公开(公告)号：NZ333085A

公开(公告)日：1999-03-29

申请号：NZ33308598

申请日：1998-12-01

Applicant: THOMAS CLINT RICHARD

Inventor： THOMAS CLINT RICHARD

IPC: H01K3/32

公开(公告)号：WO2008130517A1

公开(公告)日：2008-10-30

申请号：PCT/US2008/004752

申请日：2008-04-11

Applicant: LAM RESEARCH CORPORATION ,  THIE, William ,  BOYD, John, M. ,  REDEKER, Fritz, C. ,  DORDI, Yezdi ,  PARKS, John ,  ARUNAGIRI, Tiruchirapalli ,  OWCZARZ, Aleksander ,  BALISKY, Todd ,  THOMAS, Clint ,  WYLIE, Jacob ,  SCHOEPP, Alan, M.

Inventor： THIE, William ,  BOYD, John, M. ,  REDEKER, Fritz, C. ,  DORDI, Yezdi ,  PARKS, John ,  ARUNAGIRI, Tiruchirapalli ,  OWCZARZ, Aleksander ,  BALISKY, Todd ,  THOMAS, Clint ,  WYLIE, Jacob ,  SCHOEPP, Alan, M.

IPC: H01L21/28 ,  H01L21/3205

CPC classification number: H01L21/288 ,  C23C18/1619 ,  C23C18/1632 ,  H01L21/76873

Abstract: A dry-in/dry-out system is disclosed for wafer electroless plating. The system includes an upper zone for wafer ingress/egress and drying operations. Proximity heads are provided in the upper zone to perform the drying operations. The system also includes a lower zone for electroless plating operations. The lower zone includes an electroless plating apparatus that implements a wafer submersion by fluid upwelling method. The upper and lower zones of the system are enclosed by a dual- walled chamber, wherein the inner wall is a chemically inert plastic and the outer wall is a structural metal. The system interfaces with a fluid handling system which provides the necessary chemistry supply and control for the system. The system is ambient controlled. Also, the system interfaces with an ambient controlled managed transfer module (MTM).

Abstract translation: 公开了一种用于晶片无电镀的干/干输出系统。 该系统包括用于晶片入口/出口和干燥操作的上部区域。 靠近头部设置在上部区域以执行干燥操作。 该系统还包括用于无电镀操作的下部区域。 下部区域包括通过流体上升流法实现晶片浸没的化学镀设备。 系统的上部和下部区域由双壁室围住，其中内壁是化学惰性塑料，外壁是结构金属。 系统与流体处理系统接口，为系统提供必要的化学物质供应和控制。 系统是环境控制的。 此外，系统与环境受控的托管传输模块（MTM）接口。

公开(公告)号：WO2007078642A2

公开(公告)日：2007-07-12

申请号：PCT/US2006/047119

申请日：2006-12-08

Applicant: LAM RESEARCH CORPORATION ,  FREER, Erik, M. ,  DE LARIOS, John, M. ,  MIKHAYLICHENKO, Katrina ,  RAVKIN, Michael ,  KOROLIK, Mikhail ,  REDEKER, Fred, C. ,  THOMAS, Clint ,  PARKS, John

Inventor： FREER, Erik, M. ,  DE LARIOS, John, M. ,  MIKHAYLICHENKO, Katrina ,  RAVKIN, Michael ,  KOROLIK, Mikhail ,  REDEKER, Fred, C. ,  THOMAS, Clint ,  PARKS, John

IPC: C23G1/00 ,  B08B7/00 ,  B08B7/04 ,  B08B3/00 ,  B08B3/12

CPC classification number: H01L21/02057 ,  B05D3/10 ,  B08B7/02 ,  C11D1/04 ,  C11D3/042 ,  C11D3/044 ,  C11D3/18 ,  C11D3/2079 ,  C11D3/222 ,  C11D3/225 ,  C11D3/3765 ,  C11D9/00 ,  C11D9/02 ,  C11D9/267 ,  C11D11/0047 ,  C11D17/0004 ,  C11D17/0013 ,  C11D17/0017 ,  C11D17/003 ,  C11D17/041 ,  C23G1/00 ,  C23G1/18 ,  G03F7/42 ,  G03F7/423 ,  H01L21/02052 ,  H01L21/02096 ,  H01L21/31133 ,  H01L21/67051 ,  H01L21/67057 ,  H01L21/6708 ,  H01L21/67086

Abstract: A cleaning material is disposed over a substrate. The cleaning material includes solid components dispersed within a liquid medium. A force is applied to the solid components within the liquid medium to bring the solid components within proximity to contaminants present on the substrate. The force applied to the solid components can be exerted by an immiscible component within the liquid medium. When the solid components are brought within sufficient proximity to the contaminants, an interaction is established between the solid components and the contaminants. Then, the solid components are moved away from the substrate such that the contaminants having interacted with the solid components are removed from the substrate.

Abstract translation: 清洁材料设置在基板上。 清洁材料包括分散在液体介质中的固体组分。 将力施加到液体介质中的固体组分以使固体组分接近存在于基底上的污染物。 施加到固体组分的力可以通过液体介质中的不混溶组分施加。 当固体组分被充分接近污染物时，在固体组分和污染物之间建立了相互作用。 然后，将固体组分从衬底移开，使得与固体组分相互作用的污染物从衬底上除去。

公开(公告)号：WO2008130518A1

公开(公告)日：2008-10-30

申请号：PCT/US2008/004759

申请日：2008-04-11

Applicant: LAM RESEARCH CORPORATION ,  THIE, William ,  BOYD, John, M. ,  REDEKER, Fritz, C. ,  DORDI, Yezdi ,  PARKS, John ,  ARUNAGIRI, Tiruchirapalli ,  OWCZARZ, Aleksander ,  BALISKY, Todd ,  THOMAS, Clint ,  WYLIE, Jacob ,  SCHOEPP, Alan, M.

Inventor： THIE, William ,  BOYD, John, M. ,  REDEKER, Fritz, C. ,  DORDI, Yezdi ,  PARKS, John ,  ARUNAGIRI, Tiruchirapalli ,  OWCZARZ, Aleksander ,  BALISKY, Todd ,  THOMAS, Clint ,  WYLIE, Jacob ,  SCHOEPP, Alan, M.

IPC: H01L21/28 ,  H01L21/3205

CPC classification number: C23C18/1628 ,  Y10T137/87652

Abstract: A chemical fluid handling system is defined to supply a number of chemicals to a number of fluid inputs of a mixing manifold. The chemical fluid handling system includes a number of fluid recirculation loops for separately pre-conditioning and controlling the supply of each of the number of chemicals. Each of the fluid recirculation loops is defined to degas, heat, and filter a particular one of the number of chemical components. The mixing manifold is defined to mix the number of chemicals to form the electroless plating solution. The mixing manifold includes a fluid output connected to a supply line. The supply line is connected to supply the electroless plating solution to a fluid bowl within an electroless plating chamber.

Abstract translation: 化学流体处理系统被定义为向混合歧管的多个流体输入提供许多化学物质。 化学流体处理系统包括多个流体再循环回路，用于分别预处理和控制每个化学物质的供应。 每个流体循环回路被定义为对特定的一个化学成分进行脱气，加热和过滤。 混合歧管被定义为混合化学品的数量以形成化学镀溶液。 混合歧管包括连接到供应管线的流体输出。 供电线连接以将化学镀溶液供应到化学镀室内的流体碗。

公开(公告)号：WO2007078642A3

公开(公告)日：2007-12-27

申请号：PCT/US2006047119

申请日：2006-12-08

Applicant: LAM RES CORP ,  FREER ERIK M ,  DE LARIOS JOHN M ,  MIKHAYLICHENKO KATRINA ,  RAVKIN MICHAEL ,  KOROLIK MIKHAIL ,  REDEKER FRED C ,  THOMAS CLINT ,  PARKS JOHN

Inventor： FREER ERIK M ,  DE LARIOS JOHN M ,  MIKHAYLICHENKO KATRINA ,  RAVKIN MICHAEL ,  KOROLIK MIKHAIL ,  REDEKER FRED C ,  THOMAS CLINT ,  PARKS JOHN

IPC: B08B7/00

CPC classification number: H01L21/02057 ,  B05D3/10 ,  B08B7/02 ,  C11D1/04 ,  C11D3/042 ,  C11D3/044 ,  C11D3/18 ,  C11D3/2079 ,  C11D3/222 ,  C11D3/225 ,  C11D3/3765 ,  C11D9/00 ,  C11D9/02 ,  C11D9/267 ,  C11D11/0047 ,  C11D17/0004 ,  C11D17/0013 ,  C11D17/0017 ,  C11D17/003 ,  C11D17/041 ,  C23G1/00 ,  C23G1/18 ,  G03F7/42 ,  G03F7/423 ,  H01L21/02052 ,  H01L21/02096 ,  H01L21/31133 ,  H01L21/67051 ,  H01L21/67057 ,  H01L21/6708 ,  H01L21/67086

Abstract: A cleaning material is disposed over a substrate. The cleaning material includes solid components dispersed within a liquid medium. A force is applied to the solid components within the liquid medium to bring the solid components within proximity to contaminants present on the substrate. The force applied to the solid components can be exerted by an immiscible component within the liquid medium. When the solid components are brought within sufficient proximity to the contaminants, an interaction is established between the solid components and the contaminants. Then, the solid components are moved away from the substrate such that the contaminants having interacted with the solid components are removed from the substrate.

Abstract translation: 清洁材料设置在基板上。 清洁材料包括分散在液体介质内的固体组分。 对液体介质内的固体组分施加力以使固体组分接近衬底上存在的污染物。 施加到固体组分上的力可以由液体介质内的不混溶组分施加。 当固体组分充分接近污染物时，在固体组分和污染物之间建立相互作用。 然后，将固体组分移离基底，使得从基底去除与固体组分相互作用的污染物。

公开(公告)号：WO2008130519A1

公开(公告)日：2008-10-30

申请号：PCT/US2008/004769

申请日：2008-04-14

Applicant: LAM RESEARCH CORPORATION ,  THIE, William ,  BOYD, John, M. ,  REDEKER, Fritz, C. ,  DORDI, Yezdi ,  PARKS, John ,  ARUNAGIRI, Tiruchirapalli ,  OWCZARZ, Aleksander ,  BALISKY, Todd ,  THOMAS, Clint ,  WYLIE, Jacob ,  SCHOEPP, Alan, M.

Inventor： THIE, William ,  BOYD, John, M. ,  REDEKER, Fritz, C. ,  DORDI, Yezdi ,  PARKS, John ,  ARUNAGIRI, Tiruchirapalli ,  OWCZARZ, Aleksander ,  BALISKY, Todd ,  THOMAS, Clint ,  WYLIE, Jacob ,  SCHOEPP, Alan, M.

IPC: H01L21/304

CPC classification number: H01L21/02104 ,  C23C18/1619 ,  H01L21/67005 ,  H01L21/6715

Abstract: A semiconductor wafer electroless plating apparatus includes a platen and a fluid bowl. The platen has a top surface defined to support a wafer, and an outer surface extending downward from a periphery of the top surface to a lower surface of the platen. The fluid bowl has an inner volume defined by an interior surface so as to receive the platen, and wafer to be supported thereon, within the inner volume. A seal is disposed around the interior surface of the fluid bowl so as to form a liquid tight barrier when engaged between the interior surface of the fluid bowl and the outer surface of the platen. A number of fluid dispense nozzles are positioned to dispense electroplating solution within the fluid bowl above the seal so as to rise up and flow over the platen, thereby flowing over the wafer when present on the platen.

Abstract translation: 半导体晶片化学镀设备包括压板和流体碗。 压板具有限定为支撑晶片的顶表面和从顶表面的周边向下延伸到压板的下表面的外表面。 流体碗具有由内表面限定的内部容积，以便在内部容积内容纳压板和要支撑在其上的晶片。 密封件设置在流体碗的内表面周围，以便当接合在流体碗的内表面和压板的外表面之间时形成液密屏障。 多个流体分配喷嘴被定位成在密封件上方的流体碗内分配电镀溶液，以便在压板上升起并流动，从而当存在于压板上时流过晶片。