公开(公告)号：US09227841B2

公开(公告)日：2016-01-05

申请号：US14274118

申请日：2014-05-09

Applicant: Chao Ta Huang ,  Shih Ting Lin ,  Yu Wen Hsu

Inventor： Chao Ta Huang ,  Shih Ting Lin ,  Yu Wen Hsu

IPC: H01L41/08 ,  B81C1/00 ,  B81B7/00 ,  H01L41/113 ,  H01L41/09

CPC classification number: B81C1/00134 ,  B81B7/0064 ,  B81C1/0023 ,  B81C2203/00 ,  B81C2203/0792 ,  H01L41/0933 ,  H01L41/1134 ,  H01L2224/11

Abstract: One embodiment discloses an apparatus integrating a microelectromechanical system device with a circuit chip which includes a circuit chip, a microelectromechanical system device, a sealing ring, and a lid. The circuit chip comprises a substrate and a plurality of metal bonding areas. The substrate has an active surface with electrical circuit area, and the metal bonding areas are disposed on the active surface and electrically connected to the electrical circuits. The microelectromechanical system device comprises a plurality of bases and at least one sensing element. The bases are connected to at least one of the metal bonding areas. The at least one sensing element is elastically connected to the bases. The sealing ring surrounds the bases, and is connected to at least one of the metal bonding areas. The lid is opposite to the active surface of the circuit chip, and is connected to the sealing ring to have a hermetic chamber which seals the sensing element and the active surface of the circuit chip.

Abstract translation: 一个实施例公开了一种将微机电系统装置与包括电路芯片，微机电系统装置，密封环和盖的电路芯片集成的装置。 电路芯片包括基板和多个金属接合区域。 基板具有具有电路面积的有源表面，并且金属接合区域设置在有源表面上并电连接到电路。 微机电系统装置包括多个基座和至少一个感测元件。 基底连接至至少一个金属接合区域。 至少一个感测元件弹性地连接到基座。 所述密封环围绕所述基部，并且与所述金属接合区域中的至少一个连接。 盖与电路芯片的有效表面相对，并连接到密封环，以具有密封感测元件和电路芯片的有效表面的密封室。

公开(公告)号：US20140248731A1

公开(公告)日：2014-09-04

申请号：US14274118

申请日：2014-05-09

Applicant: Chao Ta HUANG ,  Shih Ting LIN ,  Yu Wen HSU

Inventor： Chao Ta HUANG ,  Shih Ting LIN ,  Yu Wen HSU

IPC: B81C1/00

CPC classification number: B81C1/00134 ,  B81B7/0064 ,  B81C1/0023 ,  B81C2203/00 ,  B81C2203/0792 ,  H01L41/0933 ,  H01L41/1134 ,  H01L2224/11

Abstract: One embodiment discloses an apparatus integrating a microelectromechanical system device with a circuit chip which includes a circuit chip, a microelectromechanical system device, a sealing ring, and a lid. The circuit chip comprises a substrate and a plurality of metal bonding areas. The substrate has an active surface with electrical circuit area, and the metal bonding areas are disposed on the active surface and electrically connected to the electrical circuits. The microelectromechanical system device comprises a plurality of bases and at least one sensing element. The bases are connected to at least one of the metal bonding areas. The at least one sensing element is elastically connected to the bases. The sealing ring surrounds the bases, and is connected to at least one of the metal bonding areas. The lid is opposite to the active surface of the circuit chip, and is connected to the sealing ring to have a hermetic chamber which seals the sensing element and the active surface of the circuit chip.

Abstract translation: 一个实施例公开了一种将微机电系统装置与包括电路芯片，微机电系统装置，密封环和盖的电路芯片集成的装置。 电路芯片包括基板和多个金属接合区域。 基板具有具有电路面积的有源表面，并且金属接合区域设置在有源表面上并电连接到电路。 微机电系统装置包括多个基座和至少一个感测元件。 基底连接至至少一个金属接合区域。 至少一个感测元件弹性地连接到基座。 所述密封环围绕所述基部，并且与所述金属接合区域中的至少一个连接。 盖与电路芯片的有效表面相对，并连接到密封环，以具有密封感测元件和电路芯片的有效表面的密封室。

公开(公告)号：US08643148B2

公开(公告)日：2014-02-04

申请号：US13397204

申请日：2012-02-15

Applicant: Jing-Cheng Lin ,  Hsin Chang ,  Shih Ting Lin

Inventor： Jing-Cheng Lin ,  Hsin Chang ,  Shih Ting Lin

IPC: H01L21/78

CPC classification number: H01L23/28 ,  H01L21/486 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/78 ,  H01L23/147 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5384 ,  H01L24/06 ,  H01L24/14 ,  H01L24/16 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2221/68345 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13655 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A package component includes a substrate, wherein the substrate has a front surface and a back surface over the front surface. A through-via penetrates through the substrate. A conductive feature is disposed over the back surface of the substrate and electrically coupled to the through-via. A first dielectric pattern forms a ring covering edge portions of the conductive feature. An Under-Bump-Metallurgy (UBM) is disposed over and in contact with a center portion of the conductive feature. A polymer contacts a sidewall of the substrate. A second dielectric pattern is disposed over and aligned to the polymer. The first and the second dielectric patterns are formed of a same dielectric material, and are disposed at substantially a same level.

Abstract translation: 包装部件包括基板，其中基板具有前表面和在前表面上的后表面。 通孔穿过基底。 导电特征设置在衬底的背表面上并电连接到通孔。 第一电介质图案形成导电特征的环覆盖边缘部分。 底部金属（UBM）被布置在导电特征的中心部分上并与其接触。 聚合物接触衬底的侧壁。 将第二电介质图案设置在聚合物上并对准聚合物。 第一和第二电介质图案由相同的电介质材料形成，并且设置在基本上相同的水平。

公开(公告)号：US20120147909A1

公开(公告)日：2012-06-14

申请号：US13017053

申请日：2011-01-31

Applicant: Tzong-Yow Tsai ,  Shih-Ting Lin ,  Hong-Xi Tsao ,  Chih-Lin Wang

Inventor： Tzong-Yow Tsai ,  Shih-Ting Lin ,  Hong-Xi Tsao ,  Chih-Lin Wang

IPC: H01S3/30

CPC classification number: H01S3/0675 ,  H01S3/06729 ,  H01S3/07 ,  H01S3/0809 ,  H01S3/094042 ,  H01S3/09415 ,  H01S3/113 ,  H01S3/1618

Abstract: A fiber laser system including a laser pumping source, first and second wavelength reflectors, first and second gain fibers, and first and second long wavelength reflectors is provided. The laser pumping source is adapted to emit a pumping beam. The first wavelength reflector is coupled to the laser pumping source. The first gain fiber is coupled between the first and the second wavelength reflectors. The first long wavelength reflector is coupled between the first gain fiber and the second wavelength reflector. The second long wavelength reflector is coupled between the first long wavelength reflector and the second wavelength reflector. The second gain fiber is coupled between the first and the second long wavelength reflectors. The diameter of the core of the first gain fiber is greater than the diameter of the core of the second gain fiber.

Abstract translation: 提供了包括激光泵浦源，第一和第二波长反射器，第一和第二增益光纤以及第一和第二长波长反射器的光纤激光器系统。 激光泵浦源适于发射泵浦光束。 第一波长反射器耦合到激光泵浦源。 第一增益光纤耦合在第一和第二波长反射器之间。 第一长波长反射器耦合在第一增益光纤与第二波长反射器之间。 第二长波长反射器耦合在第一长波长反射器和第二波长反射器之间。 第二增益光纤耦合在第一和第二长波长反射器之间。 第一增益光纤的芯的直径大于第二增益光纤的芯的直径。

公开(公告)号：US20120001276A1

公开(公告)日：2012-01-05

申请号：US13173119

申请日：2011-06-30

Applicant: Chao Ta HUANG ,  Shih Ting Lin ,  Yu Wen Hsu

Inventor： Chao Ta HUANG ,  Shih Ting Lin ,  Yu Wen Hsu

IPC: H01L29/84 ,  H01L21/02

CPC classification number: B81C1/00134 ,  B81B7/0064 ,  B81C1/0023 ,  B81C2203/00 ,  B81C2203/0792 ,  H01L41/0933 ,  H01L41/1134 ,  H01L2224/11

Abstract: One embodiment discloses an apparatus integrating a microelectromechanical system device with a circuit chip which comprises a circuit chip, a microelectromechanical system device, a sealing ring, and a lid. The circuit chip comprises a substrate and a plurality of metal bonding areas. The substrate has an active surface with electrical circuit area, and the metal bonding areas are disposed on the active surface and electrically connected to the electrical circuits. The microelectromechanical system device comprises a plurality of bases and at least one sensing element. The bases are connected to at least one of the metal bonding areas. The at least one sensing element is elastically connected to the bases. The sealing ring surrounds the bases, and is connected to at least one of the metal bonding areas. The lid is opposite to the active surface of the circuit chip, and is connected to the sealing ring to have a hermetic chamber which seals the sensing element and the active surface of the circuit chip.

Abstract translation: 一个实施例公开了一种将微机电系统装置与包括电路芯片，微机电系统装置，密封环和盖子的电路芯片集成的装置。 电路芯片包括基板和多个金属接合区域。 基板具有具有电路面积的有源表面，并且金属接合区域设置在有源表面上并电连接到电路。 微机电系统装置包括多个基座和至少一个感测元件。 基底连接至至少一个金属接合区域。 至少一个感测元件弹性地连接到基座。 所述密封环围绕所述基部，并且与所述金属接合区域中的至少一个连接。 盖与电路芯片的有效表面相对，并连接到密封环，以具有密封感测元件和电路芯片的有效表面的密封室。

公开(公告)号：US08857259B2

公开(公告)日：2014-10-14

申请号：US13430685

申请日：2012-03-26

Applicant: Yu-Wen Hsu ,  Sheng-Ren Chiu ,  Lu-Po Liao ,  Shih-Ting Lin

Inventor： Yu-Wen Hsu ,  Sheng-Ren Chiu ,  Lu-Po Liao ,  Shih-Ting Lin

IPC: G01C19/56

CPC classification number: G01C19/5776

Abstract: A reading circuit of a gyroscope is provided. The reading circuit includes a driving unit, a high pass filter, a signal processing unit, and a low pass filter. The driving unit generates a resonance signal for a resonator of the gyroscope and generates a demodulation signal for the signal processing unit. The signal processing unit provides a modulation signal to a Coriolis accelerometer of the gyroscope. An input terminal of the high pass filter receives an output signal of the Coriolis accelerometer. The signal processing unit processes and demodulates an output of the high pass filter according to the demodulation signal and outputs a demodulation result to the low pass filter.

Abstract translation: 提供陀螺仪的读取电路。 读取电路包括驱动单元，高通滤波器，信号处理单元和低通滤波器。 驱动单元产生用于陀螺仪的谐振器的谐振信号，并产生信号处理单元的解调信号。 信号处理单元向陀螺仪的科里奥利加速度计提供调制信号。 高通滤波器的输入端接收科里奥利加速度计的输出信号。 信号处理单元根据解调信号对高通滤波器的输出进行处理和解调，并向低通滤波器输出解调结果。

公开(公告)号：US08774239B2

公开(公告)日：2014-07-08

申请号：US13372841

申请日：2012-02-14

Applicant: Yao Wun Jhang ,  Hsin Chia Su ,  Chien Ming Huang ,  Chieh Hu ,  Hong Xi Tsau ,  Shih Ting Lin

Inventor： Yao Wun Jhang ,  Hsin Chia Su ,  Chien Ming Huang ,  Chieh Hu ,  Hong Xi Tsau ,  Shih Ting Lin

IPC: H01S3/10 ,  H04B10/17

CPC classification number: H01S3/06754 ,  H01S3/005 ,  H01S3/0057 ,  H01S3/0064 ,  H01S3/094003 ,  H01S3/1618

Abstract: An ultrafast laser generating system comprises a laser signal generator, a laser signal amplifier and a beam splitting element. The laser signal generator is configured to generate a first nanosecond pulse laser. The laser amplifier is configured to amplify the first nanosecond pulse laser from the laser signal generator so as to generate a second nanosecond pulse laser, which includes a picosecond pulse laser. The beam splitting element is configured to receive the second nanosecond pulse laser and split the picosecond pulse laser from the second nanosecond pulse laser.

Abstract translation: 超快激光发生系统包括激光信号发生器，激光信号放大器和分束元件。 激光信号发生器被配置为产生第一纳秒脉冲激光器。 激光放大器被配置为放大来自激光信号发生器的第一纳秒脉冲激光器，以便产生包括皮秒脉冲激光器的第二纳秒脉冲激光器。 分束元件被配置为接收第二纳秒脉冲激光器并从第二纳秒脉冲激光器分离皮秒脉冲激光器。

公开(公告)号：US08311065B2

公开(公告)日：2012-11-13

申请号：US13017053

申请日：2011-01-31

Applicant: Tzong-Yow Tsai ,  Shih-Ting Lin ,  Hong-Xi Tsao ,  Chih-Lin Wang

Inventor： Tzong-Yow Tsai ,  Shih-Ting Lin ,  Hong-Xi Tsao ,  Chih-Lin Wang

IPC: H01S3/30

CPC classification number: H01S3/0675 ,  H01S3/06729 ,  H01S3/07 ,  H01S3/0809 ,  H01S3/094042 ,  H01S3/09415 ,  H01S3/113 ,  H01S3/1618

Abstract: A fiber laser system including a laser pumping source, first and second wavelength reflectors, first and second gain fibers, and first and second long wavelength reflectors is provided. The laser pumping source is adapted to emit a pumping beam. The first wavelength reflector is coupled to the laser pumping source. The first gain fiber is coupled between the first and the second wavelength reflectors. The first long wavelength reflector is coupled between the first gain fiber and the second wavelength reflector. The second long wavelength reflector is coupled between the first long wavelength reflector and the second wavelength reflector. The second gain fiber is coupled between the first and the second long wavelength reflectors. The diameter of the core of the first gain fiber is greater than the diameter of the core of the second gain fiber.

Abstract translation: 提供了包括激光泵浦源，第一和第二波长反射器，第一和第二增益光纤以及第一和第二长波长反射器的光纤激光器系统。 激光泵浦源适于发射泵浦光束。 第一波长反射器耦合到激光泵浦源。 第一增益光纤耦合在第一和第二波长反射器之间。 第一长波长反射器耦合在第一增益光纤和第二波长反射器之间。 第二长波长反射器耦合在第一长波长反射器和第二波长反射器之间。 第二增益光纤耦合在第一和第二长波长反射器之间。 第一增益光纤的芯的直径大于第二增益光纤的芯的直径。

公开(公告)号：US07920605B2

公开(公告)日：2011-04-05

申请号：US12421592

申请日：2009-04-09

Applicant: Yao-Wun Jhang ,  Chien-Ming Huang ,  Hsin-Chia Su ,  Shih-Ting Lin ,  Li-Ting Wang

Inventor： Yao-Wun Jhang ,  Chien-Ming Huang ,  Hsin-Chia Su ,  Shih-Ting Lin ,  Li-Ting Wang

IPC: H01S3/30

CPC classification number: H01S3/0675 ,  H01S3/005 ,  H01S3/08086 ,  H01S3/09415 ,  H01S3/1613 ,  H04N9/3129

Abstract: An all-fiber color laser and a light-illuminating method thereof are disclosed. The steps of the light-illuminating method include: providing a fiber color laser having a pump light source and an optical fiber with a multi-level wavelength gain medium, a first grating assembly and a second grating assembly; radiating a laser via the pump light source; generating a plurality of laser beams with various wavelengths via the multi-level wavelength gain medium; adjusting the deformation of the second grating assembly to control output of the laser beams with various wavelengths; and executing periodical modulation to generate a periodical lengthwise deformation of the second grating assembly for mixing color.

Abstract translation: 公开了全光纤彩色激光器及其照明方法。 光照射方法的步骤包括：提供具有泵浦光源的光纤颜色激光器和具有多级波长增益介质的光纤，第一光栅组件和第二光栅组件; 通过泵浦光源照射激光; 通过多级波长增益介质生成具有各种波长的多个激光束; 调整第二光栅组件的变形以控制具有各种波长的激光束的输出; 并执行周期性调制以产生用于混合颜色的第二光栅组件的周期性纵向变形。

公开(公告)号：US20100166027A1

公开(公告)日：2010-07-01

申请号：US12400788

申请日：2009-03-09

Applicant: Yao-Wun Jhang ,  Chien-Ming Huang ,  Hsin-Chia Su ,  Shih-Ting Lin ,  Li-Ting Wang ,  Hong-Xi Cao

Inventor： Yao-Wun Jhang ,  Chien-Ming Huang ,  Hsin-Chia Su ,  Shih-Ting Lin ,  Li-Ting Wang ,  Hong-Xi Cao

IPC: H01S3/14 ,  H01S3/30

CPC classification number: H01S3/0675 ,  H01S3/06791 ,  H01S3/094092 ,  H01S3/094096 ,  H01S3/1608 ,  H01S3/1618 ,  H01S3/173

Abstract: A laser apparatus with all optical-fiber includes a plurality of pumping light sources in different wave bands and an optical-fiber laser system. The optical-fiber laser system includes an optical fiber at least doped with erbium (Er) element and doped with or not doped with ytterbium (Yb) element according to a need. The optical-fiber laser system outputs a laser light through the pumping light source.

Abstract translation: 具有所有光纤的激光装置包括不同波段的多个泵浦光源和光纤激光系统。 光纤激光系统包括至少掺杂有铒（Er）元素并根据需要掺杂或不掺杂镱（Yb）元素的光纤。 光纤激光系统通过泵浦光源输出激光。