公开(公告)号：WO2013032664A2

公开(公告)日：2013-03-07

申请号：PCT/US2012/050253

申请日：2012-08-10

Applicant: ALCATEL LUCENT ,  SALAMON, Todd Richard ,  RAMSEY, David Andrew

Inventor： SALAMON, Todd Richard ,  RAMSEY, David Andrew

IPC: H05K7/20 ,  H01L23/36

CPC classification number: F28D15/02 ,  H01L23/3672 ,  H01L23/467 ,  H01L23/473 ,  H01L2924/0002 ,  Y10T29/49826 ,  H01L2924/00

Abstract: An apparatus includes a heat sink with a complex 3D structure. The heat sink includes a stack of metal layers. The metal layers are mechanically connected together and being separated by physical interface regions. The stack has array of channels for carrying fluid through the stack. Each channel of the array has a lateral surface formed by portions of more than one of the metal layers.

Abstract translation: 一种装置包括具有复杂3D结构的散热器。 散热器包括一叠金属层。 金属层机械地连接在一起并由物理界面区域分离。 该堆叠具有用于承载通过堆叠的流体的通道阵列。 阵列的每个通道具有由多于一个金属层的部分形成的侧表面。

公开(公告)号：WO2013032664A3

公开(公告)日：2013-04-25

申请号：PCT/US2012050253

申请日：2012-08-10

Applicant: ALCATEL LUCENT ,  SALAMON TODD RICHARD ,  RAMSEY DAVID ANDREW

Inventor： SALAMON TODD RICHARD ,  RAMSEY DAVID ANDREW

IPC: H05K7/20 ,  H01L23/36

CPC classification number: F28D15/02 ,  H01L23/3672 ,  H01L23/467 ,  H01L23/473 ,  H01L2924/0002 ,  Y10T29/49826 ,  H01L2924/00

Abstract: An apparatus includes a heat sink with a complex 3D structure. The heat sink includes a stack of metal layers. The metal layers are mechanically connected together and being separated by physical interface regions. The stack has array of channels for carrying fluid through the stack. Each channel of the array has a lateral surface formed by portions of more than one of the metal layers.

Abstract translation: 一种设备包括具有复杂3D结构的散热器。 散热器包括一堆金属层。 金属层机械连接在一起并被物理界面区域分开。 该堆叠具有用于承载流体通过堆叠的通道阵列。 阵列的每个通道具有由多于一个金属层的部分形成的侧表面。