SEMICONDUCTOR PARTICLE AND METHOD OF MANUFACTURE THEREOF
    1.
    发明申请
    SEMICONDUCTOR PARTICLE AND METHOD OF MANUFACTURE THEREOF 审中-公开
    半导体颗粒及其制造方法

    公开(公告)号:WO2012168790A1

    公开(公告)日:2012-12-13

    申请号:PCT/IB2012/001182

    申请日:2012-05-31

    CPC classification number: H01L21/02568 H01L21/02601 H01L21/02628

    Abstract: A method of manufacturing semiconductor particles includes: preparing a cation mixture by mixing together a copper ion source, a zinc ion source, a tin ion source, a ligand which suppresses bonding reactions between ions, and water (S I); preparing a precursor solution by mixing the prepared cation mixture with a sulfur ion source (S2); placing the prepared precursor solution in a vessel and sealing the vessel containing the precursor solution (S3); and generating a hydrothermal synthesis reaction in the sealed vessel (S4). The semiconductor particles include copper, zinc, tin and sulfur, are observed in X-ray diffraction analysis to have single-phase peaks, and have a particle size equal to or lower than 100 nm.

    Abstract translation: 制造半导体颗粒的方法包括:通过将铜离子源,锌离子源,锡离子源,抑制离子之间的结合反应的配体和水(S I)混合在一起来制备阳离子混合物; 通过将制备的阳离子混合物与硫离子源(S2)混合来制备前体溶液; 将制备的前体溶液置于容器中并密封含有前体溶液的容器(S3); 并在密封容器中产生水热合成反应(S4)。 半导体颗粒包括铜,锌,锡和硫,在X射线衍射分析中观察到具有单相峰,并且具有等于或低于100nm的粒度。

Patent Agency Ranking