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    IMPROVED MICROVALVE DEVICE
    4.
    发明申请
    IMPROVED MICROVALVE DEVICE 审中-公开

    公开(公告)号：WO2010019329A3

    公开(公告)日：2010-02-18

    申请号：PCT/US2009/050063

    申请日：2009-07-09

    Applicant: MICROSTAQ, INC. ,  HUNNICUTT, Harry

    Inventor： HUNNICUTT, Harry

    IPC: B81B7/00 ,  F16K31/00

    Abstract: A microvalve device includes a body, a valve element supported for movement relative to the body, and an actuator operatively coupled to the valve element for moving the valve element in a normal range of travel. A travel limiting structure operatively cooperates with at least one of the valve element and the actuator to effectively limit the magnitude of movement of the valve element or the actuator outside the normal range of travel to prevent failure of the body, the valve element, or the actuator due to exceeding failure stress limits. A method of forming a microvalve with such a travel limiting structure is also disclosed.

    FLUID FLOW CONTROL ASSEMBLY
    5.
    发明申请
    FLUID FLOW CONTROL ASSEMBLY 审中-公开
    流体流量控制组件

    公开(公告)号：WO2010065804A2

    公开(公告)日：2010-06-10

    申请号：PCT/US2009066675

    申请日：2009-12-04

    Applicant: MICROSTAQ INC ,  HUNNICUTT HARRY ,  BEST CHRISTIAAN S

    Inventor： HUNNICUTT HARRY ,  BEST CHRISTIAAN S

    IPC: F16K11/07 ,  B81B7/00 ,  F15B13/042 ,  F16K3/24 ,  F16K31/383

    CPC classification number: F15B13/0402 ,  Y10T137/7761

    Abstract: A device has been disclosed that may include a spool valve including a body having a first connector and a second connector and a spool movable relative to the body for controlling flow between the first connector and the second connector. The reversible flow control assembly further may include a pilot valve device developing a single pressure command in the form of a fluid at a command pressure. The spool valve may be responsive to the single pressure command developed in said pilot valve device to control flow between the first connector and the second connector without regard to the direction of flow. The majority of axial forces acting on the spool to position the spool relative to the body when fluid is flowing through the valve may be fluid forces.

    Abstract translation: 已经公开了一种装置，其可以包括滑阀，滑阀包括具有第一连接器和第二连接器的主体以及相对于主体可移动的用于控制第一连接器和第二连接器之间的流动的阀芯。 可逆式流量控制组件还可以包括在指令压力下以流体形式产生单个压力指令的先导阀装置。 滑阀可以响应于在所述导阀装置中形成的单个压力命令，以控制第一连接器与第二连接器之间的流动，而不考虑流动方向。 当流体流过阀时，作用在阀芯上以将阀芯相对于阀体定位的大部分轴向力可以是流体力。

    IMPROVED MICROVALVE DEVICE
    6.
    发明申请
    IMPROVED MICROVALVE DEVICE 审中-公开
    改进的微型设备

    公开(公告)号：WO2010019329A2

    公开(公告)日：2010-02-18

    申请号：PCT/US2009050063

    申请日：2009-07-09

    Applicant: MICROSTAQ INC ,  HUNNICUTT HARRY

    Inventor： HUNNICUTT HARRY

    IPC: B81B7/00 ,  F16K31/00

    CPC classification number: F16K99/0001 ,  B81B3/0051 ,  B81B2201/054 ,  F16K99/0044 ,  F16K2099/0074 ,  F16K2099/008

    Abstract: A microvalve device includes a body, a valve element supported for movement relative to the body, and an actuator operatively coupled to the valve element for moving the valve element in a normal range of travel. A travel limiting structure operatively cooperates with at least one of the valve element and the actuator to effectively limit the magnitude of movement of the valve element or the actuator outside the normal range of travel to prevent failure of the body, the valve element, or the actuator due to exceeding failure stress limits. A method of forming a microvalve with such a travel limiting structure is also disclosed.

    Abstract translation: 微型阀装置包括主体，被支撑用于相对于主体运动的阀元件，以及可操作地联接到阀元件的致动器，用于在正常行驶范围内移动阀元件。 行程限制结构与阀元件和致动器中的至少一个可操作地配合以有效地限制阀元件或致动器在正常行程范围内的运动的大小，以防止阀体，阀元件或 由于超过故障应力极限，执行器。 还公开了一种用这种行程限制结构形成微型阀的方法。

    PROCESS AND STRUCTURE FOR HIGH TEMPERATURE SELECTIVE FUSION BONDING
    7.
    发明申请
    PROCESS AND STRUCTURE FOR HIGH TEMPERATURE SELECTIVE FUSION BONDING 审中-公开
    高温选择性熔合连接的工艺和结构

    公开(公告)号：WO2011094300A3

    公开(公告)日：2011-08-04

    申请号：PCT/US2011/022563

    申请日：2011-01-26

    Applicant: MICROSTAQ, INC. ,  ARUNASALAM, Parthiban

    Inventor： ARUNASALAM, Parthiban

    IPC: H01L21/027

    Abstract: A method to prevent movable structures within a MEMS device, and more specifically, in recesses having one or more dimension in the micrometer range or smaller (i.e., smaller than about 10 microns) from being inadvertently bonded to non-moving structures during a bonding process. The method includes surface preparation of silicon both structurally and chemically to aid in preventing moving structures from bonding to adjacent surfaces during bonding, including during high force, high temperature fusion bonding.

    Abstract translation: 一种防止MEMS器件内的可移动结构的方法，并且更具体地，在具有微米范围内的一个或多个尺寸或更小（即，小于约10微米）的凹陷中防止无意结合到 键合过程中的非移动结构。 该方法包括在结构上和化学上对硅进行表面预处理，以有助于防止在键合期间（包括在高强度，高温熔化键合期间）移动结构键合到相邻表面。

    PROCESS AND STRUCTURE FOR HIGH TEMPERATURE SELECTIVE FUSION BONDING
    8.
    发明申请
    PROCESS AND STRUCTURE FOR HIGH TEMPERATURE SELECTIVE FUSION BONDING 审中-公开
    高温选择性熔融粘结的工艺和结构

    公开(公告)号：WO2011094300A2

    公开(公告)日：2011-08-04

    申请号：PCT/US2011022563

    申请日：2011-01-26

    Applicant: MICROSTAQ INC ,  ARUNASALAM PARTHIBAN

    Inventor： ARUNASALAM PARTHIBAN

    IPC: H01L21/027

    CPC classification number: B81B3/001 ,  B81C1/00269 ,  B81C2203/0118 ,  B81C2203/036

    Abstract: A method to prevent movable structures within a MEMS device, and more specifically, in recesses having one or more dimension in the micrometer range or smaller (i.e., smaller than about 10 microns) from being inadvertently bonded to non-moving structures during a bonding process. The method includes surface preparation of silicon both structurally and chemically to aid in preventing moving structures from bonding to adjacent surfaces during bonding, including during high force, high temperature fusion bonding.

    Abstract translation: 一种用于防止MEMS器件内的可移动结构的方法，更具体地说，在具有在微米范围内或更小（即小于约10微米）的一个或多个维度的凹陷中，在接合过程中不经意地粘合到不移动的结构 。 该方法包括在结构和化学方面对硅进行表面处理，以有助于防止在结合期间移动结构粘合到相邻表面，包括在高强度，高温熔融粘合期间。

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