公开(公告)号：US20040227703A1

公开(公告)日：2004-11-18

申请号：US10437091

申请日：2003-05-13

Applicant: MCNC Research And Development Institute

Inventor： Michael K. Lamvik ,  Gary E. McGuire ,  John S. Lewis III

IPC: G09G005/00

CPC classification number: G02B27/0172 ,  G02B2027/0132 ,  G02B2027/014 ,  H04N5/7491

Abstract: This invention provides a continuous display with non-uniform pixel density, forming a foveated display. A single, continuous display has a higher pixel density at the center of the display than at the periphery of the display. Where two continuous displays are used in accordance with the present invention, the central forward gaze of the viewer's image will be displayed in high resolution while the leftmost portion of the left eye display will be in low resolution and the rightmost portion of the right eye display will be in low resolution. The pixel resolution of the visual display may correspond to the visual acuity of the human eye. A foveated image display system using a continuous display with non-uniform pixel density increases the field of view while reducing the image bandwidth. A foveated image display system may be hardware-based by employing anamorphic lenses or sensors rather than relying upon image interpolation to modify the resolution of the resultant image data communicated to the continuous display with non-uniform pixel density.

Abstract translation: 本发明提供了具有不均匀像素密度的连续显示，形成移动显示。 单个连续显示器在显示器的中心处具有比在显示器周边处更高的像素密度。 在根据本发明使用两个连续显示器的情况下，观看者的图像的中心向前视线将以高分辨率显示，而左眼显示器的最左部分将具有低分辨率，并且右眼显示器的最右部分 将处于低分辨率。 视觉显示的像素分辨率可以对应于人眼的视力。 使用具有不均匀像素密度的连续显示器的移动图像显示系统在减小图像带宽的同时增加了视场。 移动图像显示系统可以通过使用变形镜头或传感器而不是依靠图像插值来修改以不均匀的像素密度传送到连续显示器的合成图像数据的分辨率来进行硬件化。

公开(公告)号：US20040046123A1

公开(公告)日：2004-03-11

申请号：US10447620

申请日：2003-05-29

Applicant: MCNC Research and Development Institute

Inventor： David E. Dausch

IPC: G01J005/02

CPC classification number: B81B3/0035 ,  G02B26/04 ,  G02B26/0833 ,  G02B26/0841 ,  G02B26/0866

Abstract: The present invention provides for an improved electromagnetic radiation detector having a micromachined electrostatic chopper/shutter device. The MEMS flexible film chopper/shutter device provides reliability, efficiency, noise reduction and temperature fluctuation compensation capabilities to the associated electromagnetic radiation detector. An electromagnetic radiation detector having an electrostatic chopper/shutter device includes a detector material element and flexible film actuator overlying the detector material layer and moveable relative thereto. The flexible film actuator will typically include an electrode element and a biasing element such that the actuator remains in a fully curled, open state absent electrostatic voltage and moves to a fully uncurled, closed state upon the application of electrostatic voltage. Arrays that incorporate a plurality of electromagnetic radiation detectors and/or electrostatic shuttering devices are additionally provided for.

Abstract translation: 本发明提供一种具有微加工静电斩波器/快门装置的改进的电磁辐射检测器。 MEMS柔性薄膜斩波器/快门装置为相关的电磁辐射探测器提供可靠性，效率，降噪和温度波动补偿能力。 具有静电斩波器/快门装置的电磁辐射检测器包括检测器材料元件和覆盖检测器材料层并可相对于其移动的柔性膜致动器。 柔性膜致动器通常将包括电极元件和偏置元件，使得致动器在静电电压下保持完全卷曲的打开状态，并且在施加静电电压时移动到完全未弯曲的闭合状态。 另外提供了并入有多个电磁辐射检测器和/或静电遮蔽装置的阵列。

公开(公告)号：US20040228417A1

公开(公告)日：2004-11-18

申请号：US10435047

申请日：2003-05-12

Applicant: MCNC Research and Development Institute

Inventor： Levi Kennedy ,  Paul Robert Runkle ,  Brett Dean Bradford Guenther

IPC: H04K001/10 ,  H04L027/28 ,  H04B001/10

CPC classification number: H04L25/0236 ,  H04L25/022 ,  H04L25/03159 ,  H04L27/2601

Abstract: Adaptive methods and systems for applying a channel correction factor to received signals to correct errors caused by channel distortion. The channel correction factor is dynamically calculated and updated based on the received signal or signals. A receiver continuously calculates an error factor representing a deviation of the received signal from the signal being transmitted, and generates the channel correction factor based on the error factor. Since the error factor includes information related to channel distortions, the channel correction factor so calculated adapts to the change of channel characteristics. If preferred, an advanced algorithm can be used to predict the channel response for the next incoming signal such that the receiver can correct channel errors on a substantially real-time basis.

Abstract translation: 用于将信道校正因子应用于接收信号以校正由信道失真引起的误差的自适应方法和系统。 基于接收的信号或信号动态地计算和更新信道校正因子。 接收机连续计算表示接收信号与被发送信号的偏差的误差因子，并根据误差因子产生信道校正因子。 由于误差因子包括与信道失真有关的信息，因此如此计算的信道校正因子适应于信道特性的变化。 如果优选，则可以使用高级算法来预测下一个输入信号的信道响应，使得接收机可以基本上实时地校正信道错误。

公开(公告)号：WO2004013383A1

公开(公告)日：2004-02-12

申请号：PCT/US2003/016071

申请日：2003-05-20

Applicant: MCNC RESEARCH AND DEVELOPMENT INSTITUTE

Inventor： LEWIS, John, South, III ,  GOODWIN-JOHANSSON, Scott, Halden ,  STONER, Brian, Rhys ,  GREGO, Sonia ,  DAUSCH, David, Edward

IPC: C30B7/00

CPC classification number: B82Y20/00 ,  C30B5/00 ,  C30B7/005 ,  C30B29/60 ,  G02B6/1225 ,  Y10S117/902 ,  Y10S117/913 ,  Y10T428/261 ,  Y10T428/265 ,  Y10T428/31504

Abstract: A three dimensional photonic crystal (150) and layer-by-layer processes of fabricating the photonic crystal. A templated substrate (100) is exposed to a plurality of first microspheres made of a first material, the first material being of a type that will bond to the templated substrate and form a self-passivated layer of first microspheres to produce a first layer (110). The first layer (110) is exposed to a plurality of second microspheres made of a second material, the second material being of a type that will bond to the first layer (110) and form a self-passivated layer of second microspheres (134). This layering of alternatng first and second microspheres can be repeated as desired to build a three dimensional photonic crystal of desired geometry.

Abstract translation: 三维光子晶体（150）和逐层制造光子晶体的过程。 模板化衬底（100）暴露于由第一材料制成的多个第一微球体中，第一材料是将与模板化衬底结合并形成自钝化层的第一微球体以产生第一层（ 110）。 第一层（110）暴露于由第二材料制成的多个第二微球，第二材料是将结合到第一层（110）并形成第二微球（134）的自钝化层的类型， 。 可以根据需要重复交替的第一和第二微球的层叠以构建所需几何形状的三维光子晶体。

公开(公告)号：EP1419526A2

公开(公告)日：2004-05-19

申请号：EP02757368.2

申请日：2002-08-23

Applicant: MCNC Research and Development Institute

Inventor： PALMER, William Devereux ,  BONAFEDE, Salvatore ,  TEMPLE, Dorota ,  STONER, Brian R.

IPC: H01L21/768 ,  H01L23/48 ,  H01L25/065

CPC classification number: H05K3/0055 ,  H01L21/76898 ,  H01L23/481 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/13023 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/16146 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01S5/02 ,  H01S5/0207 ,  H01S5/02272 ,  H01S5/042 ,  H01S5/423 ,  H05K1/0306 ,  H05K2201/0179 ,  H05K2201/09581 ,  H01L2924/014

Abstract: An improved through-via vertical interconnect, through-via heat sinks and associated fabrication techniques are provided for. The devices benefit from an organic dielectric layer (18) that allows for low-temperature deposition processing. The low-temperature processing used to form the through-via interconnects and heat sinks allows for the formation of the interconnects and heat sinks at any point in the fabrication of the semiconductor device, including post-formation of active devices and associated circuitry. The through-via vertical interconnects of the present invention are fabricated so as to insure conformal thickness of the various layers that form the interconnect constructs. As such, the interconnects can be formed with a high aspect ratio, in the range of about 4:1 to about 10:1, substrate thickness to interconnect diameter.