VACUUM TRANSITION FOR SOLDER BUMP MOLD FILLING
    1.
    发明申请
    VACUUM TRANSITION FOR SOLDER BUMP MOLD FILLING 审中-公开
    真空过渡焊接模具填充

    公开(公告)号:WO2011028644A2

    公开(公告)日:2011-03-10

    申请号:PCT/US2010/047078

    申请日:2010-08-30

    CPC classification number: B23K3/0623 B23K2201/42

    Abstract: A bond metal injection tool can include a fill head having a sealed chamber for containing a molten bond metal (e.g., solder) and a gas, and a nozzle for directing a flow of the molten bond metal into cavities in a major surface of a mold. A pressure control device can controllably apply pressure within the chamber to eject the bond metal from the nozzle into the cavities. The pressure control device may also controllably reduce a pressure within the chamber to inhibit the bond metal from being ejected from the nozzle, such as when the fill head is being moved onto the mold surface from a parking location or when the fill head is being moved off the mold surface onto a parking location.

    Abstract translation: 键合金属注射工具可包括具有用于容纳熔融键合金属(例如焊料)和气体的密封室的填充头和用于引导熔融键合金属的流动进入 模具主表面中的空腔。 压力控制装置可以可控制地在腔室内施加压力以将粘合金属从喷嘴喷射到空腔中。 压力控制装置还可以可控制地降低腔室内的压力以抑制结合金属从喷嘴喷出,例如当填充头​​从停放位置移动到模具表面上时或当填充头正在移动时 将模具表面放在停车位上。

    VACUUM TRANSITION FOR SOLDER BUMP MOLD FILLING
    2.
    发明申请
    VACUUM TRANSITION FOR SOLDER BUMP MOLD FILLING 审中-公开
    真空过滤器用于焊接模具填充

    公开(公告)号:WO2011028644A3

    公开(公告)日:2011-06-03

    申请号:PCT/US2010047078

    申请日:2010-08-30

    CPC classification number: B23K3/0623 B23K2201/42

    Abstract: A bond metal injection tool can include a fill head having a sealed chamber for containing a molten bond metal (e.g., solder) and a gas, and a nozzle for directing a flow of the molten bond metal into cavities in a major surface of a mold. A pressure control device can controllably apply pressure within the chamber to eject the bond metal from the nozzle into the cavities. The pressure control device may also controllably reduce a pressure within the chamber to inhibit the bond metal from being ejected from the nozzle, such as when the fill head is being moved onto the mold surface from a parking location or when the fill head is being moved off the mold surface onto a parking location.

    Abstract translation: 粘结金属注射工具可以包括具有用于容纳熔融金属(例如焊料)和气体的密封室的填充头,以及用于将熔融粘合金属流引导到模具的主表面中的空腔中的喷嘴 。 压力控制装置可以可控制地在室内施加压力以将接合金属从喷嘴喷射到空腔中。 压力控制装置还可以可控制地减小腔室内的压力以阻止接合金属从喷嘴喷射,例如当填充头​​从停车位置移动到模具表面上时或当填充头被移动时 离开模具表面到停车位置。

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