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公开(公告)号：WO2012011020A2
公开(公告)日：2012-01-26
申请号：PCT/IB2011/053099
申请日：2011-07-12
Applicant: BASF SE , BASF (CHINA) COMPANY LIMITED , MELLIES, Raimund , KLIPP, Andreas
Inventor： MELLIES, Raimund , KLIPP, Andreas
IPC: C11D3/34
CPC classification number: C11D3/349 , C11D1/345 , C11D1/66 , C11D1/667 , C11D1/72 , C11D3/0073 , C11D3/06 , C11D3/2068 , C11D3/2086 , C11D3/30 , C11D3/3757 , C11D3/378 , C11D11/0017 , C11D11/0041 , C11D11/0047 , C11D11/0064 , H01L21/02074 , H05K3/1208 , H05K2203/0793
Abstract: Aqueous alkaline cleaning composition free from organic solvents and metal ion-free silicates, the said compositions comprising (A) a thioamino acid having at least one primary amino group and at least one mercapto group, (B) a quaternary ammonium hydroxide, (C) a chelating and/or corrosion inhibiting agent selected from the group consisting of aliphatic and cycloaliphatic amines having at least two primary amino groups, and aliphatic and cycloaliphatic amines having at least one hydroxy group, (D) a nonionic surfactant selected from the group of acetylenic alcohols, alkyloxylated acetylenic alcohols and alkyloxylated sorbitan monocarboxylic acid mono esters; the use of the alkaline cleaning composition for the processing of substrates useful for fabricating electrical and optical devices; and a method for processing substrates useful for fabricating electrical and optical devices making use of the said aqueous alkaline cleaning composition.
Abstract translation: （A）具有至少一个伯氨基和至少一个巯基的硫代氨基酸，（B）具有至少一个伯氨基和至少一个巯基的硫代氨基酸， （C）选自具有至少两个伯氨基的脂族和脂环族胺以及具有至少一个羟基的脂族和脂环族胺的螯合和/或腐蚀抑制剂，（D） 选自炔醇，烷氧基化炔醇和烷氧基化脱水山梨糖醇单羧酸单酯的非离子表面活性剂; 碱性清洁组合物用于加工可用于制造电气和光学装置的基材; 以及用于处理用于制造使用所述含水碱性清洁组合物的电气和光学装置的基材的方法。
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公开(公告)号：WO2011000758A1
公开(公告)日：2011-01-06
申请号：PCT/EP2010/058959
申请日：2010-06-24
Applicant: BASF SE , MELLIES, Raimund , KLIPP, Andreas
Inventor： MELLIES, Raimund , KLIPP, Andreas
CPC classification number: C11D1/62 , C11D3/34 , C11D7/3209 , C11D7/34 , C11D11/0047 , G03F7/425 , H01L21/02074
Abstract: The aqueous alkaline cleaning composition comprising (A) at least one thioamino acid having at least one secondary or tertiary amino group and at least one mercapto group and (B) at least one quaternary ammonium hydroxide; the use of the alkaline cleaning composition for the processing of substrates useful for fabricating electrical and optical devices; and a method for processing substrates useful for fabricating electrical and optical devices making use of the said aqueous alkaline cleaning composition.
Abstract translation: 含水碱性清洁组合物包含（A）至少一种具有至少一个仲或叔氨基和至少一个巯基的硫代氨基酸和（B）至少一种氢氧化季铵盐; 使用碱性清洁组合物来处理可用于制造电气和光学器件的衬底; 以及用于处理用于制造使用所述碱性水性清洁组合物的电气和光学装置的基板的方法。
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公开(公告)号：WO2011000694A1
公开(公告)日：2011-01-06
申请号：PCT/EP2010/058422
申请日：2010-06-16
Applicant: BASF SE , MELLIES, Raimund , KLIPP, Andreas
Inventor： MELLIES, Raimund , KLIPP, Andreas
CPC classification number: C11D11/0047 , C11D3/0073 , C11D7/263 , C11D7/265 , C11D7/3209 , C11D7/3218 , C11D7/34 , C11D7/5022 , H01L21/02074 , H05K3/26 , H05K2203/0793
Abstract: Aqueous alkaline cleaning composition comprising (A) at least one thioamino acid having at least one primary amino group and at least one mercapto group, (B) at least one quaternary ammonium hydroxide, (C) at least one chelating and/or corrosion inhibiting agent selected from the group consisting of aliphatic and cycloaliphatic amines having at least two primary amino groups, aliphatic and cycloaliphatic amines having at least one hydroxy group, and aromatic compounds having at least one acid group and at least one hydroxy group, (D) at least one organic solvent having wetting properties and a melting point below 0°C; and a method for processing substrates useful for fabricating electrical and optical devices making use of the said aqueous alkaline cleaning composition.
Abstract translation: 一种水性碱性清洁组合物，其包含（A）至少一种具有至少一个伯氨基和至少一个巯基的硫代氨基酸，（B）至少一种氢氧化季铵，（C）至少一种螯合和/或腐蚀抑制剂 选自具有至少两个伯氨基的脂族和脂环族胺，具有至少一个羟基的脂族和脂环族胺，以及具有至少一个酸基和至少一个羟基的芳族化合物，（D）至少 一种有机溶剂具有润湿性能和熔点低于0℃; 以及用于处理用于制造使用所述含水碱性清洁组合物的电气和光学装置的基板的方法。
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4.发明申请
公开(公告)号：WO2012127336A1
公开(公告)日：2012-09-27
申请号：PCT/IB2012/050912
申请日：2012-02-28
Applicant: BASF SE , BASF (CHINA) COMPANY LIMITED , KLIPP, Andreas , RAMAN, Vijay Immanuel , VENKATARAMAN, Shyam Sundar , MELLIES, Raimund , ZHONG, Mingjie
Inventor： KLIPP, Andreas , RAMAN, Vijay Immanuel , VENKATARAMAN, Shyam Sundar , MELLIES, Raimund , ZHONG, Mingjie
IPC: B08B3/04
CPC classification number: H01L21/02074 , C11D1/662 , C11D1/72 , C11D1/721 , C11D1/722 , C11D1/825 , C11D3/0073 , C11D3/2041 , C11D3/2065 , C11D3/2082 , C11D3/3757 , C11D11/0047 , G03F7/422 , G03F7/426
Abstract: Aqueous, nitrogen-free cleaning composition, preparation and use thereof are provided. The composition having a pH of from 5 to 8 comprises (A) an amphiphilic nonionic, water-soluble or water-dispersible surfactant and (B) a metal chelating agent selected from polycarboxylic acids having at least 3 carboxylic acid groups. The composition is used for removing residues and contaminants from semiconductor substrates.
Abstract translation: 提供了无水的无氮清洁组合物，其制备和用途。 具有5至8的pH的组合物包含（A）两亲性非离子，水溶性或水分散性表面活性剂和（B）选自具有至少3个羧酸基团的多元羧酸的金属螯合剂。 该组合物用于从半导体衬底去除残留物和污染物。
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公开(公告)号：WO2009092706A2
公开(公告)日：2009-07-30
申请号：PCT/EP2009050589
申请日：2009-01-20
Applicant: BASF SE , MELLIES RAIMUND
Inventor： MELLIES RAIMUND
CPC classification number: C23C18/50
Abstract: The invention relates to a solution for the deposition of barrier layers on metal surfaces, which comprises compounds of the elements nickel and molybdenum, at least one first reducing agent selected fromamong secondary and tertiary cyclic aminoboranes and at least one complexing agent, where the solution has a pH of from 8.5 to12.
Abstract translation: 本发明涉及用于在金属表面上沉积阻挡层的解决方案，其包括元素镍和钼的化合物，至少一种选自次级和三级环状氨基硼烷的第一还原剂和至少一种络合剂，其中溶液具有 pH为8.5〜12。
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Patent Agency Ranking
公开(公告)号：WO2009092706A3
公开(公告)日：2009-07-30
申请号：PCT/EP2009/050589
申请日：2009-01-20
Applicant: BASF SE , MELLIES, Raimund
Inventor： MELLIES, Raimund
IPC: C23C18/50
Abstract: The invention relates to a solution for the deposition of barrier layers on metal surfaces, which comprises compounds of the elements nickel and molybdenum, at least one first reducing agent selected fromamong secondary and tertiary cyclic aminoboranes and at least one complexing agent, where the solution has a pH of from 8.5 to12.
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公开(公告)号：WO2005098920A3
公开(公告)日：2007-07-05
申请号：PCT/EP2005002511
申请日：2005-03-10
Applicant: BASF AG , MELLIES RAIMUND
Inventor： MELLIES RAIMUND
IPC: H01L21/3213 , C11D11/00 , G03F7/42 , H01L21/02 , H01L21/311
CPC classification number: H01L21/02071 , C11D1/72 , C11D1/83 , C11D3/0084 , C11D3/2086 , C11D3/43 , C11D7/265 , C11D11/0047 , G03F7/423 , H01L21/02063
Abstract: The invention relates to a novel solution for removing post-etch-residue, having improved properties, and to the use thereof in the production of semi-conductors. The invention also relates to an aqueous solution having a reduced etching rate in relation to metallisations and in relation to surfaces, which must be released from post-etch residues and particles during the production process of semi-conductors.
Abstract translation: 本发明涉及一种用于去除具有改进的性质和它们在半导体制造使用PostEtch-残基的新颖的解决方案。 本发明尤其涉及一种具有减小的蚀刻速率的水溶液相比金属化和相对表面，其具有在半导体的制造过程中被释放蚀刻后残余物和微粒的。
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公开(公告)号：WO2012011020A3
公开(公告)日：2012-03-15
申请号：PCT/IB2011053099
申请日：2011-07-12
Applicant: BASF SE , BASF CHINA CO LTD , MELLIES RAIMUND , KLIPP ANDREAS
Inventor： MELLIES RAIMUND , KLIPP ANDREAS
CPC classification number: C11D3/349 , C11D1/345 , C11D1/66 , C11D1/667 , C11D1/72 , C11D3/0073 , C11D3/06 , C11D3/2068 , C11D3/2086 , C11D3/30 , C11D3/3757 , C11D3/378 , C11D11/0017 , C11D11/0041 , C11D11/0047 , C11D11/0064 , H01L21/02074 , H05K3/1208 , H05K2203/0793
Abstract: Aqueous alkaline cleaning composition free from organic solvents and metal ion-free silicates, the said compositions comprising (A) a thioamino acid having at least one primary amino group and at least one mercapto group, (B) a quaternary ammonium hydroxide, (C) a chelating and/or corrosion inhibiting agent selected from the group consisting of aliphatic and cycloaliphatic amines having at least two primary amino groups, and aliphatic and cycloaliphatic amines having at least one hydroxy group, (D) a nonionic surfactant selected from the group of acetylenic alcohols, alkyloxylated acetylenic alcohols and alkyloxylated sorbitan monocarboxylic acid mono esters; the use of the alkaline cleaning composition for the processing of substrates useful for fabricating electrical and optical devices; and a method for processing substrates useful for fabricating electrical and optical devices making use of the said aqueous alkaline cleaning composition.
Abstract translation: 所述组合物包含（A）具有至少一个伯氨基和至少一个巯基的硫代氨基酸，（B）季铵氢氧化物，（C） 选自具有至少两个伯氨基的脂族和脂环族胺和具有至少一个羟基的脂族和脂环族胺的螯合和/或腐蚀抑制剂，（D）选自炔属的非离子表面活性剂 醇，烷氧基乙炔醇和烷氧基化脱水山梨糖醇单羧酸单酯; 使用碱性清洁组合物来处理用于制造电气和光学装置的基板; 以及用于处理用于制造使用所述含水碱性清洁组合物的电气和光学装置的基板的方法。
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公开(公告)号：WO2007020206A1
公开(公告)日：2007-02-22
申请号：PCT/EP2006/065104
申请日：2006-08-07
Applicant: BASF Aktiengesellschaft , FLÜGGE, Martin , MELLIES, Raimund , GOELZENLEUCHTER, Thomas , SCHWAGER, Marianne , OESTEN, Ruediger
Inventor： FLÜGGE, Martin , MELLIES, Raimund , GOELZENLEUCHTER, Thomas , SCHWAGER, Marianne , OESTEN, Ruediger
CPC classification number: C23F1/28 , C01B15/037 , C23F1/18
Abstract: Die vorliegende Erfindung betrifft neue, lagerstabile Lösungen, mit deren Hilfe in der Halbleitertechnologie gezielt Metallisierungsschichten aus Kupfer aber auch Cu/Ni- Schichten geätzt werden können. Mit den neuen Ätzlösungen ist es möglich, reine Kupfermetallisierungen, Schichten aus Kupfer-Nickel-Legierungen aber auch übereinander liegende Kupfer und Nickelschichten zu ätzen und zu strukturieren. Die Lösungen enthalten Salpetersäure, Wasserstoffperoxid, Zitronensäure und Wasser.
Abstract translation: 本发明涉及随着半导体技术的在铜金属化层，但也铜/镍层可以被蚀刻有针对性地帮助新颖的，储存稳定的溶液。 随着新的蚀刻溶液有可能纯铜金属化，铜 - 镍合金的层，但也叠加蚀刻铜层和镍层和结构。 该溶液含有硝酸，过氧化氢，柠檬酸和水。
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10.发明申请RESIST STRIPPER AND RESIDUE REMOVER FOR CLEANING COPPER SURFACES IN SEMICONDUCTOR PROCESSING 审中-公开半导体加工中清洁铜表面的耐腐蚀剥离器和残留物去除
公开(公告)号：WO2006056298A1
公开(公告)日：2006-06-01
申请号：PCT/EP2005/011739
申请日：2005-11-03
Applicant: BASF AKTIENGESELLSCHAFT , FERSTL, Berthold , FIEDLER, Ralf , SCHWAGER, Marianne , ARNOLD, Lucia , MELLIES, Raimund , GOELZENLEUCHTER, Thomas
Inventor： FERSTL, Berthold , FIEDLER, Ralf , SCHWAGER, Marianne , ARNOLD, Lucia , MELLIES, Raimund , GOELZENLEUCHTER, Thomas
IPC: C11D7/50 , C11D7/06 , C11D11/00 , G03F7/42 , H01L21/306
CPC classification number: H01L21/02071 , C11D7/263 , C11D7/3209 , C11D7/34 , C11D7/5009 , C11D11/0047 , G03F7/425 , G03F7/426
Abstract: The present invention relates to new compositions for cleaning of microelectronic substrates, especially for copper metallizations or copper surfaces in semiconductor processing and wafer production. It also relates to the use of such cleaning compositions for stripping photoresists and cleaning residues from plasma generated organic, organometallic and inorganic compounds. Especially the invention relates to compositions of from resist strippers or polymer resist removers and their use with better performance.
Abstract translation: 本发明涉及用于清洁微电子衬底的新组合物，特别是用于半导体加工和晶片生产中的铜金属化或铜表面。 它还涉及使用这种清洁组合物来剥离光致抗蚀剂并清除来自等离子体产生的有机金属和无机化合物的残留物。 特别地，本发明涉及抗蚀剂剥离剂或聚合物抗蚀剂去除剂的组合物及其具有更好性能的用途。
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