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    LED LIGHTING APPARATUS, SYSTEMS AND METHODS OF MANUFACTURE
    1.
    发明申请
    LED LIGHTING APPARATUS, SYSTEMS AND METHODS OF MANUFACTURE 审中-公开
    LED照明设备，系统和制造方法

    公开(公告)号：WO2013002946A1

    公开(公告)日：2013-01-03

    申请号：PCT/US2012/040285

    申请日：2012-05-31

    Applicant: OSRAM SYLVANIA INC. ,  HAMBY, David W. ,  SCOTCH, Adam M. ,  SELVERIAN, John H.

    Inventor： HAMBY, David W. ,  SCOTCH, Adam M. ,  SELVERIAN, John H.

    IPC: F21V5/00

    CPC classification number: F21V5/007 ,  F21K9/20 ,  F21K9/64 ,  F21V17/16 ,  F21Y2105/10 ,  F21Y2115/10

    Abstract: A light emitting diode (LED) lighting apparatus including an array of first optic elements overlying an array of LED chips, wherein each of the LED chips is configured to emit light of a first wavelength range through a light emitting surface of the overlying first optic element. The array of first optic elements are also underlying an array of second optic elements, wherein each of the second optic elements is configured to convert light of the first wavelength range to be emitted through the light emitting surface of the underlying first optic element to light of a second wavelength range different from the first wavelength range.

    Abstract translation: 一种发光二极管（LED）照明装置，包括覆盖LED芯片阵列的第一光学元件的阵列，其中每个LED芯片被配置为通过覆盖的第一光学元件的发光表面发射第一波长范围的光 。 第一光学元件的阵列也在第二光学元件的阵列的下面，其中每个第二光学元件被配置成将要通过下面的第一光学元件的发光表面发射的第一波长范围的光转换成 与第一波长范围不同的第二波长范围。

    WAVELENGTH CONVERTER FOR AN LED, METHOD OF MAKING, AND LED CONTAINING SAME
    2.
    发明申请
    WAVELENGTH CONVERTER FOR AN LED, METHOD OF MAKING, AND LED CONTAINING SAME 审中-公开
    用于LED的波长转换器，制造方法和包含其的LED

    公开(公告)号：WO2012106282A1

    公开(公告)日：2012-08-09

    申请号：PCT/US2012/023222

    申请日：2012-01-31

    Applicant: OSRAM SYLVANIA Inc. ,  KUNDALIYA, Darshan ,  SCOTCH, Adam M. ,  RAUKAS, Madis ,  HAMBY, David ,  MISHRA, Kalish ,  STOUGH, Matthew

    Inventor： KUNDALIYA, Darshan ,  SCOTCH, Adam M. ,  RAUKAS, Madis ,  HAMBY, David ,  MISHRA, Kalish ,  STOUGH, Matthew

    IPC: C09K11/77

    CPC classification number: H01L33/502 ,  C09K11/7701 ,  C09K11/7721 ,  C09K11/7774 ,  C30B23/025 ,  C30B23/066 ,  C30B29/68 ,  Y10T428/24942

    Abstract: A wavelength converter for an LED is described that comprises a substrate of monocrystalline garnet having a cubic crystal structure, a first lattice parameter and an oriented crystal face. An epitaxial layer is formed directly on the oriented crystal face of the substrate. The layer is comprised of a monocrystalline garnet phosphor having a cubic crystal structure and a second lattice parameter that is different from the first lattice parameter wherein the difference between the first lattice parameter and the second lattice parameter results in a lattice mismatch within a range of 15%. The strain induced in the phosphor layer by the lattice mismatch shifts the emission of the phosphor to longer wavelengths when a tensile strain is induced and to shorter wavelengths when a compressive strain is induced. Preferably, the wavelength converter is mounted on the light emitting surface of a blue LED to produce an LED light source.

    Abstract translation: 描述了一种用于LED的波长转换器，其包括具有立方晶体结构的单晶石榴石基底，第一晶格参数和取向晶体面。 外延层直接形成在基板的取向晶面上。 该层由具有立方晶体结构的单晶石榴石荧光体和不同于第一晶格参数的第二晶格参数组成，其中第一晶格参数和第二晶格参数之间的差异导致在15的范围内的晶格失配 ％。 通过晶格失配在荧光体层中诱发的应变当诱发拉伸应变时将磷光体的发射移动到更长的波长，并且当产生压缩应变时将其发射到较短的波长。 优选地，波长转换器安装在蓝色LED的发光表面上以产生LED光源。

    CERAMIC HEAT PIPE WITH POROUS CERAMIC WICK
    3.
    发明申请
    CERAMIC HEAT PIPE WITH POROUS CERAMIC WICK 审中-公开
    陶瓷热管与多孔陶瓷砖

    公开(公告)号：WO2010039358A3

    公开(公告)日：2010-05-27

    申请号：PCT/US2009054846

    申请日：2009-08-25

    Applicant: OSRAM SYLVANIA INC 1 6 ,  KOENIGSBERG WILLIAM D ,  SCOTCH ADAM M ,  HAMBY DAVID W ,  SELVERIAN JOHN H ,  WENTZEL DAVID

    Inventor： KOENIGSBERG WILLIAM D ,  SCOTCH ADAM M ,  HAMBY DAVID W ,  SELVERIAN JOHN H ,  WENTZEL DAVID

    IPC: H01L23/427 ,  H01L33/64

    CPC classification number: F21V29/51 ,  F21V29/004 ,  F21V29/006 ,  F21V29/83 ,  F21V29/86 ,  F28D15/046 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A heat pipe for transporting heat from light emitting elements includes a sealed body made of a non-porous ceramic, a vapor channel inside the body that extends between two heat transfer locations spaced apart on an exterior surface of the body, a ceramic wick inside the body that extends between the two heat transfer locations, and a working fluid that partially fills the vapor transport channel. In a method of making this heat pipe, the body and wick are desirably formed together as a seamless monolithic structure made of the same ceramic material. Using a ceramic makes the heat pipe corrosion resistant and allows electrical components like LEDs to be mounted directly on the body because the ceramic is a dielectric.

    Abstract translation: 用于从发光元件传送热量的热管包括由无孔陶瓷制成的密封体，在体内的蒸气通道，其在身体的外表面上间隔开的两个传热位置之间延伸，内部的陶瓷芯 本体在两个传热位置之间延伸，以及部分填充蒸汽输送通道的工作流体。 在制造这种热管的方法中，理想地将主体和灯芯一起形成为由相同陶瓷材料制成的无缝整体结构。 使用陶瓷使得热管耐腐蚀，并且允许诸如LED的电气部件直接安装在主体上，因为陶瓷是电介质。

    LED LIGHTING APPARATUS, SYSTEMS AND METHODS OF MANUFACTURE
    4.
    发明申请
    LED LIGHTING APPARATUS, SYSTEMS AND METHODS OF MANUFACTURE 审中-公开
    LED照明设备，系统和制造方法

    公开(公告)号：WO2013002945A1

    公开(公告)日：2013-01-03

    申请号：PCT/US2012/040281

    申请日：2012-05-31

    Applicant: OSRAM SYLVANIA Inc. ,  HAMBY, David, W. ,  SCOTCH, Adam, M. ,  SELVERIAN, John, H.

    Inventor： HAMBY, David, W. ,  SCOTCH, Adam, M. ,  SELVERIAN, John, H.

    IPC: F21V19/00 ,  H01R13/03 ,  H05K1/02 ,  F21Y105/00 ,  H01R12/00

    CPC classification number: F21V23/06 ,  F21K9/20 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01R12/714 ,  H05K1/0209 ,  H05K1/111 ,  H05K1/117 ,  H05K2201/10106 ,  Y02P70/611 ,  Y10T29/49147

    Abstract: A light emitting diode (LED) lighting system including a lighting apparatus (100) comprising at least one printed circuit board (120) having an array of light emitting diode (LED) chips (108) mounted thereto, the printed circuit board (120) including a segmented conductor pathway (128) configured to electrically couple at least a portion of the array of LED chips (108), and a portion of the printed circuit board (120) forming a card edge connector (132), the card edge connector including a portion of the segmented conductor pathway (128) which provides an electrical contact (136, 140) configured to electrically couple the segmented conductor pathway to a power source.

    Abstract translation: 一种发光二极管（LED）照明系统，包括具有安装在其上的发光二极管（LED）芯片阵列的至少一个印刷电路板（120）的照明装置（100），所述印刷电路板（120） 包括被配置为电耦合所述LED芯片阵列（108）的至少一部分的分段导体路径（128）和形成卡缘连接器（132）的所述印刷电路板（120）的一部分，所述卡缘连接器 包括分段导体路径（128）的一部分，其提供被配置为将分段的导体路径电耦合到电源的电接触（136,140）。

    CERAMIC HEAT PIPE WITH POROUS CERAMIC WICK
    8.
    发明申请
    CERAMIC HEAT PIPE WITH POROUS CERAMIC WICK 审中-公开
    带多孔陶瓷芯的陶瓷热管

    公开(公告)号：WO2010039358A2

    公开(公告)日：2010-04-08

    申请号：PCT/US2009054846

    申请日：2009-08-25

    Applicant: OSRAM SYLVANIA INC 1 6 ,  KOENIGSBERG WILLIAM D ,  SCOTCH ADAM M ,  HAMBY DAVID W ,  SELVERIAN JOHN H ,  WENTZEL DAVID

    Inventor： KOENIGSBERG WILLIAM D ,  SCOTCH ADAM M ,  HAMBY DAVID W ,  SELVERIAN JOHN H ,  WENTZEL DAVID

    IPC: H01L23/427 ,  H01L33/64

    CPC classification number: F21V29/51 ,  F21V29/004 ,  F21V29/006 ,  F21V29/83 ,  F21V29/86 ,  F28D15/046 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A heat pipe for transporting heat from light emitting elements includes a sealed body made of a non-porous ceramic, a vapor channel inside the body that extends between two heat transfer locations spaced apart on an exterior surface of the body, a ceramic wick inside the body that extends between the two heat transfer locations, and a working fluid that partially fills the vapor transport channel. In a method of making this heat pipe, the body and wick are desirably formed together as a seamless monolithic structure made of the same ceramic material. Using a ceramic makes the heat pipe corrosion resistant and allows electrical components like LEDs to be mounted directly on the body because the ceramic is a dielectric.

    Abstract translation: 用于从发光元件传输热量的热管包括由无孔陶瓷制成的密封体，位于主体内部的蒸气通道，该蒸气通道在主体的外表面上间隔开的两个传热位置之间延伸， 在两个传热位置之间延伸的主体以及部分地填充蒸气传输通道的工作流体。 在制造这种热管的方法中，主体和吸芯理想地一起形成为由相同陶瓷材料制成的无缝整体结构。 使用陶瓷使得热管具有耐腐蚀性，并允许像LED那样的电气部件直接安装在主体上，因为陶瓷是电介质。

    LED WITH LIGHT TRANSMISSIVE HEAT SINK
    10.
    发明申请
    LED WITH LIGHT TRANSMISSIVE HEAT SINK 审中-公开
    带有透光散热片的LED

    公开(公告)号：WO2007044472A3

    公开(公告)日：2007-11-22

    申请号：PCT/US2006038994

    申请日：2006-10-06

    Applicant: OSRAM SYLVANIA INC ,  SCOTCH ADAM M ,  WEI GEORGE C

    Inventor： SCOTCH ADAM M ,  WEI GEORGE C

    IPC: H01L33/48 ,  H01L33/58 ,  H01L33/64

    CPC classification number: H01L33/641 ,  H01L25/0753 ,  H01L33/483 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: An more efficient or higher luminance LED assembly may be formed from a high power LED chip having a first surface, and a second surface, the first surface being mounted to a substrate; the second surface being in intimate thermal contact with a light transmissive heat sink having a thermal conductivity greater than 30 watts per meter-Kelvin. The LED chip is otherwise in electrical contact with at least a first electrical connection and a second electrical connection for powering the LED chip. Providing light transmissive heat sink can double the heat conduction from the LED dies thereby increasing life, or efficiency or luminance or a balance of the three.

    Abstract translation: 更高效或更高亮度的LED组件可以由具有第一表面和第二表面的高功率LED芯片形成，所述第一表面安装到衬底; 第二表面与具有大于30瓦每米开尔文的导热率的透光散热器紧密热接触。 否则，LED芯片与用于为LED芯片供电的至少第一电连接和第二电连接电接触。 提供透光散热片可以使来自LED晶粒的热传导加倍，从而增加寿命或效率或亮度或三者的平衡。

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