公开(公告)号：KR1020110088953A

公开(公告)日：2011-08-04

申请号：KR1020100008710

申请日：2010-01-29

Applicant: (주)티피에스 ,  재단법인 대구테크노파크

Inventor： 이원근 ,  배영제 ,  우원희 ,  전구식 ,  정승필 ,  김동한 ,  오지훈

IPC: H01L21/66

Abstract: PURPOSE: A wafer surface inspection is provided to improve the accuracy of a surface analysis in wafer by emitting the right which is emitted from a light source of an optical microscope as an angle of incidence of a prescribed range which is not perpendicularity. CONSTITUTION: A supporting plate(10) is located at the lower part of a projection lens of an optical microscope. A search point controlling part(20) is connected to the upper part of the supporting plate. A wafer which inspects a surface is horizontally arranged on the search point controlling part. The search point controlling part controls a search point about a wafer surface of the right which is emitted from the optical microscope through the projection lens. A search angle controlling part(30) is connected to between the search spot controlling part and the supporting plate and controls a search angle about a search spot of the right.

Abstract translation: 目的：提供晶片表面检查，通过发射从光学显微镜的光源发射的权利作为不是垂直度的规定范围的入射角来提高晶片中的表面分析的精度。 构成：支撑板（10）位于光学显微镜的投影透镜的下部。 搜索点控制部分（20）连接到支撑板的上部。 检查表面的晶片水平地布置在搜索点控制部分上。 搜索点控制部分控制通过投影透镜从光学显微镜发射的关于右侧的晶片表面的搜索点。 搜索角度控制部分（30）连接到搜索点控制部分和支撑板之间，并控制关于右侧搜索点的搜索角度。