公开(公告)号：US06242163B1

公开(公告)日：2001-06-05

申请号：US09387328

申请日：1999-08-31

Applicant: Jurgen Stampfl ,  Alexander Cooper ,  Rudolf Leitgeb ,  Yih-Lin Cheng ,  Friedrich Prinz

Inventor： Jurgen Stampfl ,  Alexander Cooper ,  Rudolf Leitgeb ,  Yih-Lin Cheng ,  Friedrich Prinz

IPC: C23F100

CPC classification number: C23F1/00 ,  B81C99/0085 ,  B81C2201/019 ,  B81C2201/034

Abstract: Micro-Mold Shape Deposition Manufacturing (&mgr;-Mold SDM) is a method for fabricating complex, three-dimensional microstructures from layered silicon molds. Silicon wafers are etched using conventional silicon-processing techniques to produce wafers with surface patterns, some of which contain through-etched regions. The wafers are then stacked and bonded together to form a mold, which is filled with part material. In one embodiment, the part material is a ceramic or metallic gelcasting slurry that is poured into the mold and solidified to form a part precursor. The mold is removed, and the precursor is sintered to form the final part. The gelcasting material may also be a polymer or magnetic slurry, in which case sintering is not needed. The mold can also be filled by electroplating a metal into it; if necessary, each layer is filled with metal after being bonded to a previously filled layer. Patterned silicon wafer layers may also be combined with macroscopic wax layers formed by Mold SDM to create macroscopic parts with some microscopic parts or features.

Abstract translation: 微模形状沉积制造（mu-Mold SDM）是从分层硅模制造复杂的三维微结构的方法。 使用常规的硅处理技术来蚀刻硅晶片以产生具有表面图案的晶片，其中一些具有贯通蚀刻区域。 然后将晶片堆叠并结合在一起以形成用部件材料填充的模具。 在一个实施例中，部件材料是陶瓷或金属凝胶浇注浆料，其被倒入模具中并固化以形成部件前体。 去除模具，并将前体烧结以形成最终部分。 凝胶浇铸材料也可以是聚合物或磁性浆料，在这种情况下不需要烧结。 模具也可以通过将金属电镀到其中来填充; 如果需要，每层在结合到预先填充的层之后都填充有金属。 图案化的硅晶片层还可以与由模具SDM形成的宏观蜡层组合以产生具有一些微观部件或特征的宏观部件。

公开(公告)号：US06531036B1

公开(公告)日：2003-03-11

申请号：US09383113

申请日：1999-08-25

Applicant: Rudolf Leitgeb ,  Jurgen Stampfl ,  Yih-Lin Cheng ,  Friedrich Prinz

Inventor： Rudolf Leitgeb ,  Jurgen Stampfl ,  Yih-Lin Cheng ,  Friedrich Prinz

IPC: H01L2100

CPC classification number: B23H1/04 ,  B23H9/00 ,  B81C99/0085 ,  H01F41/34

Abstract: A method for fabricating sub-millimeter sized parts uses electrodes created from patterned silicon wafers for electric-discharge machining (EDM), in which an electric discharge is generated between a patterned electrode and a conductive workpiece. Workpiece material corresponding to the electrode pattern is removed by electroerosion, and the remaining workpiece contains the desired part. Electrodes are formed by etching stepped patterns in silicon wafers and depositing a thin metallic layer on the wafer. The resulting electrode is used in an EDM machine, and an inverse pattern is produced in the part. Alternately, the silicon wafer pattern is filled by a metal to produce a metal electrode with an inverse pattern. The wafer is removed from the metal, and the metal is used in an EDM machine. The resulting part has the same pattern as the silicon wafer used to create the metal electrode. The metal can be electroplated into the wafer pattern, in which case copper may be used, or metal powder can be hot-pressed into the wafer. Hot pressed electrodes are preferably a mixture of silver and tungsten. The present method is adaptable to highly parallel manufacturing, and can be fully automated using a CAD/CAM system with added process-specific extensions.

Abstract translation: 用于制造亚毫米尺寸部件的方法使用由图案化硅晶片产生的放电加工（EDM）的电极，其中在图案化电极和导电工件之间产生放电。 对应于电极图案的工件材料通过电蚀去除，剩余的工件包含所需部分。 电极通过在硅晶片中蚀刻阶梯图案并在薄片上沉积薄金属层而形成。 所得电极用于电火花加工机，在该部件中产生反向图案。 或者，硅晶片图案由金属填充以产生具有相反图案的金属电极。 将晶片从金属上除去，并将金属用于EDM机器中。 所得部分具有与用于形成金属电极的硅晶片相同的图案。 金属可以电镀到晶片图案中，在这种情况下可以使用铜，或者可以将金属粉末热压到晶片中。 热压电极优选为银和钨的混合物。 本方法适用于高度并行的制造，并且可以使用具有附加的处理特定扩展的CAD / CAM系统进行全自动化。