Abstract:
A cover part of an electronic device and an electronic device. The cover part has a frame (1) with a first surface (8) and a second surface (9) opposite to the first surface. The cover part (25) further comprises first component (4) that is arranged to transmit and/or receive signals, and a connecting element (5) with a signal-transmitting bus that is connected to said first component (4).The connecting element (5) comprises a flexible part (27) arranged to diverge from the cover part (25).
Abstract:
A cover part of an electronic device and an electronic device. The cover part has a frame (1) with a first surface (8) and a second surface (9) opposite to the first surface. The cover part (25) further comprises first component (4) that is arranged to transmit and/or receive signals, and a connecting element (5) with a signal-transmitting bus that is connected to said first component (4).The connecting element (5) comprises a flexible part (27) arranged to diverge from the cover part (25).
Abstract:
An insert (2) is arranged in an injection mould (1 ) and plastic is cast onto the insert (2). The insert (2) comprises at least one electronic component and connector (4) for testing the component. The injection mould (1 ) is provided with a counter connector (5) which is arranged to connect to the connector (4). The condition of the insert (2) is tested by a testing device connected to the counte connector (5) during the injection moulding process.
Abstract:
A printed wiring board, an electronic device and a method for manufacturing a printed wiring board. A printed wiring board (1) comprises an insulating layer (2, 2a, 2b) and a circuit pattern (3, 3a, 3b) arranged on at least one surface of the insulating layer (2, 2a, 2b) and made of a conductive material. At least one surface of the insulating layer (2, 2a, 2b) is provided with a support pattern (6, 6a, 6b), which comprises material lines (7, 7a, 7b) arranged at a distance from each other.
Abstract:
A printed wiring board, an electronic device and a method for manufacturing a printed wiring board. A printed wiring board (1) comprises an insulating layer (2, 2a, 2b) and a circuit pattern (3, 3a, 3b) arranged on at least one surface of the insulating layer (2, 2a, 2b) and made of a conductive material. At least one surface of the insulating layer (2, 2a, 2b) is provided with a support pattern (6, 6a, 6b), which comprises material lines (7, 7a, 7b) arranged at a distance from each other.
Abstract:
A printed circuit board, a method of manufacturing the same, and an electronic device. The printed circuit board comprises at least three conducting layers insulated from one another by insulating layers. Conductive patterns comprising electrically conducting lands are formed from the conducting layers arranged with respect to one another such that every land is at least partly aligned with respect to the other lands. A through-hole-channel is provided through the lands in order to generate an electric contact between the conducting layers. The printed circuit board comprises at least one land whose both sides are provided with at least one land having a smaller surface area.
Abstract:
The invention relates to a method for congestion management in a frame relay network. In the method, a virtual channel associated with a frame (39) to be transferred is determined. In order to provide a congestion management method which is reliable and capable of rapid responding and which allows event virtual connections to be prioritized with respect to the throughput probability, (a) at least some of the virtual channels are assigned a respective service level; (b) a congestion level having values in a predetermined relationship to the values of the service levels is determined for a network resource (15) liable to congestion; (c) the value representing the service level of the virtual channel of the FR frame (39) is compared with the value representing the congestion level of said resource; and (d) when the result of the comparison falls outside a predetermined value range, the frame (39) is discarded.