns are simultaneous imaged and compared, then additional patterns are compared sequentially, in the same manner with the results of the comparisons and the pattern locations stored determine which patterns are bad when the inspection of all patterns is completed.

公开(公告)号：EP0426182A2

公开(公告)日：1991-05-08

申请号：EP90120956.9

申请日：1990-10-31

Applicant: KLA INSTRUMENTS CORP.

Inventor： Chadwick, Curt H. ,  Sholes, Robert H. ,  Greene, John D. ,  Tucker, Francis D., III ,  Fein, Michael E. ,  Jann, P. C. ,  Harvey, David J. ,  Bell, William

IPC: G01N21/88 ,  G01R31/308 ,  G06F15/62 ,  G01R31/00

CPC classification number: G01R31/308 ,  G01N21/64 ,  G01N21/956 ,  G01N21/95607 ,  G01N2021/8887 ,  G01N2021/95615 ,  G01N2021/95638 ,  G01N2201/06126 ,  G01N2201/0826

Abstract: Methods and apparatus for inspecting surface features of a substrate. In each configuration, at least one TDI sensor is used to image the portions of interest of the substrate, with those portions illuminated either with substantially uniform illumination or critical illumination. In one configuration, a substrate, is compared to the expected characteristic features prestored in a memory. In a second configuration, a first and second pattern in a region of the surface of at least one substrate are inspected by comparing one pattern against the other and noting whether they agree with each other without the prestoring of an expected pattern. This is accomplished by illuminating at least the two patterns, imaging the first pattern and storing its characteristics in a temporary memory, then imaging the second pattern and comparing it to the stored characteristics from the temporary memory. Here, the comparison reveals whether the two patterns agree or not. Then the comparisons continue sequentially with the second pattern becoming the first pattern in the next imaging/comparison sequence against a new second pattern. Each time the comparison is performed, it is noted whether or not there has been agreement between the two patterns and which two patterns where compared. After all of the patterns are sequentially compared, the bad ones are identified by identifying those that did not compare with other patterns in the test process. This inspection technique is useful for doing die-to-die inspections, as well as repeating pattern inspections within the same die. A variation of the second configuration uses two TDI sensors to simultaneously image the first and second patterns, thus eliminating the need for the temporary memory. In this configuration, the two patterns are simultaneous imaged and compared, then additional patterns are compared sequentially, in the same manner with the results of the comparisons and the pattern locations stored determine which patterns are bad when the inspection of all patterns is completed.

Abstract translation: 用于检查基板的表面特征的方法和装置。 在每个配置中，使用至少一个TDI传感器对基板的感兴趣部分进行成像，其中那些部分以基本均匀的照明或临界照明照亮。 在一种配置中，将衬底与预先存储在存储器中的预期特征特征进行比较。 在第二配置中，通过将一个图案与另一个基板的一个图案进行比较，并且注意到它们是否彼此一致而不预先预定图案，来检查至少一个基板的表面区域中的第一和第二图案。 这是通过照亮至少两个图案，对第一图案进行成像并将其特征存储在临时存储器中，然后对第二图案进行成像并将其与来自临时存储器的存储特性进行比较来实现的。 在这里，比较显示两种模式是否一致。 然后比较继续顺序地与第二图案相对于新的第二图案在下一个成像/比较序列中成为第一图案。 每次执行比较时，都注意到两种模式之间是否存在一致性，以及两种模式之间的比较。 在所有模式顺序比较之后，通过识别在测试过程中与其他模式不相比较的那些模式来识别不良模式。 该检查技术对于进行模 - 模检查以及在相同模具内重复图案检查是有用的。 第二配置的变化使用两个TDI传感器来同时对第一和第二图案进行成像，因此不需要临时存储器。 在该配置中，两个图案被同时成像和比较，然后以与比较的结果相同的方式对附加图案进行比较，并且存储的图案位置确定当所有图案的检查完成时哪些图案是不好的。

公开(公告)号：EP0818814A2

公开(公告)日：1998-01-14

申请号：EP97305036.2

申请日：1997-07-09

Applicant: KLA INSTRUMENTS CORP.

Inventor： Bareket, Noah

IPC: H01L21/66

CPC classification number: G03F7/70633 ,  H01L22/12 ,  H01L22/34

Abstract: The present invention is a new target, and associated apparatus and methods, for determining offset between adjacent layers of a semiconductor device. The target disclosed here includes a first periodic structure to be placed on a first layer of the device and a second periodic structure, that complements the first periodic structure, placed on a second layer of the device at a location that is adjacent the first periodic structure when the second layer is placed on the first layer. Any offset that may occur is detected by the present invention either optically, micro-mechanically or with electron beams using any of various methods and system embodiments.

Abstract translation: 本发明是用于确定半导体器件的相邻层之间的偏移的新目标以及相关联的装置和方法。 这里公开的目标包括放置在装置的第一层上的第一周期性结构和补充第一周期性结构的第二周期性结构，该第二周期性结构与邻近第一周期结构的位置放置在装置的第二层上 当第二层被放置在第一层上时。 本发明可通过各种方法和系统实施例中的任何一种光学，微机械或电子束来检测可能发生的任何偏移。

公开(公告)号：EP0426182B1

公开(公告)日：1997-01-02

申请号：EP90120956.9

申请日：1990-10-31

Applicant: KLA INSTRUMENTS CORP.

Inventor： Chadwick, Curt H. ,  Sholes, Robert H. ,  Greene, John D. ,  Tucker, Francis D., III ,  Fein, Michael E. ,  Jann, P. C. ,  Harvey, David J. ,  Bell, William

IPC: G01N21/88 ,  G01R31/308 ,  G06T7/40 ,  G01R31/00

CPC classification number: G01R31/308 ,  G01N21/64 ,  G01N21/956 ,  G01N21/95607 ,  G01N2021/8887 ,  G01N2021/95615 ,  G01N2021/95638 ,  G01N2201/06126 ,  G01N2201/0826

公开(公告)号：EP0426166A2

公开(公告)日：1991-05-08

申请号：EP90120932.0

申请日：1990-10-31

Applicant: KLA INSTRUMENTS CORP.

Inventor： Chadwick, Curt H. ,  Sholes, Robert H. ,  Greene, John D. ,  Tucker, Francis D. III ,  Fein, Michael E. ,  Jann, P.C. ,  Harvey, David J. ,  Bell, William

IPC: G01N21/88 ,  G01R31/308 ,  G06T7/60

CPC classification number: G01N21/8806 ,  G01N21/956 ,  G01N21/95607 ,  G01N2021/8907 ,  G01N2021/8908 ,  G01N2021/95615 ,  G01N2021/95638 ,  G01N2201/06126 ,  G01R31/309 ,  G01R31/311

Abstract: Methods and apparatus for inspecting surface features of a substrate. In each configuration, at least one TDI sensor is used to image the portions of interest of the substrate, with those portions illuminated either with substantially uniform illumination. In one configuration, a substrate is compared to the expected characteristic features prestored in a memory. In a second configuration, a first and second pattern in a region of the surface of at least one substrate are inspected by comparing one pattern against the other and noting whether they agree with each other without the prestoring of an expected pattern. This is accomplished by illuminating at least the two patterns, imaging the first pattern and storing its characteristics in a temporary memory, then imaging the second pattern and comparing it to the stored characteristics from the temporary memory. Here, the comparison reveals whether the two patterns agree or not. Then the comparisons continue sequentially with the second pattern becoming the first pattern in the next imaging/comparison sequence against a new second pattern. Each time the comparison is performed, it is noted whether or not there has been agreement between the two patterns and which two patterns where compared. After all of the patterns are sequentially compared, the bad ones are identified by identifying those that did not compare with other patterns in the test process. This inspection technique is useful for doing die-to-die inspections. A variation of the second configuration uses two TDI sensors to simultaneously image the first and second patterns, thus eliminating the need for the temporary memory. In this configuration, the two patterns are simultaneous imaged and compared, then additional patterns are compared sequentially, in the same manner with the results of the comparisons and the pattern locations stored determine which patterns are bad when the inspection of all patterns is completed.

Abstract translation: 用于检查基板的表面特征的方法和装置。 在每种配置中，使用至少一个TDI传感器来对基片的感兴趣的部分进行成像，其中那些部分以基本均匀的照明照亮。 在一种配置中，将衬底与预先存储在存储器中的预期特征特征进行比较。 在第二配置中，通过将一个图案与另一个基板的一个图案进行比较，并且注意到它们是否彼此一致而不预先预定图案，来检查至少一个基板的表面区域中的第一和第二图案。 这是通过照亮至少两个图案，对第一图案进行成像并将其特征存储在临时存储器中，然后对第二图案进行成像并将其与来自临时存储器的存储特性进行比较来实现的。 在这里，比较显示两种模式是否一致。 然后比较继续顺序地与第二图案相对于新的第二图案在下一个成像/比较序列中成为第一图案。 每次执行比较时，都注意到两种模式之间是否存在一致性，以及两种模式之间的比较。 在所有模式顺序比较之后，通过识别在测试过程中与其他模式不相比较的那些模式来识别不良模式。 这种检查技术对于进行模具检查是有用的。 第二配置的变型使用两个TDI传感器来同时对第一和第二图案进行成像，因此不需要临时存储器。 在该配置中，两个图案被同时成像和比较，然后以与比较的结果相同的方式对附加图案进行比较，并且存储的图案位置确定当所有图案的检查完成时哪些图案是不好的。