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公开(公告)号：WO2012080475A1
公开(公告)日：2012-06-21
申请号：PCT/EP2011/073066
申请日：2011-12-16
Applicant: GENERAL ELECTRIC COMPANY , GE HEALTHCARE UK LIMITED , SMITH, Reginald Donovan , MILLER, Scott, Michael , YOON, Yosang , RUBINSZTAJN, Slawomir , SUSARLA, Prameela
Inventor： SMITH, Reginald Donovan , MILLER, Scott, Michael , YOON, Yosang , RUBINSZTAJN, Slawomir , SUSARLA, Prameela
IPC: C12N5/00
CPC classification number: C12N5/0068 , C12N2533/12 , C12N2533/30 , C12N2535/10
Abstract: A method of culturing adherent cells is provided, wherein the method comprises providing a carrier for growing the cells, comprising one or more surfaces; and one or more relief features/indentations are present on one or more of the surfaces, wherein the carrier has a length at least about 0.2 mm, a width at least about 0.2 mm, and a height in a range from about 0.012 mm to 0.5 mm; and wherein each of the relief features/indentations has a height above the surfaces in a range from about 2 to 200 μm, and width in a range from about 20 to 200 μm; seeding the cells on the carriers; and growing the cells on the carrier.
Abstract translation: 提供培养贴壁细胞的方法，其中所述方法包括提供用于生长所述细胞的载体，包含一个或多个表面; 并且在一个或多个表面上存在一个或多个消除特征/凹陷，其中载体具有至少约0.2mm，宽度至少约0.2mm的长度，以及在约0.012mm至0.5的范围内的高度 毫米; 并且其中每个所述浮雕特征/压痕的表面高度在约2至200μm的范围内，宽度在约20至200μm的范围内; 将细胞接种在载体上; 并在载体上生长细胞。
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公开(公告)号：WO2007005275A1
公开(公告)日：2007-01-11
申请号：PCT/US2006/023957
申请日：2006-06-20
Applicant: GENERAL ELECTRIC COMPANY , LU, Qiwei , O'BRIEN, Michael , ROCHA-GALICIA, Gerardo , SUSARLA, Prameela
Inventor： LU, Qiwei , O'BRIEN, Michael , ROCHA-GALICIA, Gerardo , SUSARLA, Prameela
CPC classification number: C08G59/621 , C08L63/00 , C08L71/123 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , Y10T428/31511 , C08L2666/22 , H01L2924/00014 , H01L2924/00
Abstract: A molding composition suitable for encapsulating solid state devices includes an epoxy resin, a hardener, a poly(arylene ether) resin comprising less than 5 weight percent of particles greater than 100 micrometers, and about 70 to about 95 weight percent of a silica filler, based on the total weight of the composition. After curing, the composition exhibits improved increased copper adhesion and reduced shrinkage compared to conventional molding compositions.
Abstract translation: 适用于封装固态器件的模塑组合物包括环氧树脂，硬化剂，包含小于5重量％的大于100微米的颗粒的聚（亚芳基醚）树脂和约70至约95重量％的二氧化硅填料， 基于组合物的总重量。 固化后，与常规模塑组合物相比，该组合物显示出改进的增加的铜附着力和减小的收缩率。
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公开(公告)号：WO2005035625A1
公开(公告)日：2005-04-21
申请号：PCT/US2004/031880
申请日：2004-09-29
Applicant: GENERAL ELECTRIC COMPANY , ZARNOCH, Kenneth, Paul , CAMPBELL, John, Robert , FRESHHOUR, Amy, Rene , GUO, Hua , RUDE, John, Austin , SUSARLA, Prameela , VALLANCE, Michael, Alan , YEAGER, Gary, William
Inventor： ZARNOCH, Kenneth, Paul , CAMPBELL, John, Robert , FRESHHOUR, Amy, Rene , GUO, Hua , RUDE, John, Austin , SUSARLA, Prameela , VALLANCE, Michael, Alan , YEAGER, Gary, William
IPC: C08G65/48
CPC classification number: C08G65/48 , C08F283/08 , C08F290/062 , C08G65/485
Abstract: A thermoset composition exhibiting reduced water absorption in the cured state includes an olefinically unsaturated monomer and a capped poly(arylene ether) prepared by the reaction of an uncapped poly(arylene ether) with an anhydride capping agent. The capped poly(arylene ether) is isolated and/or purified by methods that reduce the concentrations of polar impurities that contribute to water absorption by the cured composition.
Abstract translation: 在固化状态下显示减少的吸水性的热固性组合物包括通过未封端的聚（亚芳基醚）与酸酐封端剂的反应制备的烯属不饱和单体和封端的聚（亚芳基醚）。 封端的聚（亚芳基醚）是通过降低有助于固化的组合物吸水的极性杂质的浓度的方法分离和/或纯化的。
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公开(公告)号：WO2007130063A1
公开(公告)日：2007-11-15
申请号：PCT/US2006/017952
申请日：2006-05-10
Applicant: GENERAL ELECTRIC COMPANY , ZARNOCH, Kenneth, Paul , SUSARLA, Prameela , VALLANCE, Michael, Alan
Inventor： ZARNOCH, Kenneth, Paul , SUSARLA, Prameela , VALLANCE, Michael, Alan
CPC classification number: C08G65/485 , C08G2650/04 , C08K9/06 , C08L71/126 , C08L2666/04
Abstract: A curable molding composition is provided having a binder system and a filler system. The molding composition is useful as an electronic material composition for electronic devices.
Abstract translation: 提供了具有粘合剂体系和填充体系的可固化模塑组合物。 成型组合物可用作电子器件的电子材料组合物。
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公开(公告)号：WO2006023371A1
公开(公告)日：2006-03-02
申请号：PCT/US2005/028602
申请日：2005-08-11
Applicant: GENERAL ELECTRIC COMPANY , BIRSAK, Joop , CHAO, Herbert Shin-I , DUFFEY, Bryan , FRESHOUR, Amy, Rene , INGELBRECHT, Hugo, Gerard, Eduard , LU, Qiwei , O'BRIEN, Michael, Joseph , SUSARLA, Prameela , VALLANCE, Michael , ZARNOCH, Kenneth, Paul
Inventor： BIRSAK, Joop , CHAO, Herbert Shin-I , DUFFEY, Bryan , FRESHOUR, Amy, Rene , INGELBRECHT, Hugo, Gerard, Eduard , LU, Qiwei , O'BRIEN, Michael, Joseph , SUSARLA, Prameela , VALLANCE, Michael , ZARNOCH, Kenneth, Paul
IPC: C08G65/48
CPC classification number: C08G65/485 , C08F220/06 , C08F222/1006 , C08F283/06 , C08F283/08 , C08F290/061 , C08F290/062
Abstract: A curable composition includes an olefinically unsaturated monomer and a poly(arylene ether) having two polymerizable groups and an intrinsic viscosity of about 0.05 to about 0.30 deciliters per gram. The composition exhibits an improved combination of high flow during molding and high post-cure stiffness and impact strength. The composition is particularly useful for fabricating plastic-packaged electronic devices.
Abstract translation: 可固化组合物包括烯属不饱和单体和具有两个可聚合基团的聚（亚芳基醚），特性粘度为约0.05至约0.30分升/克。 该组合物在模塑期间显示出高流动性和高后固化刚度和冲击强度的改进的组合。 该组合物特别适用于制造塑料封装的电子器件。
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Patent Agency Ranking6.发明申请CELL CARRIER, ASSOCIATED METHODS FOR MAKING CELL CARRIER AND CULTURING CELLS USING THE SAME 审中-公开细胞载体，用于制备细胞载体和培养细胞的相关方法
公开(公告)号：WO2012080473A1
公开(公告)日：2012-06-21
申请号：PCT/EP2011/073064
申请日：2011-12-16
Applicant: GENERAL ELECTRIC COMPANY , GE HEALTHCARE UK LIMITED , RANGARAJAN, Arvind , SUSARLA, Prameela , MILLER, Scott, Michael , SMITH, Reginald Donovan , RUBINSZTAJN, Slawomir , BELETSKII, Anton
Inventor： RANGARAJAN, Arvind , SUSARLA, Prameela , MILLER, Scott, Michael , SMITH, Reginald Donovan , RUBINSZTAJN, Slawomir , BELETSKII, Anton
CPC classification number: C12N5/0068 , C12M25/14 , C12N2533/30 , C12N2535/10 , Y10T156/1039
Abstract: A carrier for growing adherent cells is provided, wherein the carrier comprises one or more outer surfaces; and one or more structured indentations on one or more of the outer surfaces, wherein the carrier has a length at least about 0.2 mm, a width at least about 0.2 mm, and a height in a range from about 0.05 mm to 1.2 mm and each of the structured indentations has a major axis in a range from about 0.1 mm to 0.5 mm, a minor axis in a range from about 0.1 mm to 0.5 mm and a depth in a range from about 0.025 mm to about 0.5 mm. The carrier may comprise a single indentation or 'cup' like structure, or may comprise a plurality of indentations. A method of making the carrier, and culturing stromal cells using the same carrier are also provided.
Abstract translation: 提供了用于生长贴壁细胞的载体，其中载体包括一个或多个外表面; 以及在一个或多个外表面上的一个或多个结构化凹陷，其中所述载体具有至少约0.2mm，宽度至少约0.2mm的长度，以及在约0.05mm至1.2mm范围内的高度， 的结构化缺口具有在约0.1mm至0.5mm的范围内的长轴，在约0.1mm至0.5mm的范围内的短轴和在约0.025mm至约0.5mm的范围内的深度。 载体可以包括单个凹陷或“杯状”结构，或者可以包括多个凹陷。 还提供了制造载体和使用相同载体培养基质细胞的方法。
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公开(公告)号：WO2012080472A1
公开(公告)日：2012-06-21
申请号：PCT/EP2011/073061
申请日：2011-12-16
Applicant: GENERAL ELECTRIC COMPANY , GE HEALTHCARE UK LIMITED , YOON, Yosang , RUBINSZTAJN, Slawomir , CARAHER, Joel , BALCH, Gary , SUSARLA, Prameela
Inventor： YOON, Yosang , RUBINSZTAJN, Slawomir , CARAHER, Joel , BALCH, Gary , SUSARLA, Prameela
CPC classification number: C12N5/0068 , B29C59/04 , B29C59/10 , B29C59/14 , C12N2533/30 , C12N2535/10
Abstract: A method of making a carrier for growing cells, comprises providing a polymer film; embossing on one or more sides of the polymer film with an embossing roller comprising patterned surface; generating a pattern of structured indentation on one or more side of the polymer film; and discretizing the patterned polymer film into a plurality of portions. The embossing pattern generates relief features on the carrier surface. An alternative method of making a carrier for growing cells is also provided, wherein the method comprises, extruding a polymer film; embossing on one or more sides of the polymer film with a roller comprising patterned surface; generating a pattern of structured indentation on one or more side of the polymer film; imparting a surface treatment to the film comprising one or more of corona discharge treatment, gas plasma treatment, chemical functionalization or coating; and discretizing the treated polymer film into a plurality of portions.
Abstract translation: 制造用于生长细胞的载体的方法包括提供聚合物膜; 使用包括图案化表面的压花辊在聚合物膜的一侧或多侧上压花; 在聚合物膜的一侧或多侧产生结构化凹陷的图案; 并将图案化的聚合物膜离散成多个部分。 压花图案在载体表面上产生浮雕特征。 还提供了制备用于生长细胞的载体的替代方法，其中所述方法包括挤出聚合物膜; 用包含图案化表面的辊在聚合物膜的一个或多个侧面上压花; 在聚合物膜的一侧或多侧产生结构化凹陷的图案; 对包括电晕放电处理，气体等离子体处理，化学官能化或涂布中的一种或多种的膜进行表面处理; 并将经处理的聚合物膜离散成多个部分。
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公开(公告)号：WO2005033179A8
公开(公告)日：2005-05-26
申请号：PCT/US2004031826
申请日：2004-09-28
Applicant: GEN ELECTRIC , CAMPBELL JOHN ROBERT , DUFFY BRYAN , RUDE JOHN AUSTIN , SUSARLA PRAMEELA , VALLANCE MICHAEL ALAN , YEAGER GARY WILLIAM , ZARNOCH KENNETH PAUL
Inventor： CAMPBELL JOHN ROBERT , DUFFY BRYAN , RUDE JOHN AUSTIN , SUSARLA PRAMEELA , VALLANCE MICHAEL ALAN , YEAGER GARY WILLIAM , ZARNOCH KENNETH PAUL
IPC: C08F283/06 , C08F283/08 , C08F290/06 , C08G65/48 , C08K5/103 , C08K5/5313 , C08L67/06 , C08L71/12
CPC classification number: C08K5/5313 , C08F283/06 , C08F283/08 , C08F290/06 , C08F290/062 , C08K5/103 , C08L67/06 , C08L71/12 , C08L71/00
Abstract: A curable composition includes a functionalized poly(arylene ether) resin, an acryloyl monomer, and a phosphorus flame retardant. The composition exhibits an improved balance of properties such as toughness, flame retardance, heat-resistance, and moisture resistance. It is useful, for example, as an encapsulant for semiconductor products.
Abstract translation: 可固化组合物包含官能化聚亚芳基醚树脂，丙烯酰单体和磷阻燃剂。 该组合物显示出诸如韧性，阻燃性，耐热性和耐湿性等性能的改善的平衡。 例如，作为半导体产品的密封剂是有用的。
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公开(公告)号：WO2012080474A1
公开(公告)日：2012-06-21
申请号：PCT/EP2011/073065
申请日：2011-12-16
Applicant: GENERAL ELECTRIC COMPANY , GE HEALTHCARE UK LIMITED , MILLER, Scott Michael , YOON, Yosang , RUBINSZTAJN, Slawomir , DAVIS, Peter, Kennedy , SUSARLA, Prameela
Inventor： MILLER, Scott Michael , YOON, Yosang , RUBINSZTAJN, Slawomir , DAVIS, Peter, Kennedy , SUSARLA, Prameela
CPC classification number: C12N5/0068 , C12N2533/12 , C12N2533/14 , C12N2533/30 , C12N2535/10
Abstract: In one example of a carrier for growing adherent cells, comprises one or more surfaces; and one or more relief features on one or more of the surfaces, wherein the carrier has a length at least about 0.2 mm, a width at least about 0.2 mm, and a height in a range from about 0.012 mm to 0.5 mm; and wherein each of the relief features has a height in a range from about 2 to 200 μm, and width in a range from about 20 to 200 μm.
Abstract translation: 在用于生长贴壁细胞的载体的一个实例中，包括一个或多个表面; 以及在一个或多个表面上的一个或多个凹凸特征，其中所述载体具有至少约0.2mm，宽度至少约0.2mm，高度在约0.012mm至0.5mm范围内的长度; 并且其中每个所述凹凸特征具有在约2至200μm范围内的高度，并且宽度在约20至200μm的范围内。
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公开(公告)号：WO2011040867A1
公开(公告)日：2011-04-07
申请号：PCT/SE2010/051033
申请日：2010-09-27
Applicant: GENERAL ELECTRIC COMPANY , GE HEALTHCARE BIO-SCIENCES AB , RUBINSZTAJN, Slawomir , SMITH, Reginald, D. , LOGHIN, Evelina, R. , SUSARLA, Prameela
Inventor： RUBINSZTAJN, Slawomir , SMITH, Reginald, D. , LOGHIN, Evelina, R. , SUSARLA, Prameela
IPC: C12N5/02
CPC classification number: C12N5/0068 , C12M23/20 , C12M33/00 , C12N2533/32 , C12N2539/10
Abstract: Methods and kits of releasing cells are provided. The method comprises the steps of providing cultured cells on a cell culture support comprising a multi layer polyelectrolyte coating immobilized on a substrate, and releasing the cultured cells from the cell culture support by a releasing solution comprising DMSO. The kit comprises a cell culture support and a releasing solution. The cell culture support comprises a substrate and a multi layer polyelectrolyte coating immobilized on the substrate and the releasing solution comprises DMSO.
Abstract translation: 提供了释放细胞的方法和试剂盒。 该方法包括以下步骤：在包含固定在底物上的多层聚电解质涂层的细胞培养载体上提供培养的细胞，以及通过包含DMSO的释放溶液从细胞培养支持物释放培养的细胞。 该试剂盒包括细胞培养支持物和释放溶液。 细胞培养载体包含固定在底物上的底物和多层聚电解质涂层，释放溶液包含DMSO。
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