Abstract:
The method involves locally connecting sheet metals (2, 3) by common plastic deformation in an assembling region. The plastic deformation takes place via a flow hole molding of assembling components. Friction heat from the sheet metals leads axial and rotational movement of a flow forming tool (1) to form a common passage. A contact fixture is formed within a passage region in a contact zone (5) of the sheet metals.
Abstract:
Precursor compositions useful for atomic layer deposition (ALD) and chemical vapor deposition (CVD) of strontium ruthenium oxide (SrRuO3) thin films, e.g., in the manufacture of microelectronic devices, as well as processes of making and using such precursors, and precursor supply systems containing such precursor compositions in packaged form. Cyclopentadienyl compounds of varied type are described, including cyclopentadienyl as well as non cyclopentadienyl ligands coordinated to ruthenium, strontium or barium central atoms. The precursors of the invention are useful for forming contacts for microelectronic memory device structures, and in a specific aspect for selectively coating copper metallization without deposition on associated dielectric, under deposition conditions in a forming gas ambient.
Abstract:
Metal aminotroponiminates, metal bis-oxazolinates and metal guanidinates are described, as well as ligand precursors of such compounds, and mixed ligand barium and strontium complexes suitable for chemical vapor deposition, atomic layer deposition, and rapid vapor deposition processes. Such metal compounds are useful in the formation of thin metal films on substrates, e.g., in chemical vapor deposition, atomic layer deposition or rapid vapor deposition processes. The substrates formed have thin film monolayers of the metals provided by the precursors.
Abstract:
Precursor compositions useful for atomic layer deposition (ALD) and chemical vapor deposition (CVD) of strontium ruthenium oxide (SrRuO 3 ) thin films, e.g., in the manufacture of microelectronic devices, as well as processes of making and using such precursors, and precursor supply systems containing such precursor compositions in packaged form. Cyclopentadienyl compounds of varied type are described, including cyclopentadienyl as well as non cyclopentadienyl ligands coordinated to ruthenium, strontium or barium central atoms. The precursors of the invention are useful for forming contacts for microelectronic memory device structures, and in a specific aspect for selectively coating copper metallization without deposition on associated dielectric, under deposition conditions in a forming gas ambient.
Abstract translation:用于原子层沉积(ALD)和氧化钌氧化锶(SrR 3 O 3)薄膜的化学气相沉积(CVD)的前体组合物,例如在微电子器件的制造中以及制备方法 并使用这样的前体和含有包装形式的前体组合物的前体供给系统。 描述了不同类型的环戊二烯基化合物,包括环戊二烯基以及与钌,锶或钡中心原子配位的非环戊二烯基配位体。 本发明的前体可用于形成用于微电子存储器件结构的接触,并且在特定方面,用于在形成气体环境中的沉积条件下,在相关联的电介质上不沉积而选择性地涂覆铜金属化。
Abstract:
A system and method for forming a phase change memory material on a substrate, in which the substrate is contacted with precursors for a phase change memory chalcogenide alloy under conditions producing deposition of the chalcogenide alloy on the substrate, at temperature below 350°C, with the contacting being carried out via chemical vapor deposition or atomic layer deposition. Various tellurium, germanium and germanium-tellurium precursors are described, which are useful for forming GST phase change memory films on substrates.
Abstract:
Bismuth precursors having utility for forming highly conformal bismuth-containing films by low temperature ( 2 Te 3 , Bi 4 Ti 3 O 12 , SrBi 2 Ta 2 O 9 , Bi- Ta-O, BiP and thermoelectric bismuth-containing films.
Abstract translation:通过低温(<300℃)汽相沉积法如CVD和ALD,包括铋酸铵,铋酸铋,铋酸铋,铋等具有用于形成高度保形的含铋膜的铋前体 氨基甲酸酯和硫代氨基甲酸铋,β-二酮酸铋,二酮亚铋酸铋,二巯基亚铋酸铋,铋环戊二烯基,铋烷基化物,铋醇盐和具有侧配体的铋甲硅烷基,铋甲硅烷基酰胺,铋螯合酰胺和二三羟基亚氨基二膦酸铋。 还描述了制造这种前体的方法,以及适用于制造微电子器件产品的这种前体的封装形式。 这些铋前体可用于形成含铋膜,例如GBT,Bi 2 Te 3,Bi 4 Ti 3 3 SrBi 2 Ta 2 O 9 O 9,Bi-Ta-O, BiP和热电含铋薄膜。 p>
Abstract:
Antimony, germanium and tellurium precursors useful for CVD/ALD of corresponding metal-containing thin films are described, along with compositions including such precursors, methods of making such precursors, and films and microelectronic device products manufactured using such precursors, as well as corresponding manufacturing methods. The precursors of the invention are useful for forming germanium-antimony-tellurium (GST) films and microelectronic device products, such as phase change memory devices, including such films.
Abstract:
A system and method for forming a phase change memory material on a substrate, in which the substrate is contacted with precursors for a phase change memory chalcogenide alloy under conditions producing deposition of the chalcogenide alloy on the substrate, at temperature below 350°C, with the contacting being carried out via chemical vapor deposition or atomic layer deposition. Various tellurium, germanium and germanium-tellurium precursors are described, which are useful for forming GST phase change memory films on substrates.