Abstract:
A plasma enhanced atomic layer deposition (PEALD) method and system, the system including a process chamber and a substrate holder provided within the processing chamber and configured to support a substrate on which a predetermined film will be formed. A first process material supply system is configured to supply a first process material to the process chamber, and a second process material supply system configured to supply a second process material to the process chamber in order to provide a reduction reaction with the first process material to form the predetermined film on the substrate. Also included is a power source configured to couple electromagnetic power to the process chamber to generate a plasma within the process chamber to facilitate the reduction reaction, and a chamber component exposed to the plasma and made from a film compatible material that is compatible with the predetermined film deposited on the substrate.
Abstract:
A method for depositing a film on a substrate using a plasma enhanced atomic layer deposition (PEALD) process includes disposing the substrate in a process chamber configured to facilitate the PEALD process. A first process material is introduced within the process chamber, and a second process material is introduced within the process chamber. Electromagnetic power of more than 600W is coupled to the process chamber during introduction of the second process material in order to generate a plasma that accelerates a reduction reaction between the first and second process materials at a surface of the substrate. The film is formed on the substrate by alternatingly introducing the first process material and the second process material.
Abstract:
A process for producing a polyoxymethylene copolymer by copolymerizing trioxane as a main monomer with a cyclic ether or a cyclic formal as a comonomer by using a cationically active catalyst, wherein an alkali metal fluoride is contacted with the copolymer after the completion of the copolymerization to thereby deactivate the polymerization catalyst. The treatment is effected at a pH-value of >/= 7.0, producing a polyoxymethylene copolymer having an improved heat stability.___________________________________________
Abstract:
A polyoxymethylene composition which is improved in thermal stability, little stains the mold even in continuous long-term molding work, and is extremely reduced in the emission of a formaldehyde smell. The composition comprises polyoxymethylene, 0.01-5 wt. % of an antioxidant and 0.01-10 wt.% of a melamine-formaldehyde polycondensate, each based on the polyoxymethylene. The polycondensate to be used is one which is prepared by the reaction of mainly melamine and formaldehyde and contains on average 2.0-10 mol of melamine units per mole, and wherein 3 mol of the amino groups contained in 1 mol of melamine have on average at least 3.0 mol of hydrogen.
Abstract:
A modified polyacetal obtained by heating 100 pts.wt. of a polyacetal component (A) together with 0.1 - 30 pts.wt. of a polymerizable compound (B) having a modifying group such as an epoxy, carboxyl or acid anhydride group to thereby introduce the modifying group into the polyacetal. The component (A) includes a polyacetal (A1) selected from among polyoxymethylene homopolymer and copolymers and a polymerizable polyacetal (A2) having functional groups containing a polymerizable unsaturated bond. The efficiency of introduction of the modifying group can be improved by adding 0.01 - 2.5 pts.wt. of a free-radical initiator to 100 pts.wt. in total of the components (A) and (B) and mixing in a state in which the polyacetal is molten. This process ensures simple and efficient introduction of the modifying group into the polyacetal component and improves the affinity of the polyacetal.
Abstract:
A plasma enhanced atomic layer deposition (PEALD) system includes a first chamber component coupled to a second chamber component to provide a processing chamber defining an isolated processing space within the processing chamber. A substrate holder is provided within the processing chamber and configured to support a substrate, a first process material supply system is configured to supply a first process material to the processing chamber and a second process material supply system is configured to supply a second process material to the processing chamber. A power source is configured to couple electromagnetic power to the processing chamber, and a sealing assembly interposed between the first and second chamber components. The sealing assembly includes a plurality of sealing members configured to reduce the amount of external contaminants permeating through an interface of the first and second components into the isolated processing space of the processing chamber, wherein the film is formed on the substrate by altematingly introducing the first process material and the second process material.
Abstract:
A plasma enhanced atomic layer deposition (PEALD) system includes a first chamber component coupled to a second chamber component to provide a processing chamber defining an isolated processing space within the processing chamber. A substrate holder is provided within the processing chamber and configured to support a substrate, a first process material supply system is configured to supply a first process material to the processing chamber and a second process material supply system is configured to supply a second process material to the processing chamber. A power source is configured to couple electromagnetic power to the processing chamber, and a sealing assembly interposed between the first and second chamber components. The sealing assembly includes a plurality of sealing members configured to reduce the amount of external contaminants permeating through an interface of the first and second components into the isolated processing space of the processing chamber, wherein the film is formed on the substrate by altematingly introducing the first process material and the second process material.
Abstract:
A cyclic polyoxymethylene with a number-average molecular weight of 500 to 5,000 is produced by treating an alkali-decomposable linear polyoxymethylene homopolymer in an organic liquid medium containing a cationically active catalyst in solid form at 10 to 150 DEG C for 1 to 500 min to effect cyclization. The reaction mixture obtained by the cyclization is treated with an alkaline medium to remove unreacted linear polyoxymethylene homopolymer by hydrolysis, thus isolating cyclic polyoxymethylene. The product has a narrow molecular weight distribution and is useful as a resin modifier.
Abstract:
A plasma enhanced atomic layer deposition (PEALD) system includes a processing chamber defining an isolated processing space within the processing chamber, and a substrate holder provided within the processing chamber and configured to support a substrate. A first process material supply system is configured to supply a first process material to the processing chamber, a second process material supply system is configured to supply a second process material to the processing chamber and a power source is configured to couple electromagnetic power to the processing chamber. A contaminant shield is positioned along a periphery of the substrate holder and configured to impede external contaminants that permeate the chamber from traveling to a region of the substrate holder, wherein the film is formed on the substrate by altematingly introducing the first process material and the second process material.
Abstract:
A method for depositing a film on a substrate using a plasma enhanced atomic layer deposition (PEALD) process includes disposing the substrate in a process chamber configured to facilitate the PEALD process. A first process material is introduced within the process chamber, and a second process material is introduced within the process chamber. Electromagnetic power of more than 600W is coupled to the process chamber during introduction of the second process material in order to generate a plasma that accelerates a reduction reaction between the first and second process materials at a surface of the substrate. The film is formed on the substrate by alternatingly introducing the first process material and the second process material.