公开(公告)号：WO2007146582A3

公开(公告)日：2009-03-19

申请号：PCT/US2007069806

申请日：2007-05-25

Applicant: FORMFACTOR INC ,  MILLER CHARLES A ,  SPORCK A NICHOLAS ,  ELDRIDGE BENJAMIN N

Inventor： MILLER CHARLES A ,  SPORCK A NICHOLAS ,  ELDRIDGE BENJAMIN N

IPC: G01R31/02

CPC classification number: G01R1/06711 ,  G01R1/06727 ,  G01R1/07 ,  G01R31/3025

Abstract: A probe for contacting and testing ICs on a semiconductor device includes a dielectric insulating material tip. The dielectric tip does not contaminate the surface being probed unlike metal probe tips. A contact scrub is further not required with signals being capacitively or inductively coupled from the probe tip to the IC. Testing can be performed during early fabrication steps of the wafer without the need for applying a metalization layer to the wafer to form bond pads. Testing can be performed by inductively coupling an AC signal to the probe tip, with coupling enhanced by including a magnetic material in the dielectric probe tip. Using an AC test signal enables testing of ICs without requiring separate power and ground connections.

Abstract translation: 用于在半导体器件上接触和测试IC的探针包括介电绝缘材料尖端。 与金属探针尖端不同，电介质尖端不会污染被探测的表面。 进一步不需要接触擦洗，信号从探头尖端到IC电容或电感耦合。 可以在晶片的早期制造步骤期间进行测试，而不需要将金属化层施加到晶片以形成接合焊盘。 可以通过将AC信号电感耦合到探针尖端来进行测试，通过在介电探针尖端中包括磁性材料来增强耦合。 使用AC测试信号可以测试IC，而不需要单独的电源和接地连接。

公开(公告)号：WO2008028171A2

公开(公告)日：2008-03-06

申请号：PCT/US2007/077467

申请日：2007-09-01

Applicant: FORMFACTOR, INC. ,  SPORCK, A., Nicholas ,  HENSON, Roy, J.

Inventor： SPORCK, A., Nicholas ,  HENSON, Roy, J.

IPC: G01R31/02

CPC classification number: G01R31/2889 ,  G01R1/07385

Abstract: A contactor device comprising a plurality of probes disposed to contact ones of the electronic devices can be electrically connected to a source of test signals. A switch can be activated electrically connecting a connection to the source of test signals to a selected one of a first group of electrically connected ones of the probes disposed to contact a first set of a plurality of the electronic devices or a second group of electrically connected ones of the probes disposed to contact a second set of a plurality of the electronic devices.

Abstract translation: 包括设置成接触电子装置的多个探针的接触器装置可电连接到测试信号源。 可以激活开关，将连接到测试信号源的连接电连接到被设置为接触多个电子设备的第一组的第一组电连接的探针中的选定的一个或第二组电连接 探针中的一个被设置为接触多个电子设备的第二组。

公开(公告)号：WO2006113708A3

公开(公告)日：2009-05-07

申请号：PCT/US2006014554

申请日：2006-04-18

Applicant: FORMFACTOR INC ,  ELDRIDGE BENJAMIN N ,  GRUBE GARY W ,  HOBBS ERIC D ,  MATHIEU GAETAN L ,  SHINDE MAKARAND S ,  SPORCK A NICHOLAS ,  WATSON THOMAS N ,  SLOCUM ALEXANDER N

Inventor： ELDRIDGE BENJAMIN N ,  GRUBE GARY W ,  HOBBS ERIC D ,  MATHIEU GAETAN L ,  SHINDE MAKARAND S ,  SPORCK A NICHOLAS ,  WATSON THOMAS N ,  SLOCUM ALEXANDER N

IPC: G01R31/02

CPC classification number: G01R31/2874 ,  G01R31/2863 ,  G01R31/2889 ,  Y10T29/5313

Abstract: A probe card assembly can include a probe head assembly having probes for contacting an electronic device to be tested. The probe head assembly can be electrically connected to a wiring substrate and mechanically attached to a stiffener plate. The wiring substrate can provide electrical connections to a testing apparatus, and the stiffener plate can provide structure for attaching the probe card assembly to the testing apparatus. The stiffener plate can have a greater mechanical strength than the wiring substrate and can be less susceptible to thermally induced movement than the wiring substrate. The wiring substrate may be attached to the stiffener plate at a central location of the wiring substrate. Space may be provided at other locations where the wiring substrate is attached to the stiffener plate so that the wiring substrate can expand and contract with respect to the stiffener plate.

Abstract translation: 探针卡组件可以包括具有用于接触要测试的电子设备的探针的探针头组件。 探针头组件可以电连接到布线基板并且机械地附接到加强板。 布线基板可以提供到测试装置的电连接，并且加强板可以提供用于将探针卡组件附接到测试装置的结构。 加强板可以具有比布线基板更大的机械强度，并且可以比布线基板更不易受热引起的移动。 布线基板可以在布线基板的中心位置处附接到加强板。 可以在将布线基板附接到加强板的其他位置处设置空间，使得布线基板能够相对于加强板膨胀和收缩。

公开(公告)号：WO2008070466A3

公开(公告)日：2008-11-06

申请号：PCT/US2007085483

申请日：2007-11-25

Applicant: FORMFACTOR INC ,  CHRAFT MATTHEW E ,  ELDRIDGE BENJAMIN N ,  HENSON ROY J ,  SPORCK A NICHOLAS

Inventor： CHRAFT MATTHEW E ,  ELDRIDGE BENJAMIN N ,  HENSON ROY J ,  SPORCK A NICHOLAS

IPC: G01R31/02

CPC classification number: G01R31/31926 ,  G01R31/318511

Abstract: Probes in a plurality of DUT probe groups can be connected in parallel to a single tester channel. In one aspect, digital potentiometers can be used to effectively switch the tester channel from a probe in one DUT probe group to a probe in another DUT probe group. In another aspect, switches in parallel with a resistor can accomplish such switching. In yet another aspect, a chip select terminal on each DUT can be used to effectively connect and disconnect internal DUT circuitry to the tester channel. Multiple DUT probe groups so connected can be used to create different patterns of DUT probe groups for testing different patterns of DUTs and thus facilitate sharing tester channels.

Abstract translation: 多个DUT探针组中的探针可以并行连接到单个测试器通道。 在一个方面，可以使用数字电位计来有效地将测试器通道从一个DUT探针组中的探针切换到另一个DUT探针组中的探针。 另一方面，与电阻器并联的开关可以完成这种切换。 在又一方面，每个DUT上的芯片选择端子可以用于有效连接和断开内部DUT电路与测试器通道的连接。 如此连接的多个DUT探针组可用于创建不同模式的DUT探针组，以测试不同DUT的模式，从而便于共享测试器通道。

公开(公告)号：WO2009042731A1

公开(公告)日：2009-04-02

申请号：PCT/US2008/077586

申请日：2008-09-25

Applicant: FORMFACTOR, INC. ,  BERRY, Tommie, Edward ,  SPORCK, A., Nicholas

Inventor： BERRY, Tommie, Edward ,  SPORCK, A., Nicholas

IPC: G01R31/02

CPC classification number: G01R1/07342 ,  G01R31/2889

Abstract: Methods and apparatus for testing devices using serially controlled intelligent switches have been described. In some embodiments, a probe card assembly can be provided that includes a plurality of integrated circuits (ICs) serially coupled to form a chain, the chain coupled to at least one serial control line, the plurality of ICs including switches coupled to test probes, each of the switches being programmable responsive to a control signal on the at least one serial control line.

Abstract translation: 已经描述了使用串行控制的智能开关来测试装置的方法和装置。 在一些实施例中，可以提供探针卡组件，其包括串联耦合以形成链的多个集成电路（IC），所述链耦合到至少一个串行控制线，所述多个IC包括耦合到测试探针的开关， 每个开关可响应于至少一个串行控制线上的控制信号来编程。

公开(公告)号：WO2002084307A1

公开(公告)日：2002-10-24

申请号：PCT/US2002/011331

申请日：2002-04-09

Applicant: FORMFACTOR, INC. ,  SPORCK, A., Nicholas ,  SHINDE, Makarand, S.

Inventor： SPORCK, A., Nicholas ,  SHINDE, Makarand, S.

IPC: G01R1/073

CPC classification number: G01R1/07342

Abstract: A probe card assembly includes a printed circuit board with tester contacts for making electrical connections to a semiconductor tester. The probe card assembly also includes a probe head assembly with probes for contacting a semiconductor device under test. One or more daughter cards (432) is mounted to the printed circuit board such that they are substantially coplanar with the printed circuit board. The daughter cards (432) may contain a circuit for processing test data, including test signals to be input into the semiconductor and/or response signals generated by the semiconductor device in response to the test signals.

Abstract translation: 探针卡组件包括具有用于与半导体测试器电连接的测试器触点的印刷电路板。 探针卡组件还包括具有用于接触被测半导体器件的探针的探针头组件。 一个或多个子卡（432）安装到印刷电路板上，使得它们与印刷电路板基本共面。 子卡（432）可以包含用于处理测试数据的电路，包括要输入到半导体的测试信号和/或响应于测试信号由半导体器件产生的响应信号。

公开(公告)号：WO2008028171A3

公开(公告)日：2008-12-31

申请号：PCT/US2007077467

申请日：2007-09-01

Applicant: FORMFACTOR INC ,  SPORCK A NICHOLAS ,  HENSON ROY J

Inventor： SPORCK A NICHOLAS ,  HENSON ROY J

IPC: G01R31/02

CPC classification number: G01R31/2889 ,  G01R1/07385

Abstract: A contactor device comprising a plurality of probes disposed to contact ones of the electronic devices can be electrically connected to a source of test signals. A switch can be activated electrically connecting a connection to the source of test signals to a selected one of a first group of electrically connected ones of the probes disposed to contact a first set of a plurality of the electronic devices or a second group of electrically connected ones of the probes disposed to contact a second set of a plurality of the electronic devices.

Abstract translation: 包括设置成与电子装置中的一些电子装置接触的多个探针的接触器装置可以电连接到测试信号源。 可以激活开关，该开关将与测试信号源的连接电连接到被布置为接触第一组多个电子设备的第一组电连接探针中的选定一个，或者第二组电连接 这些探针中的一些设置成接触多个电子设备的第二组。

公开(公告)号：WO2008070466A2

公开(公告)日：2008-06-12

申请号：PCT/US2007/085483

申请日：2007-11-25

Applicant: FORMFACTOR, INC. ,  CHRAFT, Matthew, E. ,  ELDRIDGE, Benjamin, N. ,  HENSON, Roy, J. ,  SPORCK, A., Nicholas

Inventor： CHRAFT, Matthew, E. ,  ELDRIDGE, Benjamin, N. ,  HENSON, Roy, J. ,  SPORCK, A., Nicholas

IPC: G01R31/02

CPC classification number: G01R31/31926 ,  G01R31/318511

Abstract: Probes in a plurality of DUT probe groups can be connected in parallel to a single tester channel. In one aspect, digital potentiometers can be used to effectively switch the tester channel from a probe in one DUT probe group to a probe in another DUT probe group. In another aspect, switches in parallel with a resistor can accomplish such switching. In yet another aspect, a chip select terminal on each DUT can be used to effectively connect and disconnect internal DUT circuitry to the tester channel. Multiple DUT probe groups so connected can be used to create different patterns of DUT probe groups for testing different patterns of DUTs and thus facilitate sharing tester channels.

Abstract translation: 多个DUT探针组中的探针可以并联连接到单个测试仪通道。 在一个方面，数字电位器可用于有效地将测试仪通道从一个DUT探针组中的探头切换到另一个DUT探针组中的探针。 另一方面，与电阻并联的开关可以实现这种切换。 在另一方面，每个DUT上的芯片选择端可用于有效地连接和断开内部DUT电路到测试器通道。 如此连接的多个DUT探针组可用于创建不同的DUT探针组，以测试DUT的不同图案，从而便于共享测试仪通道。

公开(公告)号：WO2007146582A2

公开(公告)日：2007-12-21

申请号：PCT/US2007/069806

申请日：2007-05-25

Applicant: FORMFACTOR, INC. ,  MILLER, Charles, A. ,  SPORCK, A., Nicholas ,  ELDRIDGE, Benjamin, N.

Inventor： MILLER, Charles, A. ,  SPORCK, A., Nicholas ,  ELDRIDGE, Benjamin, N.

IPC: G01R31/02

CPC classification number: G01R1/06711 ,  G01R1/06727 ,  G01R1/07 ,  G01R31/3025

Abstract: A probe for contacting and testing ICs on a semiconductor device includes a dielectric insulating material tip. The dielectric tip does not contaminate the surface being probed unlike metal probe tips. A contact scrub is further not required with signals being capacitively or inductively coupled from the probe tip to the IC. Testing can be performed during early fabrication steps of the wafer without the need for applying a metalization layer to the wafer to form bond pads. Testing can be performed by inductively coupling an AC signal to the probe tip, with coupling enhanced by including a magnetic material in the dielectric probe tip. Using an AC test signal enables testing of ICs without requiring separate power and ground connections.

Abstract translation: 用于在半导体器件上接触和测试IC的探针包括介电绝缘材料尖端。 与金属探针尖端不同，电介质尖端不会污染被探测的表面。 进一步不需要接触擦洗，信号从探头尖端到IC电容或电感耦合。 可以在晶片的早期制造步骤期间进行测试，而不需要将金属化层施加到晶片以形成接合焊盘。 可以通过将AC信号电感耦合到探针尖端来进行测试，通过在介电探针尖端中包括磁性材料来增强耦合。 使用AC测试信号可以测试IC，而不需要单独的电源和接地连接。

公开(公告)号：WO2006113708A2

公开(公告)日：2006-10-26

申请号：PCT/US2006/014554

申请日：2006-04-18

Applicant: FORMFACTOR, INC. ,  ELDRIDGE, Benjamin, N. ,  GRUBE, Gary, W. ,  HOBBS, Eric, D. ,  MATHIEU, Gaetan, L. ,  SHINDE, Makarand, S. ,  SPORCK, A., Nicholas ,  WATSON, Thomas, N. ,  SLOCUM, Alexander, N.

Inventor： ELDRIDGE, Benjamin, N. ,  GRUBE, Gary, W. ,  HOBBS, Eric, D. ,  MATHIEU, Gaetan, L. ,  SHINDE, Makarand, S. ,  SPORCK, A., Nicholas ,  WATSON, Thomas, N. ,  SLOCUM, Alexander, N.

IPC: G01R31/02

CPC classification number: G01R31/2874 ,  G01R31/2863 ,  G01R31/2889 ,  Y10T29/5313

Abstract: A probe card assembly can include a probe head assembly having probes for contacting an electronic device to be tested. The probe head assembly can be electrically connected to a wiring substrate and mechanically attached to a stiffener plate. The wiring substrate can provide electrical connections to a testing apparatus, and the stiffener plate can provide structure for attaching the probe card assembly to the testing apparatus. The stiffener plate can have a greater mechanical strength than the wiring substrate and can be less susceptible to thermally induced movement than the wiring substrate. The wiring substrate may be attached to the stiffener plate at a central location of the wiring substrate. Space may be provided at other locations where the wiring substrate is attached to the stiffener plate so that the wiring substrate can expand and contract with respect to the stiffener plate.

Abstract translation: 探针卡组件可以包括具有用于接触要测试的电子设备的探针的探针头组件。 探针头组件可以电连接到布线基板并且机械地附接到加强板。 布线基板可以提供到测试装置的电连接，并且加强板可以提供用于将探针卡组件附接到测试装置的结构。 加强板可以具有比布线基板更大的机械强度，并且可以比布线基板更不易受热引起的移动。 布线基板可以在布线基板的中心位置处附接到加强板。 可以在将布线基板附接到加强板的其他位置处设置空间，使得布线基板能够相对于加强板膨胀和收缩。