DIMENSIONAL SILICA-BASED POROUS SILICON STRUCTURES AND METHODS OF FABRICATION
    5.
    发明申请
    DIMENSIONAL SILICA-BASED POROUS SILICON STRUCTURES AND METHODS OF FABRICATION 审中-公开
    二维硅基多孔硅结构和制造方法

    公开(公告)号:WO2012027121A2

    公开(公告)日:2012-03-01

    申请号:PCT/US2011/047367

    申请日:2011-08-11

    Abstract: Methods of fabricating dimensional silica-based substrates or structures comprising a porous silicon layers are contemplated. According to one embodiment, oxygen is extracted from the atomic elemental composition of a silica glass substrate by reacting a metallic gas with the substrate in a heated inert atmosphere to form a metal-oxygen complex along a surface of the substrate. The metal-oxygen complex is removed from the surface of the silica glass substrate to yield a crystalline porous silicon surface portion and one or more additional layers are formed over the crystalline porous silicon surface portion of the silica glass substrate to yield a dimensional silica-based substrate or structure comprising the porous silicon layer. Embodiments are also contemplated where the substrate is glass-based, but is not necessarily a silica-based glass substrate. Additional embodiments are disclosed and claimed.

    Abstract translation: 考虑制造尺寸二氧化硅基衬底或包含多孔硅层的结构的方法。 根据一个实施例,通过在加热的惰性气氛中使金属气体与衬底反应以沿着衬底的表面形成金属 - 氧复合物,从二氧化硅玻璃衬底的原子元素组合物中提取氧。 将金属 - 氧复合物从二氧化硅玻璃基材的表面去除以产生结晶多孔硅表面部分,并且在石英玻璃基材的结晶多孔硅表面部分上形成一个或多个另外的层,以产生基于二氧化硅的尺寸 基材或包含多孔硅层的结构。 也考虑了其中衬底是基于玻璃的,但不一定是二氧化硅基玻璃衬底的实施例。 另外的实施例被公开和要求保护。

    PLANAR WAVEGUIDE AND OPTICAL FIBER COUPLING
    6.
    发明申请
    PLANAR WAVEGUIDE AND OPTICAL FIBER COUPLING 审中-公开
    平面波导和光纤耦合

    公开(公告)号:WO2011066122A3

    公开(公告)日:2011-08-04

    申请号:PCT/US2010056670

    申请日:2010-11-15

    Abstract: An apparatus for optically coupling light between optical transmission components is provided. The apparatus includes first and second optical transmission components wherein the first optical transmission component includes a planar optical waveguide (102), a grating coupler (106), and a transparent substrate (104) and the second optical transmission component includes an optical fiber (120). Preferably, the planar optical waveguide includes silicon and the transparent substrate includes glass. Methods for coupling light between optical transmission components are also provided.

    Abstract translation: 提供了一种用于在光传输部件之间光耦合光的装置。 该装置包括第一和第二光传输部件,其中第一光传输部件包括平面光波导(102),光栅耦合器(106)和透明基板(104),第二光传输部件包括光纤 )。 优选地,平面光波导包括硅,并且透明基板包括玻璃。 还提供了用于在光传输部件之间耦合光的方法。

    PLANAR WAVEGUIDE AND OPTICAL FIBER COUPLING
    7.
    发明申请
    PLANAR WAVEGUIDE AND OPTICAL FIBER COUPLING 审中-公开
    平面波导和光纤耦合

    公开(公告)号:WO2011066122A2

    公开(公告)日:2011-06-03

    申请号:PCT/US2010/056670

    申请日:2010-11-15

    Abstract: An apparatus for optically coupling light between optical transmission components is provided. The apparatus includes first and second optical transmission components wherein the first optical transmission component includes a planar optical waveguide, a grating coupler, and a transparent substrate and the second optical transmission component includes an optical fiber. Preferably, the planar optical waveguide includes silicon and the transparent substrate includes glass. Methods for coupling light between optical transmission components are also provided.

    Abstract translation: 提供了一种用于在光传输部件之间光耦合光的装置。 该装置包括第一和第二光传输部件,其中第一光传输部件包括平面光波导,光栅耦合器和透明基板,第二光传输部件包括光纤。 优选地,平面光波导包括硅,并且透明基板包括玻璃。 还提供了用于在光传输部件之间耦合光的方法。

    METHODS AND APPARATUS FOR PACKAGING ELECTRONIC COMPONENTS

    公开(公告)号:WO2009073102A3

    公开(公告)日:2009-06-11

    申请号:PCT/US2008/013062

    申请日:2008-11-24

    Abstract: Packages for elements, e.g., OLEDs, that are temperature sensitive are provided. The packages have a first glass substrate (12), a second glass substrate (16), and a wall (14) that separates the first and second substrates (12, 16) and hermetically seals at least one temperature sensitive element (18, 28, 36) between the substrates (12, 16). The wall (14) comprises a sintered frit and at least a portion of the wall is laser sealed to the second substrate (16) by melting a glass component of the sintered frit. The minimum width (40) of the laser-sealed portion of the wall (14) at any location along the wall (14) is greater than or equal to 2 millimeters so as to provide greater hermeticity and strength to the package. The laser sealing is performed without substantially degrading the temperature sensitive element(s) (18, 28, 36) housed in the package.

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