公开(公告)号：KR101417924B1

公开(公告)日：2014-07-11

申请号：KR1020130017748

申请日：2013-02-20

Applicant: (주)미래컴퍼니

Inventor： 송청호 ,  이상만 ,  류재연 ,  배성민

IPC: B23K26/38 ,  B23K26/00 ,  B23K26/04

Abstract: Disclosed are a laser processing apparatus and a laser processing method. The laser processing method comprises a step for providing a bonded panel bonded by interposing an intermediate layer between a first panel and a second panel; a step for inserting a film between the second panel and the intermediate layer to correspond with a processing object position; and a step for cutting a part of the second panel by irradiating the part with a laser. In the cutting step, damage to the intermediate layer in a laser processing step is prevented by controlling a processing depth of a laser corresponding to the thickness of the film. According to the present invention, the laser processing method is capable of selectively cutting one side of an LCD panel, which is formed by bonding a color filter panel and a TFT panel, using a laser depending on the need. Therefore, damage, which might be generated, can be prevented and repaired even if the damage is generated.

Abstract translation: 公开了一种激光加工装置和激光加工方法。 激光加工方法包括通过在第一面板和第二面板之间插入中间层来提供接合的面板的步骤; 用于在第二面板和中间层之间插入薄膜以对应于处理对象位置的步骤; 以及通过用激光照射该部分来切割第二面板的一部分的步骤。 在切割步骤中，通过控制与膜的厚度相对应的激光的处理深度来防止激光加工步骤中的中间层的损坏。 根据本发明，根据需要，激光加工方法能够选择性地切割通过使用激光结合滤色器面板和TFT面板而形成的LCD面板的一侧。 因此，即使产生损害，也可以防止和修复损坏。

公开(公告)号：KR1020140105414A

公开(公告)日：2014-09-01

申请号：KR1020140049075

申请日：2014-04-24

Applicant: (주)미래컴퍼니

Inventor： 송청호 ,  이상만 ,  류재연 ,  배성민

IPC: B23K26/34 ,  B23K26/38

Abstract: Disclosed are a laser processing method comprising a step for providing a bonded panel bonded by interposing an intermediate layer between a first panel and a second panel, a step for inserting a film between the second panel and the intermediate layer to correspond to a processing target location, and a step for cutting a part of the second panel by irradiating a laser; and a laser processing apparatus. The cutting step is performed to prevent damage in the intermediate layer in the laser processing method by controlling a processing depth of a laser to correspond to the thickness of the film. An LCD panel is formed by binding a color filter panel and a TFT panel. The present invention has an effect of preventing damage, which might occur when one panel is selectively cut by using a laser as necessary; and repairing damage even if the damage is occurred.

Abstract translation: 公开了一种激光加工方法，包括通过在第一面板和第二面板之间插入中间层来提供粘合的接合面板的步骤，用于在第二面板和中间层之间插入薄膜以对应于处理目标位置的步骤 以及通过照射激光来切割第二面板的一部分的步骤; 和激光加工装置。 执行切割步骤以通过控制激光器的处理深度来对应于膜的厚度来防止激光加工方法中的中间层的损坏。 LCD面板通过结合滤色器面板和TFT面板而形成。 本发明具有防止当需要使用激光选择性地切割一个面板时可能发生的损坏的效果; 即使损坏发生，也可以修复损坏。