Abstract:
An improved performance charged beam apparatus and method of improving the performance of charged beam apparatus are provided. The apparatus includes: a chamber having an interior surface; a pump port for evacuating the chamber (170) ; a substrate holder within the chamber (245) ; a charged particle beam within the chamber (250) , the charged beam generated by a source (130) and the charged particle beam striking the substrate; and one or more liners in contact with one or more different regions (A, B, C) of the interior surface of the chamber, the liners preventing material generated by interaction of the charged beam and the substrate from coating the one or more different regions of the interior surface of the chamber.
Abstract:
An improved performance charged beam apparatus and method of improving the performance of charged beam apparatus are provided. The apparatus includes: a chamber having an interior surface; a pump port for evacuating the chamber (170) ; a substrate holder within the chamber (245) ; a charged particle beam within the chamber (250) , the charged beam generated by a source (130) and the charged particle beam striking the substrate; and one or more liners in contact with one or more different regions (A, B, C) of the interior surface of the chamber, the liners preventing material generated by interaction of the charged beam and the substrate from coating the one or more different regions of the interior surface of the chamber.
Abstract:
An improved performance charged beam apparatus and method of improving the performance of charged beam apparatus are provided. The apparatus includes: a chamber having an interior surface; a pump port for evacuating the chamber; a substrate holder within the chamber; a charged particle beam within the chamber, the charged beam generated by a source and the charged particle beam striking the substrate; and one or more liners in contact with one or more different regions of the interior surface of the chamber, the liners preventing material generated by interaction of the charged beam and the substrate from coating the one or more different regions of the interior surface of the chamber.
Abstract:
A method of forming a nitrided silicon oxide layer. The method includes: forming a silicon dioxide layer on a surface (32) of a silicon substrate (30); performing a rapid thermal nitridation of the silicon dioxide layer at a temperature of less than or equal to about 900 °C and a pressure greater than about 500 Torr to form an initial nitrided silicon oxide layer; and performing a rapid thermal oxidation or anneal of the initial nitrided silicon oxide layer at a temperature of less than or equal to about 900 °C and a pressure greater than about 500 Torr to form a nitrided silicon oxide layer (34). Also a method of forming a MOSFET with a nitrided silicon oxide dielectric layer (34).
Abstract:
A method of forming a nitrided silicon oxide layer. The method includes: forming a silicon dioxide layer on a surface (32) of a silicon substrate (30); performing a rapid thermal nitridation of the silicon dioxide layer at a temperature of less than or equal to about 900 °C and a pressure greater than about 500 Torr to form an initial nitrided silicon oxide layer; and performing a rapid thermal oxidation or anneal of the initial nitrided silicon oxide layer at a temperature of less than or equal to about 900 °C and a pressure greater than about 500 Torr to form a nitrided silicon oxide layer (34). Also a method of forming a MOSFET with a nitrided silicon oxide dielectric layer (34).