公开(公告)号：WO03043085A2

公开(公告)日：2003-05-22

申请号：PCT/EP0213209

申请日：2002-10-25

Applicant: IBM ,  IBM FRANCE ,  ALCOE DAVE ,  NOWAK RONALD ,  PREDA FRANCESCO ,  OGGIONI STEFANO SERGIO

Inventor： ALCOE DAVE ,  NOWAK RONALD ,  PREDA FRANCESCO ,  OGGIONI STEFANO SERGIO

IPC: H01L23/12 ,  H01L23/16 ,  H01L23/36 ,  H01L23/498 ,  H01L23/66 ,  H01L25/065 ,  H05K1/02 ,  H05K1/11 ,  H01L25/00

CPC classification number: H05K1/0219 ,  H01L23/16 ,  H01L23/36 ,  H01L23/49822 ,  H01L23/66 ,  H01L25/0655 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01057 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/1903 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/111 ,  H05K2201/09236 ,  H05K2201/09781

Abstract: An electronic device carrier (110) adapted for transmitting high−frequency signals, including a circuitized substrate with a plurality of conductive layers (240a to 240g) insulated from each other, the conductive layers being arranged in a sequence from a first one of the conductive layers (240a) wherein a plurality of signal tracks (200) each one ending with a contact area (205) for transmitting a high−frequency signal are formed, and a reference structure (215a, 215b, 230) connectable to a reference voltage or ground for shielding the signal tracks the reference structure includes at least one reference track (230) formed in a second one of the conductive layers (240b) adjacent to the first conductive layer and at least one further refer­ence track formed in one of the conductive layers (240d) different from the first and second conductive layer, a portion of each signal track excluding at least the area corresponding to the orthographic projection of associated contact area being superimposed in plan view to a corre­sponding reference track and at least a part of the area corresponding to the orthographic projection of the contact area associated to each signal track being superimposed in plan view to a corresponding further reference track with interposition of a floating conductive track, i.e. a track not connected to any signal, reference voltage or ground track.

Abstract translation: 一种电子设备载体（110），其适于传输高频信号，所述高频信号包括具有彼此绝缘的多个导电层（240a至240g）的电路化基板，所述导电层从所述导电层 形成多个信号轨道（200），每个信号轨道（200）各自以用于发送高频信号的接触区域（205）结束，并且可以连接到参考电压的参考结构（215a，215b，230）或 用于屏蔽信号轨道的接地基准结构包括形成在与第一导电层相邻的第二导电层（240b）中的至少一个参考轨道（230）和形成在导电层之一中的至少一个另外的参考轨道 （240d），不同于第一和第二导电层，每个信号轨道的一部分至少排除对应于相关联的接触区域的正投影的区域 在平面图中叠加到对应的参考轨道，并且对应于与每个信号轨道相关联的接触区域的正投影的区域的至少一部分在平面图中被叠加到相应的另外的参考轨道，其中插入浮动导电轨迹 ，即没有连接到任何信号，参考电压或地面轨道的轨道。

公开(公告)号：WO2003043085A3

公开(公告)日：2003-05-22

申请号：PCT/EP2002/013209

申请日：2002-10-25

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION ,  COMPAGNIE IBM FRANCE ,  ALCOE, Dave ,  NOWAK, Ronald ,  PREDA, Francesco ,  OGGIONI, Stefano, Sergio

Inventor： ALCOE, Dave ,  NOWAK, Ronald ,  PREDA, Francesco ,  OGGIONI, Stefano, Sergio

IPC: H01L23/498

Abstract: An electronic device carrier (110) adapted for transmitting high-frequency signals, including a circuitized substrate with a plurality of conductive layers (240a to 240g) insulated from each other, the conductive layers being arranged in a sequence from a first one of the conductive layers (240a) wherein a plurality of signal tracks (200) each one ending with a contact area (205) for transmitting a high-frequency signal are formed, and a reference structure (215a, 215b, 230) connectable to a reference voltage or ground for shielding the signal tracks the reference structure includes at least one reference track (230) formed in a second one of the conductive layers (240b) adjacent to the first conductive layer and at least one further refer­ence track formed in one of the conductive layers (240d) different from the first and second conductive layer, a portion of each signal track excluding at least the area corresponding to the orthographic projection of associated contact area being superimposed in plan view to a corre­sponding reference track and at least a part of the area corresponding to the orthographic projection of the contact area associated to each signal track being superimposed in plan view to a corresponding further reference track with interposition of a floating conductive track, i.e. a track not connected to any signal, reference voltage or ground track.