公开(公告)号：WO2015191272A1

公开(公告)日：2015-12-17

申请号：PCT/US2015/032292

申请日：2015-05-22

Applicant: LUXVUE TECHNOLOGY CORPORATION

Inventor： BATHURST, Stephen P. ,  PARKS, Paul Argus ,  LIGHT, Nile Alexander

IPC: B81C99/00 ,  B25J7/00

CPC classification number: B81C99/002 ,  B25J7/00 ,  B25J15/0085 ,  B25J19/02 ,  B81B2203/0163 ,  H01L21/6831 ,  H02N13/00 ,  Y10T74/20006

Abstract: Systems and methods for aligning a transfer head assembly with a substrate are disclosed. In an embodiment a pivot mount is used for generating a feedback signal in a closed-loop motion control system. In an embodiment, the pivot mount includes a plurality of spring arms, with each spring arm including a switch-back along an axial length of the spring arm such that a pair of first and second lengths of the spring arm are immediately adjacent the switch-back and are parallel to each other. A first strain sensing element is located at the first length, and a second strain sensing element is located at the second length.

Abstract translation: 公开了用于将转印头组件与衬底对准的系统和方法。 在一个实施例中，枢轴安装件用于在闭环运动控制系统中产生反馈信号。 在一个实施例中，枢轴支架包括多个弹簧臂，每个弹簧臂包括沿着弹簧臂的轴向长度的开关，使得弹簧臂的一对第一和第二长度紧邻开关 - 背部并且彼此平行。 第一应变传感元件位于第一长度，并且第二应变感测元件位于第二长度。

公开(公告)号：WO2015094601A2

公开(公告)日：2015-06-25

申请号：PCT/US2014/067190

申请日：2014-11-24

Applicant: LUXVUE TECHNOLOGY CORPORATION

Inventor： BIBL, Andreas ,  SAKARIYA, Kapil V. ,  PAVATE, Vikram

IPC: G06F1/16

CPC classification number: H01L25/167 ,  G04G9/10 ,  G06F1/163 ,  G06F1/1652 ,  G06F3/0412 ,  G06F3/042 ,  G06F3/14 ,  G09G3/32 ,  G09G2380/02 ,  H01L23/293 ,  H01L23/3171 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5387 ,  H01L25/0753 ,  H01L31/0216 ,  H01L31/16 ,  H01L33/44 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/115 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/10106 ,  H05K2201/10128 ,  H01L2924/00

Abstract: A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays.

Abstract translation: 描述了包括显示模块的显示模块和系统应用。 显示模块可以包括前表面，后表面和前表面上的显示区域的显示基板。 多个互连件从前表面延伸到后表面。 一组发光二极管（LED）在显示区域中并与多个互连电连接，一个或多个驱动电路位于显示基板的背面。 示例性系统应用包括可穿戴的，可滚动的和可折叠的显示器。

公开(公告)号：WO2014204695A1

公开(公告)日：2014-12-24

申请号：PCT/US2014/041491

申请日：2014-06-09

Applicant: LUXVUE TECHNOLOGY CORPORATION

Inventor： BIBL, Andreas ,  GRIGGS, Charles R.

IPC: H01L33/44

CPC classification number: H01L25/167 ,  H01L24/95 ,  H01L25/0753 ,  H01L25/165 ,  H01L27/0203 ,  H01L27/124 ,  H01L27/1244 ,  H01L33/0008 ,  H01L33/06 ,  H01L33/08 ,  H01L33/20 ,  H01L33/30 ,  H01L33/44 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00

Abstract: Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.

Abstract translation: 描述了将微型LED器件集成到发光器件中的发光器件和方法。 在一个实施例中，发光器件包括堤层内的反射堤坝结构，以及位于堤层顶部并在反射堤岸结构上方升高的导电线。 微型LED器件在反射堤结构内，钝化层位于堤层之上，并且侧向围绕反射堤坝结构内的微型LED器件。 微型LED器件的一部分和在堤层顶部的导电线突出于钝化层的顶表面之上。

公开(公告)号：WO2014039335A1

公开(公告)日：2014-03-13

申请号：PCT/US2013/056912

申请日：2013-08-27

Applicant: LUXVUE TECHNOLOGY CORPORATION

Inventor： HIGGINSON, John, A. ,  BIBL, Andreas ,  ALBERTALLI, David

IPC: H01L21/677 ,  B65G49/07 ,  H01L21/68 ,  B25J9/04

CPC classification number: B25J15/0085 ,  B81C99/002 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/67259 ,  H01L24/75 ,  H01L24/95 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75753 ,  H01L2224/7598 ,  H02N13/00

Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool includes an articulating transfer head assembly, a carrier substrate holder, and an actuator assembly to adjust a spatial relationship between the articulating transfer head assembly and the carrier substrate holder. The articulating transfer head assembly may include an electrostatic voltage source connection and a substrate supporting an array of electrostatic transfer heads.

Abstract translation: 公开了用于从载体衬底传送微器件的系统和方法。 在一个实施例中，传质工具包括铰接传送头组件，载体衬底保持器和致动器组件，以调节关节式传送头组件和载体衬底保持器之间的空间关系。 铰接传送头组件可以包括静电电压源连接和支撑静电转印头阵列的基片。

公开(公告)号：WO2015175131A1

公开(公告)日：2015-11-19

申请号：PCT/US2015/025873

申请日：2015-04-15

Applicant: LUXVUE TECHNOLOGY CORPORATION

Inventor： BIBL, Andreas ,  GOLDA, Dariusz

IPC: G09F9/30 ,  H01L25/075 ,  H01L25/16 ,  H01L27/12 ,  H05K1/18

CPC classification number: H01L25/167 ,  G09F9/301 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/24 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L25/0753 ,  H01L27/1266 ,  H01L27/15 ,  H01L27/153 ,  H01L27/156 ,  H01L2221/68318 ,  H01L2221/68359 ,  H01L2221/68381 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/16227 ,  H01L2224/24101 ,  H01L2224/24105 ,  H01L2224/24227 ,  H01L2224/245 ,  H01L2224/27462 ,  H01L2224/2747 ,  H01L2224/291 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/32227 ,  H01L2224/73259 ,  H01L2224/73267 ,  H01L2224/81005 ,  H01L2224/81192 ,  H01L2224/81424 ,  H01L2224/81438 ,  H01L2224/81444 ,  H01L2224/81466 ,  H01L2224/81486 ,  H01L2224/8149 ,  H01L2224/81805 ,  H01L2224/81825 ,  H01L2224/8183 ,  H01L2224/82005 ,  H01L2224/82102 ,  H01L2224/82104 ,  H01L2224/82106 ,  H01L2224/83005 ,  H01L2224/83192 ,  H01L2224/83424 ,  H01L2224/83438 ,  H01L2224/83444 ,  H01L2224/83466 ,  H01L2224/83486 ,  H01L2224/8349 ,  H01L2224/83805 ,  H01L2224/83825 ,  H01L2224/8383 ,  H01L2224/92224 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/10161 ,  H01L2924/10162 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15156 ,  H01L2924/18161 ,  H01L2924/18162 ,  H05K1/189 ,  H05K3/4682 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/01074 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0781 ,  H01L2924/01038 ,  H01L2924/053 ,  H01L2924/06 ,  H01L2924/01006 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01042 ,  H01L2924/01022 ,  H01L2924/01071 ,  H01L2224/81 ,  H01L2224/82 ,  H01L2224/83

Abstract: A flexible display panel (103) and method of formation with a sacrificial release layer are described. The method of manufacturing a flexible display system includes forming a sacrificial layer on a carrier substrate (101). A flexible display substrate (105) is formed on the sacrificial layer, with a plurality of release openings (111) that extend through the flexible display substrate (105) to the sacrificial layer. An array of LEDs (106) and a plurality of microchips (108) are transferred onto the flexible display substrate (105) to form a flexible display panel (103). The sacrificial layer is selectively removed such that the flexible display panel (103) attaches to the carrier substrate (101) by a plurality of support posts. The flexible display panel (103) is removed from the carrier substrate (101) and is electrically coupled with display components to form a flexible display system.

Abstract translation: 描述了柔性显示面板（103）及其形成方法。 柔性显示系统的制造方法包括在载体基板（101）上形成牺牲层。 柔性显示基板（105）形成在牺牲层上，多个释放开口（111）延伸穿过柔性显示基板（105）至牺牲层。 一组LED（106）和多个微芯片（108）被转移到柔性显示基板（105）上以形成柔性显示面板（103）。 选择性地去除牺牲层，使得柔性显示面板（103）通过多个支撑柱附接到载体基板（101）。 柔性显示面板（103）从载体基板（101）移除并与显示部件电耦合以形成柔性显示系统。

公开(公告)号：WO2014197221A1

公开(公告)日：2014-12-11

申请号：PCT/US2014/039300

申请日：2014-05-23

Applicant: LUXVUE TECHNOLOGY CORPORATION

Inventor： BIBL, Andreas ,  GOLDA, Dariusz

IPC: B81C99/00 ,  H01L21/67 ,  H01L23/00 ,  H01L21/683 ,  B25J15/00 ,  H01L21/768

CPC classification number: H01L21/6833 ,  B81C99/002 ,  H01L21/6835 ,  H01L21/76802 ,  H01L21/76877 ,  H01L21/76898 ,  H01L24/75 ,  H01L2221/68322 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/00

Abstract: Micro pick up arrays for transferring micro devices from a carrier substrate are disclosed. In an embodiment, a micro pick up array (104) includes a compliant contact (108) for delivering an operating voltage from a voltage source to an array of electrostatic transfer heads (114). The compliant contact is moveable relative to a base substrate (214) of the micro pick up array.

Abstract translation: 公开了用于从载体衬底传送微器件的微拾取阵列。 在一个实施例中，微拾取阵列（104）包括用于将工作电压从电压源传送到静电转印头（114）阵列的柔性接触件（108）。 柔性触点相对于微拾取阵列的基底（214）可移动。

公开(公告)号：WO2014186214A1

公开(公告)日：2014-11-20

申请号：PCT/US2014/037399

申请日：2014-05-08

Applicant: LUXVUE TECHNOLOGY CORPORATION

Inventor： BIBL, Andreas ,  MCGRODDY, Kelly

IPC: H01L33/50 ,  H01L27/15

CPC classification number: H01L33/504 ,  H01L27/156 ,  H01L33/06 ,  H01L33/502 ,  H01L2224/18 ,  H01L2224/24 ,  H01L2224/82

Abstract: A light emitting device and method of manufacture are described. In an embodiment, the light emitting device includes a micro LED device bonded to a bottom electrode, a top electrode in electrical contact with the micro LED device, and a wavelength conversion layer around the micro LED device. The wavelength conversion layer includes phosphor particles. Exemplary phosphor particles include quantum dots that exhibit luminescence due to their size, or particles that exhibit luminescence due to their composition.

Abstract translation: 描述了一种发光器件及其制造方法。 在一个实施例中，发光器件包括结合到底部电极的微型LED器件，与微型LED器件电接触的顶部电极以及围绕微型LED器件的波长转换层。 波长转换层包括磷光体颗粒。 示例性荧光体颗粒包括由于其尺寸而显示发光的量子点或由于其组成而显示发光的颗粒。

公开(公告)号：WO2014149864A1

公开(公告)日：2014-09-25

申请号：PCT/US2014/021259

申请日：2014-03-06

Applicant: LUXVUE TECHNOLOGY CORPORATION

Inventor： BIBL, Andreas ,  SAKARIYA, Kapil V. ,  GRIGGS, Charles R. ,  PERKINS, James Michael

IPC: H01L27/32 ,  H01L51/52

CPC classification number: H01L25/0753 ,  H01L24/95 ,  H01L27/1214 ,  H01L27/1259 ,  H01L33/0095 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/00

Abstract: A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities.

Abstract translation: 描述了显示面板和制造方法。 在一个实施例中，显示基板包括像素区域和非像素区域。 子像素阵列和相应的底电极阵列位于像素区域中。 微型LED器件的阵列结合到底部电极阵列。 形成与微型LED器件的阵列电接触的一个或多个顶部电极层。 在一个实施例中，冗余的一对微型LED器件被结合到底部电极阵列。 在一个实施例中，微型LED器件的阵列被成像以检测不规则。

公开(公告)号：WO2013176963A1

公开(公告)日：2013-11-28

申请号：PCT/US2013/041441

申请日：2013-05-16

Applicant: LUXVUE TECHNOLOGY CORPORATION

Inventor： GOLDA, Dariusz ,  BIBL, Andreas

IPC: H01L21/677 ,  B81C1/00 ,  B65G49/07

CPC classification number: B81C99/0025 ,  B81C2201/0194 ,  H01L21/67144 ,  H01L24/75 ,  H01L2224/7598

Abstract: A micro device transfer head array and method of forming a micro device transfer array from an SOI substrate are described. In an embodiment, the micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include a silicon interconnect and an array of silicon electrodes electrically connected with the silicon interconnect. Each silicon electrode includes a mesa structure protruding above the silicon interconnect. A dielectric layer covers a top surface of each mesa structure.

Abstract translation: 描述了从SOI衬底形成微器件传输阵列的微器件转移头阵列和方法。 在一个实施例中，微器件传送头阵列包括基底衬底和基底衬底上的图案化硅层。 图案化硅层可以包括硅互连和与硅互连电连接的硅电极阵列。 每个硅电极包括突出在硅互连上方的台面结构。 介电层覆盖每个台面结构的顶面。

公开(公告)号：WO2013162927A9

公开(公告)日：2013-10-31

申请号：PCT/US2013/036477

申请日：2013-04-12

Applicant: LUXVUE TECHNOLOGY CORPORATION

Inventor： HU, Hsin-Hua ,  BIBL, Andreas

IPC: H01L33/36

Abstract: A method of fabricating and transferring a micro device and an array of micro devices to a receiving substrate are described. In an embodiment, a patterned sacrificial layer is utilized to form a self-aligned metallization stack and is utilized as an etch stop layer during etching of a p-n diode layer to form a plurality of micro p-n diodes.