RECEPTACULO CONTENEDOR PARA SUPOSITORIOS Y SIMILARES.

    公开(公告)号:ES1016576U

    公开(公告)日:1991-11-16

    申请号:ES9100630

    申请日:1991-03-01

    Inventor: ARMETTI MASSIMO

    Abstract: RECEPTACULO CONTENEDOR PARA SUPOSITORIOS Y SIMILARES, DEL TIPO CONSTITUIDO POR AL MENOS DOS HOJAS (20) SELLADAS ENTRE SI DE MODO QUE DEFINAN, EN FASES OPERATIVAS SUCESIVAS, AL MENOS UN ASIENTO (1), COMUNICANDO ESTE ULTIMO CON EL EXTERIOR Y SIENDO CAPAZ DE RECIBIR UN CORRESPONDIENTE SUPOSITORIO (10), EN UNA PRIMERA FASE OPERATIVA, QUEDANDO DICHO ASIENTO AISLADO DEL EXTERIOR, EN UNA SEGUNDA FASE OPERATIVA, MEDIANTE SELLADO, PRESENTANDO DICGAS HOJAS (20), ADEMAS, RESPECTIVOS BORDES (2) ENFRENTADOS PERO SEPARADOS, ESTANDO CARACTERIZADO DICHO RECEPTACULO CONTENEDOR (100) POR EL HECHO DE QUE DICHOS BORDES (2) SON POR LO MENOS UNO PARA CADA HOJA (20) Y DEFINEN RESPECTIVAS ZONAS (2A) DE SUJECION EN RELIEVE, VUELTAS HACIA PARTES OPUESTAS, POR LO MENOS UNA POR CADA BORDE (2), SIENDO DICHAS ZONAS 92A) DE SUJECION CAPACES DE SER SUJETAS PARA PERMITIR LA SEPARACION DE DICHAS HOJAS (100), ESTANDO DETERMINADA DICHA SEPARACION POR LA SEPARACION DE DICHOS BORDES (2), IMPUESTA EN CORRESPONDENCIA CON DICHAS ZONAS (2A) DE SUJECION.

    PAPER DOCUMENT INCORPORATING A RADIOFREQUENCY IDENTIFICATION DEVICE
    3.
    发明申请
    PAPER DOCUMENT INCORPORATING A RADIOFREQUENCY IDENTIFICATION DEVICE 审中-公开
    兼容无线电识别装置的纸质文件

    公开(公告)号:WO2006079904A1

    公开(公告)日:2006-08-03

    申请号:PCT/IB2006/000136

    申请日:2006-01-27

    Inventor: LOLLI, Marcello

    CPC classification number: G06K19/07722 G06K19/07749

    Abstract: A paper document (1), wherein a radiofrequency identifying device (4) comprising an antenna (5) and a microchip (6) is incorporated, comprises a first element (2) in plastic-coated paper and a second element (3) in plastic-coated paper between which the radiofrequency identifying device (4) is enclosed, said antenna (5) being made of a wire in electrically conductive material.

    Abstract translation: 一种纸文件(1),其中结合有包括天线(5)和微芯片(6)的射频识别装置(4),其包括塑料涂布纸中的第一元件(2)和第二元件(3) 封闭有射频识别装置(4)的塑料涂布纸,所述天线(5)由导电材料的导线制成。

    AUXILIARY DEVICE FOR BIDIRECTIONAL OPENING OF WINGS OF DOORS, WINDOWS, OR THE LIKE
    4.
    发明申请
    AUXILIARY DEVICE FOR BIDIRECTIONAL OPENING OF WINGS OF DOORS, WINDOWS, OR THE LIKE 审中-公开
    用于双门打开门,窗或类似物的辅助装置

    公开(公告)号:WO2005090725A1

    公开(公告)日:2005-09-29

    申请号:PCT/IB2005/000577

    申请日:2005-03-08

    Abstract: The present invention relates to a device (1) for facilitating the bidirectional opening of leaves of door or similar structures, which can be housed all through the extension thereof within a seat (17) inside each leaf (9) and comprising a lobed pivot (4) being fastened to the frame (8) of the door and a tracer element (5) pressed against the lobed element (4) with an adjustable pressure. The number and location of the lobes (10) along the outer perimeter of the lobed element (4) define the open/closed preset positions for the leaf (9).

    Abstract translation: 本发明涉及一种用于促进门或类似结构的叶片的双向打开的装置(1),其可以全部通过其延伸部收纳在每个叶片(9)内部的座(17)内并且包括叶片枢轴 4)被紧固到门的框架(8)和以可调节的压力压靠在叶片元件(4)上的示踪元件(5)。 叶片(10)沿着叶片元件(4)的外周边的数量和位置限定了叶片(9)的打开/关闭的预设位置。

    SOLAR MODULE
    5.
    发明申请
    SOLAR MODULE 审中-公开
    太阳能模块

    公开(公告)号:WO2012172584A1

    公开(公告)日:2012-12-20

    申请号:PCT/IT2012/000176

    申请日:2012-06-12

    CPC classification number: H01L35/32

    Abstract: The present invention relates to a solar module (1) comprising a plurality of superimposed layers (13, 2, 14, 2', 15, 2'', 16), among which a first layer (13), exposed to the heat is made up of a thermal conductor material, i.e. glass, at least one second layer (2; 2'; 2'') is electrically insulated, said second layer (2; 2'; 2'') providing a first side (3) which is exposed to heat and a second side (4) which dissipates heat, each of said first (3) and second (4) sides providing at least two plates (10, 12, 10', 12', 10'', 12'') made up of a material with high thermal conductivity, said at least two plates (10, 10', 10'') of said first side (3) being connected to corresponding said at least two plates (12, 12', 12'') of said second side (4) respectively by means of a first cable (8) electronically positive and a second cable (9) electronically negative, said first (8) and second (9) cables being welded together at a point (11).

    Abstract translation: 本发明涉及包括多个重叠层(13,2,14,2',15“2”,16“)的太阳能模块(1),其中暴露于热的第一层(13)是 由热导体材料(即玻璃)组成,至少一个第二层(2; 2'; 2“)被电绝缘,所述第二层(2; 2'; 2”)提供第一侧面(3) 每个所述第一(3)和第二(4)侧提供至少两个板(10,12,10',12',10“,12),所述第二侧(4)散热, 所述第一侧(3)的至少两个板(10,10',10“)与相应的所述至少两个板(12,12', 分别通过电子正的第一电缆(8)和电子负极的第二电缆(9)将所述第二侧(4)的所述第二侧(4)的所述第二侧(4) (11)。

    SYSTEM FOR MULTIPLE REMOVAL OF MICROCHIPS FROM A WAFER CONSISTING OF A PLURALITY OF MICROCHIPS
    6.
    发明申请
    SYSTEM FOR MULTIPLE REMOVAL OF MICROCHIPS FROM A WAFER CONSISTING OF A PLURALITY OF MICROCHIPS 审中-公开
    从大量微量元素中分离出多个微量元素的系统

    公开(公告)号:WO2006063652A1

    公开(公告)日:2006-06-22

    申请号:PCT/EP2005/012323

    申请日:2005-11-17

    Inventor: LOLLI, Marcello

    CPC classification number: H01L21/67132

    Abstract: A device for removing microchips (2) from a wafer (1) placed on a support element (5), comprising lifting means (6) of said microchips (2) associated with said support element (5), removing means (7) of said microchips (2) and transferring means (11) of said microchips (2), said lifting means comprises a plurality of lifting elements (6) and said removing means (7) comprises a plurality of gripping elements (8). A method of removing microchips (2) from a wafer (1) placed on a substratum (3), said method comprising arranging said substratum (3) with said wafer (1) on a support element. (5), positioning said support element (5) to bring a first microchip to a removing position, raising a plurality of microchips (2) in sequence or simultaneously from said substratum and removing the microchips (2) of said plurality of microchips in sequence or simultaneously.

    Abstract translation: 一种用于从放置在支撑元件(5)上的晶片(1)移除微芯片(2)的装置,包括与所述支撑元件(5)相关联的所述微芯片(2)的提升装置(6),去除装置 所述微芯片(2)和所述微芯片(2)的转印装置(11),所述提升装置包括多个提升元件(6),所述移除装置(7)包括多个夹紧元件(8)。 一种从放置在基底(3)上的晶片(1)移除微芯片(2)的方法,所述方法包括将所述基底(3)与所述晶片(1)布置在支撑元件上。 (5),定位所述支撑元件(5)以将第一微芯片带到去除位置,依次或同时地从所述基底上升多个微芯片(2),并依次去除所述多个微芯片的微芯片(2) 或同时。

    APPARATUS AND METHOD FOR MAKING AN ANTENNA FOR A RADIOFREQUENCY IDENTIFYING DEVICE
    7.
    发明申请
    APPARATUS AND METHOD FOR MAKING AN ANTENNA FOR A RADIOFREQUENCY IDENTIFYING DEVICE 审中-公开
    用于制造无线电识别装置的天线的装置和方法

    公开(公告)号:WO2006079913A1

    公开(公告)日:2006-08-03

    申请号:PCT/IB2006/000156

    申请日:2006-01-27

    Inventor: LOLLI, Marcello

    Abstract: An apparatus (1) for making an antenna for wire transponders (7) of electrically conductive material, comprising depositing means (6; 6') for depositing said wire on a substrate (8) placed on support means (9), said depositing means (6; 6') and said substrate (8) being movable with respect to each other; said support means (9) being movable along directions parallel to at least two axis of a Cartesian reference system. A method for making an antenna comprising providing a substrate (8) intended to receive said antenna, providing a lamina or wire (19) of electrically conductive material wound on at least one reel (18), unwinding said lamina (19), or said wire (19a) from said at least one reel (18; 18a), pressing said lamina, or wire, (19) on a surface of said substrate (8) by means of pressing means (22), fixing said lamina, or wire, (19), to said substrate (8), separating, by means of cutting means (23) a stretch of lamina, or wire, (19), fixed to said substrate (8) from the remaining lamina, or wire, (19) wound on said reel (18), said substrate (8) being movable with respect to an assembly comprised of said at least one reel (18), said pressing means (22) and said cutting means (24), along at least one direction substantially parallel to an axis of a Cartesian reference system.

    Abstract translation: 一种用于制造用于导电材料的线转发器(7)的天线的装置(1),包括用于在放置在支撑装置(9)上的基底(8)上沉积所述线的沉积装置(6; 6'),所述沉积装置 (6; 6')和所述基板(8)可相对于彼此移动; 所述支撑装置(9)能够平行于笛卡尔参考系统的至少两个轴线的方向移动。 一种用于制造天线的方法,包括提供旨在接收所述天线的基板(8),提供卷绕在至少一个卷轴(18)上的导电材料的薄片或导线(19),展开所述薄片(19)或所述 从所述至少一个卷轴(18; 18a)的线(19a),通过压制装置(22)将所述薄片或线(19)压在所述基底(8)的表面上,固定所述薄片或线 (19),通过切割装置(23)从剩余的层或电线(19)分离固定到所述基板(8)上的一段薄片或线(19),(19) 19),所述基板(8)能够相对于包括所述至少一个卷轴(18),所述按压装置(22)和所述切割装置(24)的组件至少可移动 一个方向基本上平行于笛卡尔参考系的轴。

    APPARATUS AND METHOD FOR MAKING AN ANTENNA FOR A RADIOFREQUENCY IDENTIFYING DEVICE
    8.
    发明公开
    APPARATUS AND METHOD FOR MAKING AN ANTENNA FOR A RADIOFREQUENCY IDENTIFYING DEVICE 有权
    装置和方法用于制造天线,用于射频识别装置

    公开(公告)号:EP1842405A1

    公开(公告)日:2007-10-10

    申请号:EP06710281.4

    申请日:2006-01-27

    Inventor: LOLLI, Marcello

    Abstract: An apparatus (1) for making an antenna for wire transponders (7) of electrically conductive material, comprising depositing means (6; 6') for depositing said wire on a substrate (8) placed on support means (9), said depositing means (6; 6') and said substrate (8) being movable with respect to each other; said support means (9) being movable along directions parallel to at least two axis of a Cartesian reference system. A method for making an antenna comprising providing a substrate (8) intended to receive said antenna, providing a lamina or wire (19) of electrically conductive material wound on at least one reel (18), unwinding said lamina (19), or said wire (19a) from said at least one reel (18; 18a), pressing said lamina, or wire, (19) on a surface of said substrate (8) by means of pressing means (22), fixing said lamina, or wire, (19), to said substrate (8), separating, by means of cutting means (23) a stretch of lamina, or wire, (19), fixed to said substrate (8) from the remaining lamina, or wire, (19) wound on said reel (18), said substrate (8) being movable with respect to an assembly comprised of said at least one reel (18), said pressing means (22) and said cutting means (24), along at least one direction substantially parallel to an axis of a Cartesian reference system.

    SYSTEM FOR MULTIPLE REMOVAL OF MICROCHIPS FROM A WAFER CONSISTING OF A PLURALITY OF MICROCHIPS
    10.
    发明公开
    SYSTEM FOR MULTIPLE REMOVAL OF MICROCHIPS FROM A WAFER CONSISTING OF A PLURALITY OF MICROCHIPS 审中-公开
    SYSTEM FOR MICROCHIP中的一种多种Microchip现有晶圆的多个移除

    公开(公告)号:EP1825499A1

    公开(公告)日:2007-08-29

    申请号:EP05810361.5

    申请日:2005-11-17

    Inventor: LOLLI, Marcello

    CPC classification number: H01L21/67132

    Abstract: A device for removing microchips (2) from a wafer (1) placed on a support element (5), comprising lifting means (6) of said microchips (2) associated with said support element (5), removing means (7) of said microchips (2) and transferring means (11) of said microchips (2), said lifting means comprises a plurality of lifting elements (6) and said removing means (7) comprises a plurality of gripping elements (8). A method of removing microchips (2) from a wafer (1) placed on a substratum (3), said method comprising arranging said substratum (3) with said wafer (1) on a support element. (5), positioning said support element (5) to bring a first microchip to a removing position, raising a plurality of microchips (2) in sequence or simultaneously from said substratum and removing the microchips (2) of said plurality of microchips in sequence or simultaneously.

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