公开(公告)号：WO2008156562A3

公开(公告)日：2008-12-24

申请号：PCT/US2008/007089

申请日：2008-06-05

Applicant: LAM RESEARCH CORPORATION ,  STEVENSON, Thomas, R. ,  DE LA LLERA, Anthony ,  ULLAL, Saurabh

Inventor： STEVENSON, Thomas, R. ,  DE LA LLERA, Anthony ,  ULLAL, Saurabh

IPC: C23C16/455 ,  C23C16/00

Abstract: Showerhead electrode assemblies are disclosed, which include a showerhead electrode adapted to be mounted in an interior of a vacuum chamber; an optional backing plate attached to the showerhead electrode; a thermal control plate attached to the backing plate or to the showerhead electrode at multiple contact points across the backing plate; and at least one thermally and electrically conductive gasket separating the backing plate and the thermal control plate, or the backing plate and showerhead electrode, at the contact points. Methods of processing semiconductor substrates using the showerhead electrode assemblies are also disclosed.

公开(公告)号：WO2008156562A2

公开(公告)日：2008-12-24

申请号：PCT/US2008007089

申请日：2008-06-05

Applicant: LAM RES CORP ,  STEVENSON THOMAS R ,  DE LA LLERA ANTHONY ,  ULLAL SAURABH

Inventor： STEVENSON THOMAS R ,  DE LA LLERA ANTHONY ,  ULLAL SAURABH

IPC: C23C16/455 ,  C23C16/00

CPC classification number: H01J37/32449 ,  H01J37/32091 ,  H01J37/32541 ,  H01J37/3255 ,  H01J37/32724

Abstract: Showerhead electrode assemblies are disclosed, which include a showerhead electrode adapted to be mounted in an interior of a vacuum chamber; an optional backing plate attached to the showerhead electrode; a thermal control plate attached to the backing plate or to the showerhead electrode at multiple contact points across the backing plate; and at least one thermally and electrically conductive gasket separating the backing plate and the thermal control plate, or the backing plate and showerhead electrode, at the contact points. Methods of processing semiconductor substrates using the showerhead electrode assemblies are also disclosed.

Abstract translation: 公开了一种喷头电极组件，其包括适于安装在真空室内部的喷头电极; 连接到喷头电极的可选背板; 热控制板，在穿过背板的多个接触点处附接到背板或喷头电极; 以及在接触点处分离背板和热控制板，或背板和喷头电极的至少一个导热和导电的衬垫。 还公开了使用喷头电极组件处理半导体衬底的方法。