Abstract:
In one embodiment, a system to inspect the edge of a wafer, comprises an surface analyzer assembly, a first drive assembly to impart linear motion between the surface analyzer and a first surface of the wafer, and a second drive assembly to impart rotary motion between the surface analyzer and the wafer about an axis parallel to the first surface of the wafer.
Abstract:
A method comprises generating a data set comprising first surface roughness data from a first orientation and second surface roughness data from a second orientation and determining a roughness bias parameter from the first surface roughness data and the second surface roughness data.
Abstract:
In one embodiment, a surface analyzer system comprises a radiation targeting assembly to target a radiation beam onto a surface; and a reflected radiation collecting assembly that collects radiation reflected from the surface, wherein the reflected radiation collecting assembly comprises a mirror to collect radiation reflected from the surface.
Abstract:
A laser based inspection tool (LIT) for inspecting planar surfaces is described. In a preferred embodiment the LIT can simultaneously inspect both planar surfaces of disks for use in disk drives. In one embodiment of the invention, the incident beam is directed onto the surface to be inspected at an angle slightly offset from perpendicular so that the reflected beam is physically separated from the incident beam. The reflected beam is routed to a detector which converts the intensity of the reflected into an analog signal. The analog signal is sampled and digitized to generate pixel data stored in a buffer. Various analyses are performed on the data including calculating a rate of change in the pixel data. If the rate of change in the pixel data exceeds a selected threshold that indicates a possible defect if it occurs in the data area of the disk.
Abstract:
In one embodiment, a system to inspect an edge region of a wafer, comprises a surface analyzer assembly comprising a radiation targeting assembly that targets a radiation beam onto a surface of the wafer; a reflected radiation collection assembly to collect radiation reflected from a surface of the wafer; means for rotating the surface analyzer assembly about an edge surface of the wafer; and means for detecting one or more defects in the edge region of the wafer.
Abstract:
In one embodiment, a surface analyzer system comprises a radiation targeting assembly to target radiation onto a surface, a reflected radiation collecting assembly that collects radiation reflected from the surface, and a signal processing module. The signal processing module generates an image of magnetic characteristics of the magnetic disk, wherein the image comprises a plurality of servo sector arcs, locates a sample of points on a plurality of the servo sector arcs, fits a circle to the sample of points on each of the plurality of servo sector arcs, and determines at least one pivot-to-gap measurement from the radius of the circles.
Abstract:
In one embodiment, a system for inspecting a first surface of a substrate, comprises a first reflected radiation collector to generate a first signal set representing one or more characteristics of radiation reflected from the first surface from a radiation source disposed in a first plane of incidence, a spatial filter in the radiation path between the surface and the first reflected radiation collector, a second reflected radiation collector to generate a second signal set representing one or more characteristics of radiation reflected from the first surface from a radiation source disposed in a first plane of incidence approximately orthogonal to the first plane of incidence, a spatial filter in the radiation path between the surface and the first reflected radiation collector, means for combining the first signal set and the second signal set to generate a signal set which represents one or more characteristics of the first surface, and means for processing the signal set to generate a data set representing one or more characteristics of the first surface.
Abstract:
Scratches, pits and particles which are smaller or larger than the beam size may be measured and identified by a dual beam technique. This invention uses a pair of orthogonally oriented laser beams, one in the radial and one in the circumferential direction. The scattered light from radial and circumferential beams allows the detection and classification of particles, pits and scratches.
Abstract:
Scratches, pits and particles which are smaller or larger than the beam size may be measured and identified by a single and dual multiple beam techniques. In one embodiment, this the invention uses a pair of orthogonally oriented white light beams, one in the radial and one in the circumferential direction. The scattered light from the radial and circumferential beams allows the detection and classification of particles, pits and scratches. In other embodiments, single beam techniques are used to classify radial and circumferential defects.