公开(公告)号：WO2012135497A3

公开(公告)日：2013-02-28

申请号：PCT/US2012031208

申请日：2012-03-29

Applicant: SMITH INTERNATIONAL ,  TESSITORE TED ,  GRIFFO ANTHONY ,  SHEN YUELIN ,  ZHANG YOUHE ,  KESHAVAN MADAPUSI K

Inventor： TESSITORE TED ,  GRIFFO ANTHONY ,  SHEN YUELIN ,  ZHANG YOUHE ,  KESHAVAN MADAPUSI K

IPC: E21B10/46 ,  E21B10/567 ,  E21B10/573

CPC classification number: C03C25/68 ,  B22F2003/244 ,  C22C1/1094 ,  C22C26/00 ,  E21B10/54

Abstract: A cutting element that includes a polycrystalline diamond layer having a cutting face and a diamond layer side surface, a substrate attached to the polycrystalline diamond layer, the substrate having a bottom surface and a substrate side surface, an interface between the diamond layer and the substrate, and a mask covering at least the bottom surface and the substrate side surface of the cutting element is disclosed.

Abstract translation: 一种切割元件，其包括具有切割面和金刚石层侧表面的多晶金刚石层，附着到所述多晶金刚石层的基板，所述基板具有底表面和基板侧表面，所述金刚石层和所述基板之间的界面 并且公开了至少覆盖切割元件的底表面和基板侧表面的掩模。

公开(公告)号：WO2012135497A2

公开(公告)日：2012-10-04

申请号：PCT/US2012/031208

申请日：2012-03-29

Applicant: SMITH INTERNATIONAL INC. ,  TESSITORE, Ted ,  GRIFFO, Anthony ,  SHEN, Yuelin ,  ZHANG, Youhe ,  KESHAVAN, Madapusi K.

Inventor： TESSITORE, Ted ,  GRIFFO, Anthony ,  SHEN, Yuelin ,  ZHANG, Youhe ,  KESHAVAN, Madapusi K.

IPC: E21B10/46 ,  E21B10/567 ,  E21B10/573

CPC classification number: C03C25/68 ,  B22F2003/244 ,  C22C1/1094 ,  C22C26/00 ,  E21B10/54

Abstract: A cutting element that includes a polycrystalline diamond layer having a cutting face and a diamond layer side surface, a substrate attached to the polycrystalline diamond layer, the substrate having a bottom surface and a substrate side surface, an interface between the diamond layer and the substrate, and a mask covering at least the bottom surface and the substrate side surface of the cutting element is disclosed.

Abstract translation: 一种切割元件，其包括具有切割面和金刚石层侧表面的多晶金刚石层，附着到所述多晶金刚石层的基底，所述基底具有底表面和基底侧表面，所述金刚石层和所述基底之间的界面 以及至少覆盖切割元件的底面和基板侧面的掩模。