公开(公告)号：KR100734917B1

公开(公告)日：2007-07-03

申请号：KR1020070029958

申请日：2007-03-27

Applicant: (주)파트론

Inventor： 임병준 ,  이정남 ,  박종권

IPC: H01Q1/24

CPC classification number: H01Q1/243 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q9/0414 ,  H01Q9/0421 ,  H01Q9/0442 ,  H01Q13/10

Abstract: A DVB-H(Digital Video Broadcasting-Handheld) antenna for a mobile communication terminal is provided to acquire a sufficient antenna space in the mobile communication terminal by including a radiator of a bent shape between an upper ground plane and a lower ground plane. A DVB-H antenna for a mobile communication terminal includes a lower ground plane(201), an upper ground plane(200), a hinge(205), a radiator(204), a short circuit line(206), a feeding line(203), and a matching circuit. The lower ground plane(201) is located on a PCB substrate. The upper ground plane(200) is located to be apart from the lower ground plane(201). The hinge(205) connects a side of the lower ground plane(201) with a side of the upper ground plane(200). The radiator(204) of a bent shape is located on a space between the lower ground plane and the upper ground plane(200). The short circuit line(206) connects the upper ground plane(200) with a left or right upper side of the radiator(204). The feeding line(203) connects a left or right lower side of the radiator(204) with a part from which the lower ground plane(201) is removed. The matching circuit locates a chip capacitor in series or parallel by removing a part of the feeding line(203). The matching circuit is formed by locating a chip inductor and the chip capacitor in parallel between the feeding line(203) and the lower ground plane(201).

Abstract translation: 提供了一种用于移动通信终端的DVB-H（数字视频广播 - 手持式）天线，用于通过在上地平面和下地平面之间包括弯曲形状的散热器来获取移动通信终端中的足够的天线空间。 用于移动通信终端的DVB-H天线包括下接地平面（201），上接地平面（200），铰链（205），散热器（204），短路线（206），馈线 （203）和匹配电路。 下接地平面（201）位于PCB基板上。 上接地平面（200）位于与下接地平面（201）分开的位置。 铰链（205）将下接地平面（201）的一侧与上接地平面（200）的一侧连接。 弯曲形状的散热器（204）位于下地平面和上地平面（200）之间的空间中。 短路线（206）将上接地平面（200）与散热器（204）的左右上侧连接。 馈送线（203）将散热器（204）的左或右下侧与去除下接地平面（201）的部分连接。 匹配电路通过去除馈电线（203）的一部分来串联或并联定位片式电容器。 匹配电路通过将芯片电感器和芯片电容器并联在馈电线路（203）和下部接地平面（201）之间而形成。